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Catalog Datasheet	MFG & Type	Document Tags	PDF
heat sink to220 Abstract: TH17023 Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220	PDF
MO-048 Abstract: No abstract text available Text:  Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048	PDF
Untitled Abstract: No abstract text available Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	O-220, 063W/cm O-220 120x130 TH17023 175x195	PDF
MO-048 Abstract: MULTIWATT die TH17023 Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die	PDF
MO-048 Abstract: MULTIWATT die CMC 15 EPOXY RESIN Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach	Original	MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die CMC 15 EPOXY RESIN	PDF