Untitled
Abstract: No abstract text available
Text: Package outline DIP16: plastic dual in-line package; 16 leads 300 mil ; long body SOT38-1 ME seating plane D A2 A A1 L e Z b1 c w M (e 1) b MH 9 16 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT
|
Original
|
PDF
|
DIP16:
OT38-1
050G09
MO-001
SC-503-16
|
SOT385-1 package outline
Abstract: pllmc
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline PLLMC: plastic leadless module carrier SOT385-1 A1 D A2 A E1 α E A D1 A3 A Cross section A-A not to scale 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 D (1) D1(1) E (1)
|
Original
|
PDF
|
OT385-1
SOT385-1 package outline
pllmc
|
SOT382-1
Abstract: MS-022 QFP100 jedec QFP100
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.6 mm ; body 14 x 20 x 2.8 mm SOT382-1 c y X A 80 51 50 81 ZE e E HE A A2 A1 (A 3) θ wM Lp bp pin 1 index 100 L 31 detail X 30 1 wM bp e v M A
|
Original
|
PDF
|
QFP100:
OT382-1
135E16
MS-022
SOT382-1
MS-022
QFP100
jedec QFP100
|
sot382
Abstract: No abstract text available
Text: PDF: 1999 Nov 16 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT382-2 c y X 80 A 51 50 81 ZE e A E HE A2 A1 (A3) θ wM Lp bp pin 1 index 100 1 L 31 detail X 30 ZD wM bp e
|
Original
|
PDF
|
QFP100:
OT382-2
OT382-2
MO-112CC1
MO-112CC1
sot382
|
MO-047-AA
Abstract: 047-AA plcc20 jedec A319 MO-047AA SOT380-1
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 A4 9 β A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
PLCC20:
OT380-1
OT380-1
MO-047AA
MO-047-AA
047-AA
plcc20 jedec
A319
SOT380-1
|
lqfp44 package outline
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X 33 23 A 34 22 ZE e E HE A A2 A 3 A1 wM θ pin 1 index bp 44 Lp L 12 detail X 11 1 ZD e v M A wM bp D B HD
|
Original
|
PDF
|
LQFP44:
OT389-1
OT389-1
lqfp44 package outline
|
sot388b
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388B U A y D U1 E 1 2 3 L1 4 L b Z e c w M e1 e 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D e e1
|
Original
|
PDF
|
OT388B
sot388b
|
Untitled
Abstract: No abstract text available
Text: HCS410/WM KEELOQ Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES SOT385 Security HCS410/WM • Two programmable 64-bit encryption keys • 16/32-bit bi-directional challenge and response using one of two keys • Programmable 32-bit serial number
|
Original
|
PDF
|
HCS410/WM
OT385
64-bit
16/32-bit
32-bit
HCS410
DS41116B-page
|
MO-001
Abstract: No abstract text available
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP16: plastic dual in-line package; 16 leads 300 mil ; long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
|
Original
|
PDF
|
DIP16:
OT38-1
050G09
MO-001
SC-503-16
MO-001
|
Transponder immobilizer
Abstract: immobilizer transponder Immobilizer Base station ZA93 Transponder PPM 125KHz sot385 Transponder immobiliser Immobilizer Control Unit home security burglar alarm system diagram definition of Immobilizer
Text: M HCS410/WM Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES Security SOT385 HCS410/WM • Two programmable 64-bit encryption keys • 16/32-bit bi-directional challenge and response using one of two keys • Programmable 32-bit serial number • Three IFF encryption algorithms
|
Original
|
PDF
|
HCS410/WM
OT385
64-bit
16/32-bit
32-bit
HCS410
125kHZ
Transponder immobilizer
immobilizer transponder
Immobilizer Base station
ZA93
Transponder PPM 125KHz
sot385
Transponder immobiliser
Immobilizer Control Unit
home security burglar alarm system diagram
definition of Immobilizer
|
Untitled
Abstract: No abstract text available
Text: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
|
Original
|
PDF
|
TQFP100:
OT386-1
137E20
MS-026
|
Untitled
Abstract: No abstract text available
Text: Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 β A4 9 A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
PLCC20:
OT380-1
01ximum
112E04
MS-018
EDR-7319
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
|
Original
|
PDF
|
TQFP100
OT386-1
OT386-1
|
Untitled
Abstract: No abstract text available
Text: Package outline SQFP128: plastic shrink quad flat package; 128 leads lead length 1.6 mm ; body 14 x 20 x 2.72 mm SOT387-3 c y X A 65 64 102 103 e E HE A A2 A1 (A 3) wM pin 1 index L 128 38 1 39 detail X wM bp e θ Lp bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
|
Original
|
PDF
|
SQFP128:
OT387-3
|
|
|
A319
Abstract: No abstract text available
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 A4 9 β A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
PLCC20:
OT380-1
OT380-1
112E04
MO-047
A319
|
sot386
Abstract: MA26
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
|
Original
|
PDF
|
TQFP100:
OT386-1
OT386-1
sot386
MA26
|
uhf amplifier design
Abstract: w-TMB uhf amplifier BGY206 MSA486 SC09 MGD353 47VC
Text: DISCRETE SEMICONDUCTORS DATA SHEET BGY206 UHF amplifier module Preliminary specification File under Discrete Semiconductors, SC09 1996 May 29 Philips Semiconductors Preliminary specification UHF amplifier module BGY206 FEATURES PINNING - SOT388A • 4.8 V nominal supply voltage
|
Original
|
PDF
|
BGY206
OT388A
BGY206
OT388A
uhf amplifier design
w-TMB
uhf amplifier
MSA486
SC09
MGD353
47VC
|
msa486
Abstract: MGD351 BGY122A BGY122B SC09 MGD350
Text: DISCRETE SEMICONDUCTORS DATA SHEET BGY122A; BGY122B UHF amplifier modules Preliminary specification File under Discrete Semiconductors, SC09 1996 Apr 26 Philips Semiconductors Preliminary specification UHF amplifier modules BGY122A; BGY122B FEATURES PINNING - SOT388A
|
Original
|
PDF
|
BGY122A;
BGY122B
OT388A
SCDS48
127081/1200/01/pp16
msa486
MGD351
BGY122A
BGY122B
SC09
MGD350
|
Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT383-1 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L detail X pin 1 index 120 31 30 1 v M A ZD wM
|
Original
|
PDF
|
QFP120:
OT383-1
OT383-1
MO-108-19
MO-108-1990
|
sot382
Abstract: No abstract text available
Text: PDF: 1999 Jun 15 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.6 mm ; body 14 x 20 x 2.8 mm SOT382-1 c y X A 80 51 50 81 ZE e E HE A A2 A1 (A 3) θ wM Lp bp pin 1 index 100 L 31 detail X 30 1 wM bp e v M A
|
Original
|
PDF
|
QFP100:
OT382-1
OT382-1
MO-108CC-
MO-108CC-1
sot382
|
SOT38
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline DIP16: plastic dual in-line package; 16 leads 300 mil SOT38-9 ME seating plane D A2 A A1 L b1 e Z c w M (e1) b 9 16 MH b2 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
DIP16:
OT38-9
SOT38
|
TQFP100
Abstract: tQFP100 package MS-026 MS-026 tqfp100
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
|
Original
|
PDF
|
TQFP100:
OT386-1
137E20
MS-026
TQFP100
tQFP100 package
MS-026
MS-026 tqfp100
|
BGY240S
Abstract: pn1999 snw-eq-608
Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D369 BGY240S UHF amplifier module Product specification Supersedes data of 1998 Nov 05 1999 Aug 23 Philips Semiconductors Product specification UHF amplifier module BGY240S FEATURES PINNING - SOT388C • 3.5 V nominal supply voltage
|
Original
|
PDF
|
M3D369
BGY240S
OT388C
BGY240S
OT388C
125002/07/pp12
pn1999
snw-eq-608
|
BGY122A
Abstract: BGY122B MG044
Text: Philips Semiconductors Preliminary specification UHF amplifier modules BGY122A; BGY122B FEATURES PINNING - SOT388A • Single 4.8 V nominal supply voltage PIN • 1.2 W output power DESCRIPTION 1 RF input • Easy control of output power by DC voltage 2 VC
|
OCR Scan
|
PDF
|
BGY122A;
BGY122B
BGY122A
BGY122B
OT388A
MLB740
7110flSb
01D54b2
MG044
|
