heat sink to220
Abstract: TH17023
Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder
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Original
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PDF
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O-220,
063W/cm
O-220
120x130
TH17023
175x195
heat sink to220
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MO-048
Abstract: No abstract text available
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
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Original
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PDF
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MO-048
063W/cm
TH17023
175x195
MO-048
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Untitled
Abstract: No abstract text available
Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder
|
Original
|
PDF
|
O-220,
063W/cm
O-220
120x130
TH17023
175x195
|
MO-048
Abstract: MULTIWATT die TH17023
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
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Original
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PDF
|
MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
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MO-048
Abstract: MULTIWATT die CMC 15 EPOXY RESIN
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
|
Original
|
PDF
|
MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
CMC 15
EPOXY RESIN
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Untitled
Abstract: No abstract text available
Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin
|
Original
|
PDF
|
063W/cm
120x130
175x195
|
Untitled
Abstract: No abstract text available
Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin
|
Original
|
PDF
|
063W/cm
120x130
175x195
|