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    28P2V Price and Stock

    Hirose Electric Co Ltd KM32-8P-2V(BL)(800)

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    DigiKey KM32-8P-2V(BL)(800) Reel 500
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    Avnet Americas KM32-8P-2V(BL)(800) Reel 500
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    Mouser Electronics KM32-8P-2V(BL)(800)
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    28P2V Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    14AD

    Abstract: 28P2V SOP28 package SOP28-P-375-1 MS-013-AE
    Text: 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight g 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters


    Original     		PDF 28P2V-A 28pin 375mil OP28-P-375-1 MS-013AE 14AD 28P2V SOP28 package SOP28-P-375-1 MS-013-AE

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


    Original     		PDF 240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G

    sharp lsi pc 2002

    Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
    Text: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction


    Original     		PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.


    Original     		PDF 300mil 64P4B 16P2P 20P2N 375mil 28P2V 300mil 26P3D 400mil TSOP 48 thermal resistance TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


    Original     		PDF 240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A

    AXS628319

    Abstract: ATMEL soldering iron
    Text: AXS6.fm 169 ページ ２００３年１２月２２日 月曜日 午後１２時１１分 AXS6 SOP IC SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density


    Original     		PDF

    10C2

    Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension


    Original     		PDF 12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G

    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


    Original     		PDF 240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881

    tgn 600

    Abstract: No abstract text available
    Text: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact


    OCR Scan     		PDF 980m/S2 OP-40DXX-SMT-TT OP-44EXX-SMT-TT tgn 600

    Untitled

    Abstract: No abstract text available
    Text: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5


    OCR Scan     		PDF T00S371 1650-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2

    94v-0 m02

    Abstract: ATMEL 32P
    Text: SOCKETS SOP — 32 D XX — SMT — TT n Position:. 32 D = .525" Row Spacing Plating Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ^005371 00003bfl D HGb PC board pattern j j P S ' ± 0.3 General Tolerance ALL DIMENSIONS


    OCR Scan     		PDF 00003bfl OP-32DXX-SMT-XX Rati0GM-50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 94v-0 m02 ATMEL 32P

    Robinson Nugent IC SOCKET

    Abstract: No abstract text available
    Text: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5


    OCR Scan     		PDF Plat50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2 Robinson Nugent IC SOCKET

    M66503AFP

    Abstract: 6503A M66503ASP/FP
    Text: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION PIN CONFIGURATION (TOP VIEW) T h e M 6 6 5 0 3 A is a c o n s ta n t c u rre n t LED d riv e r IC, w h o se o u tp u t c u rre n t is v aria ble. T h e IC 's fu n c tio n s in clu d e 16-bit


    OCR Scan     		PDF M66503ASP/FP 16-BIT M66503AFP 6503A M66503ASP/FP

    M66503ASP/FP

    Abstract: No abstract text available
    Text: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION The M66503A is a constant current LED driver IC, whose output current is variable. The IC’s functions include 16-bit serial input/parallel output shift register with output latch.


    OCR Scan     		PDF M66503ASP/FP 16-BIT M66503A 16-bit M66503ASP/FP

    Robinson Nugent s2

    Abstract: No abstract text available
    Text: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact


    OCR Scan     		PDF 1000MQ 980m/S2 300mil) S13M30S OP-44EXX-SMT-TT Robinson Nugent s2

    ATMEL 32P

    Abstract: toshiba 94V-0
    Text: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d


    OCR Scan     		PDF OP-40DXX-SMT-TT Socke0GM-50-300B, FP-20DA, FP-20-D 375mll) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2 ATMEL 32P toshiba 94V-0

    M66805P

    Abstract: M66806FP
    Text: HIGH-SPEED LINE INTERFACE 1C SEM CONDUCTOR New s FUNCTION OF 2 CONVENTIONAL INTERFACE ICS HOUSED IN A SINGLE PACKAGE D E S C R I P T I function of 2 traditional line interfaces housed in a single package. The M66805P has 4 built-in circuits connecting RS-422A line drivers/re­


    OCR Scan     		PDF M66805P RS-422A M66806FP

    M66S

    Abstract: n type laser diode M66311P 16P2N-A 16P2N 32P2W n type laser diode driver
    Text: IA P P LIC A T IO N SPECIFIC IC Function Type No. Package M irai fiate ftamj M66235FP 16P2N-A M66236FP 16P2N-A Synchronous clock generator Includes PLL frequency synthesizer Features U sage/Field • Wide frequency range 25~52MHz • Efficient synchronous accurity ± 3ns


    OCR Scan     		PDF M66235FP 16P2N-A 52MHz 25MHz 50MHz 100kHz M66236FP M66238FP 32P2W-A M66S n type laser diode M66311P 16P2N-A 16P2N 32P2W n type laser diode driver

    P20GT-50-375B-2

    Abstract: No abstract text available
    Text: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC


    OCR Scan     		PDF 00S371 G0003fc S13M00S Pla50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 P20GT-50-375B-2