Untitled
Abstract: No abstract text available
Text: SiE822DF Vishay Siliconix N-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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SiE822DF
2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: SiE830DF Vishay Siliconix N-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • Extremely Low Qgd WFET Technology for Low Switching Losses • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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SiE830DF
2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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kvp 61
Abstract: kvp 03
Text: GFMQ, GFWQ Vishay Draloric Ceramic Capacitor Stacks Ceramic capacitor stacks with solder tags L RATED VOLTAGE UR: see table below 18 øD 1.5 0.059 3.2 (0.126) DESIGN: MODEL GFMQ DIELECTRIC STRENGTH: 0.3 (0.012) ~2 (0.079) see table below (Test voltage between solder tags)
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18-Jul-08
kvp 61
kvp 03
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l 0706
Abstract: gdmq0806
Text: GDMQ Vishay Draloric Ceramic Capacitor Stacks DESIGN: Ceramic capacitor stacks with leads L RATED VOLTAGE UR: see table below DIELECTRIC STRENGTH: Ø DISSIPATION FACTOR tan δ: D 66 2.6 see table below (Test voltage between leads) ≤ 25 • 10-3 0.6 6.9
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18-Jul-08
l 0706
gdmq0806
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Untitled
Abstract: No abstract text available
Text: SiE820DF Vishay Siliconix N-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • Extremely Low Qgd WFET Technology for Low Switching Losses • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for Double-Sided Cooling
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Original
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PDF
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SiE820DF
2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: SiE800DF Vishay Siliconix N-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • Extremely Low Qgd WFET Technology for Low Switching Losses • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for Double-Sided Cooling
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PDF
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SiE800DF
2002/95/EC
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: SiE800DF Vishay Siliconix N-Channel 30 V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • Extremely Low Qgd for Low Switching Losses • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for Double-Sided
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Original
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PDF
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SiE800DF
2002/95/EC
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: SiE832DF Vishay Siliconix N-Channel 40-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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Original
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PDF
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SiE832DF
2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: GDMQ Vishay Draloric Ceramic Capacitor Stacks DESIGN: Ceramic capacitor stacks with leads L RATED VOLTAGE UR: see table below DIELECTRIC STRENGTH: Ø DISSIPATION FACTOR tan δ: D 66 2.6 see table below (Test voltage between leads) ≤ 25 • 10-3 0.6 6.9
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PDF
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72/hay
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: GFMQ, GFWQ Vishay Draloric Ceramic Capacitor Stacks Ceramic capacitor stacks with solder tags L RATED VOLTAGE UR: see table below 18 øD 1.5 0.059 3.2 (0.126) DESIGN: MODEL GFMQ DIELECTRIC STRENGTH: 0.3 (0.012) ~2 (0.079) see table below (Test voltage between solder tags)
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11-Mar-11
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ok ps
Abstract: pq41 EN61000-3-3 EN61000-4-2 EN61000-4-3 EN61000-4-4 EN61000-4-5
Text: AC-DC 350 Watts xppower.com JPS350 Series • 300 W with Convection Cooling • High Efficiency - Up to 90% • Meets EN61000-3-2, -3 • Meets 1U, Low Profile Requirements • Zero Voltage Switching Technology • AC OK & DC OK Signals • Current Sharing
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JPS350
EN61000-3-2,
VAC/60Hz
10-Jun-05
JPS350
ok ps
pq41
EN61000-3-3
EN61000-4-2
EN61000-4-3
EN61000-4-4
EN61000-4-5
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Untitled
Abstract: No abstract text available
Text: SiE822DF Vishay Siliconix N-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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Original
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PDF
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SiE822DF
2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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7445-1
Abstract: No abstract text available
Text: SiE822DF Vishay Siliconix N-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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Original
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PDF
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SiE822DF
2002/95/EC
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
7445-1
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WX26 cable
Abstract: marking code H5C SMD Transistor xo-54be max 083 Crystal Oscillator, Leaded, Radial, 16.000 MHz smd transistor h5c XO-54B p l e sq3300 mto13fad XO-52BE
Text: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book FREQUENCY CONTROL PRODUCTS vishay DALE vsE-db0020-0507 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents
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vsE-db0020-0507
WX26 cable
marking code H5C SMD Transistor
xo-54be
max 083
Crystal Oscillator, Leaded, Radial, 16.000 MHz
smd transistor h5c
XO-54B
p l e sq3300
mto13fad
XO-52BE
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Untitled
Abstract: No abstract text available
Text: GFMQ, GFWQ Vishay Draloric Ceramic Capacitor Stacks Ceramic capacitor stacks with solder tags L RATED VOLTAGE UR: see table below 18 øD 1.5 0.059 3.2 (0.126) DESIGN: MODEL GFMQ DIELECTRIC STRENGTH: 0.3 (0.012) ~2 (0.079) see table below (Test voltage between solder tags)
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Original
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: SiE832DF Vishay Siliconix N-Channel 40-V D-S MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET • Ultra Low Thermal Resistance Using TopExposed PolarPAK® Package for DoubleSided Cooling
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Original
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PDF
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SiE832DF
2002/95/EC
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST CM 54 REVISIONS LTR T DESCRIPTION DATE EC 0G3B 1042 04 DWN APVD BSV DB 10JUN05 D 1.1 9 ±0.15 a A 9 5 .1 0 9 1 .1 4 8 7 .1 7
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10JUN05
1ZFEB91
19FEB91
MTA-156
31MAR2000
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION A LL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. LOC DIST CM 54 REVISIONS LTR T DESCRIPTION EC 0G3B DWN DATE 1042 04 APVD BSV DB 10JUN05 A D D V. S "N i S 95.10 91.14 87.17 83.21 79.25
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10JUN05
1ZFEB91
19FEB91
31MAR2000
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6406
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST CM 54 REVISIONS LTR DESCRIPTION DATE EC 0G3B 1042 04 DWN APVD BSV DB 10JUN05 D D 9 5 .10 [3.744] 24 5-640604-4 91 .14 [3.588]
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10JUN05
1ZFEB91
19FEB91
MTA-156
31MAR2000
6406
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F200
Abstract: No abstract text available
Text: 6 7 T H IS D R A W IN G IS U N P U B L IS H E D . R ELEASED A LL C O P Y R IG H T - B Y TYCO E LE C TR O N IC S FO R 5 4 2 3 P U B L IC A T IO N R IG H T S LOC C O R P O R A TIO N . 2.54 [. 1 O O ] R E V I S I ON S DI A 3 RELEASE PER EC 0 S 1 2 - 0 0 3 4 - 0 5
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0S12-0034-05
EC0-09-024606
10JUN05
02NOV09
31MAR2000
06JUL05
us049721
F200
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931AM
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 6 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC DIST AD 00 ALL RIGHTS RESERVED. REVISIONS LTR DESCRIPTION 0 RELEASE 01 REVISED HO U S IN G MATERIAL: T H E R M O P L A S T IC . DATE PE REC 0S12 - 0 0 3 4 - 0 5
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0S12-0034-05
EC0-09-024606
10JUN05
02NOV09
31MAR2000
31AUG05
us049721
931AM
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Untitled
Abstract: No abstract text available
Text: 7 T H IS D R A W IN G IS U N P U B L IS H E D . R ELEASED A LL C O P Y R IG H T - B Y TYCO E LE C TR O N IC S FO R 6 5 4 3 2 P U B L IC A T IO N R IG H T S LOC RESERVED. D IS T AD C O R P O R A TIO N . 2.54 [. 1 O O ] DI A 2 HOUSING MATERIAL: THERMOPLASTIC.
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0S12-0034-05
10JUN05
02NOV09
31MAR2000
31AUG05
us049721
\dm-tec-mod\5532903
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Untitled
Abstract: No abstract text available
Text: 6 7 T H IS D R A W IN G IS U N P U B L IS H E D . R ELEASED A LL C O P Y R IG H T - B Y TYCO E LE C TR O N IC S FO R 5 3 4 2 P U B L IC A T IO N R IG H T S LOC RESERVED. D IS T 25 AD C O R P O R A TIO N . R E V I S I ON S LTR 01 DI A 2 HOUSING MATERIAL: THERMOPLASTIC.
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0S12-0034-05
10JUN05
19JAN
31MAR2000
30AUG05
us049721
ALEX\5532431
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. F -F COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 4 2 3 - ALL RIGHTS RESERVED. LOC DIST AD 25 R E V IS IO N S P LTR RELEASE DI A 3 DESCRIPTION HOUSING MATERIAL: THERMOPLASTIC. CONTACT MATERIAL: COPPER
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10JUN05
31MAR2000
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