LQFP128
Abstract: LQFP128-P-1420-0
Text: 128P6D-D Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g MD e JEDEC Code – Lead Material Cu Alloy HD 128 102 b2 103 ME D 1 l2 Symbol HE E Recommended Mount Pad 38 65 64 39 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E
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128P6D-D
128pin
LQFP128-P-1420-0
LQFP128
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LQFP128
Abstract: LQFP128-P-1420-0 128P6D-A D1102
Text: 128P6D-A Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g 0.85 Lead Material Alloy 42 MD e JEDEC Code – HD 103 b2 128 ME D 1 102 I2 E HE Recommended Mount Pad Symbol 65 38 39 64 L1 A F A1 c A2 e b y L Detail F A A1 A2 b
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128P6D-A
128pin
LQFP128-P-1420-0
LQFP128
128P6D-A
D1102
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LQFP128
Abstract: LQFP128-P-1420-0
Text: 128P6D-C Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD b2 128 103 1 ME D 102 l2 HE D Recommended Mount Pad Symbol 65 38 39 64 A L1 F b A1 c A2 e y L Detail F A A1 A2 b c D E
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128P6D-C
128pin
LQFP128-P-1420-0
LQFP128
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240K6X-A
240P6Y-A
240P6Z-A
255F7F
256F7B
256F7X-A/B
256P6J-E
256P6K-E
272F7X-A/B
281S8-C
432W6
48P4B
hssop
44P3W-R
28P0
5P5T
tsop 2-54
42P9R
70P3S-M
479F7G
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100MHZ
Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,
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136P6S-C
100P6S-C
80P6N-C
208P6Y-A
64P6N-B
160P6E-A
44P6N-B
100MHZ
IC PACKAGE ELECTRICAL CHARACTERISTIC LCR
24p2n-a
136P6S-C
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TSOP 48 thermal resistance
Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.
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300mil
64P4B
16P2P
20P2N
375mil
28P2V
300mil
26P3D
400mil
TSOP 48 thermal resistance
TSOP 66 Package thermal resistance
QFP PACKAGE thermal resistance
TSOP 66 thermal resistance
thermal resistance standards
C8866
TSOP 54 thermal resistance
80p6n
TSOP 66 Package
28P2V
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12P9B
14P5A
16P5A
20P5A
24P5A
18P4G
20P4G
22P4H
24P4D
24P4Y
10C2
144PFB-A
48P4B
16P2S-A
240mil
hssop
Package tray dimension
12P9
16P2Z-A
18P4G
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240mil
SP050PC
340mil
SP070PC
440mil
12P9B
14P5A
16P5A
20P5A
24P5A
324pc
L198
L-088
930PC
12P9B
300mil trays
4028PC
L199
SP080
pt881
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M5M410092AFP-13
Abstract: M5M410092BRF-10 16SRAM 100P6S M5M4V4169CTP-15 m5m410092
Text: 3 »jam w jiiM ^Kiaaw iaw •CACHED DYNAMIC RAMs Classification Memory capacity 4M Memory Configuration 256KX 16DRAM IKX16SRAM Cached Dynamic RAM 16M 1MX16DRAM 1K X 16SRAM Min. Cycle time fisi ■ Typ. power dissipation (mW - Package Outline Type No. 10
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M5M4V4169CTP-10
M5M4V4169CTP-12
M5M4V4169CTP-15
M5M4V16169TP-10
70P3S-L
70P3S-L
M5M410092AFP-13
M5M410092BRF-10
16SRAM
100P6S
m5m410092
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M54630P
Abstract: M54630 n type laser diode APC RS 800 m5463 66515FP M54977 54975P M66515FP 16P2N
Text: lAPPLICATION SPECIFIC IC CONTINUED Function Tyjse No. Packase Outiire WttfKXM Features • U sag e /F ie ld • Includes self APC c irc u it N -type Laser diode d rive r with M 66515FP self APC function 20P 2N -A H igh speed Bip • H igh-speed sw itching 40M bps
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66515FP
M66rks
54972P
M54974P
54975P
M54977P
S4992P/FP
54992AP
54995P
M56620AP
M54630P
M54630
n type laser diode
APC RS 800
m5463
M54977
M66515FP
16P2N
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M65826
Abstract: cd-rom ic signal 128P6D-A M65826FP
Text: y MITSUBISHI SOUND PROCESSOR ICs M65826FP SINGLE CHIP CD-ROM DECODER DESCRIPTION The M65826FP is a single chip CD-ROM Decoder using CMOS technology. CD-DA Digital Signal Processor {DSP , CD-ROM Decoder and ATAPI. This IC can be used in CD-ROM, CD-I and Video CD.
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M65826FP
M65826FP
128P6D-A
M65826
cd-rom ic signal
128P6D-A
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78Lxx voltage regulator
Abstract: M5N317L 78xx voltage regulator M51204 regulator 78xx series m5n317 M64500AFP M5237ML M5233 M5237L
Text: •DISPLAY CONTROLLER - — i ? Type No. Circuit function ! Supply ! voltage : ! M3S000AFP CRT & Color/Monochrome Flat Panel Control M64513AFP Interface for AX System with M64500AFP M64542FP Navigation Graphic Controller * M64545FP EI Typical electrical characteristics
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M3S000AFP
M64513AFP
M64542FP
M64545FP
M64500AFP
160P6
160P6C
128P6D
5I203TL/FP
M51204TL/FP
78Lxx voltage regulator
M5N317L
78xx voltage regulator
M51204
regulator 78xx series
m5n317
M5237ML
M5233
M5237L
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8 BIT ALU IC
Abstract: No abstract text available
Text: MITSUBISHI LSIs M 5 M 4 1 0 0 9 2 A F P ,R F -1 0 ,-1 3 3D-RAM 10485760-BIT 327680-WQRD BY 32-BIT FRAME BUFFER MEMORY DESCRIPTION • Second-generation, 0.5 The M 5M 410092A FP.R F is a 10M-bit frame buffer memory which • 128-pin, plastic QFP integrates a 327680-word by 32-bit dynamic RAM array, 2048-bit
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10485760-BIT
327680-WQRD
32-BIT)
10092A
10M-bit
128-pin,
327680-word
32-bit
2048-bit
640-bit
8 BIT ALU IC
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