SI8407DB
Abstract: 8902E Si8902EDB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for MOSFETs Part Numbers: Si8407DB Si8902EDB MICRO FOOTr 2X3: 0.8-mm PITCH, 0.275-mm BUMP HEIGHT Part Number Method Si8407DB T2 Si8902EDB T2 Device on Tape Orientation 8902E
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Si8407DB
Si8902EDB
275-mm
8902E
8902E
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JESD097
Abstract: hpc capacitor hp*t03 HPC0402A160FXYT LTCC 0402J100FBWTR CROSS REFERENCE LTCC
Text: HPC0402A Vishay High Performance, High Precision Surface Mount 0402 Capacitor FEATURES ∑ New technology surface mount capacitor based on a special semiconductor process ∑ Construction reduces the parasitic inductance and brings the SRF values to ultra-high frequencies
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HPC0402A
032nH)
EIA-481-2-A
EIA-481-1-A)
12-Oct-04
JESD097
hpc capacitor
hp*t03
HPC0402A160FXYT
LTCC
0402J100FBWTR
CROSS REFERENCE LTCC
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ILSB-1206
Abstract: No abstract text available
Text: ILSB-1206 Vishay Dale Monolithic Chip Inductors FEATURES • • • • • MECHANICAL SPECIFICATIONS High reliability. Surface mountable. Magnetically self shielded. Nickel barrier plating virtually eliminates silver migration. 100% Lead Pb -free and RoHS compliant.
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ILSB-1206
160mm
390mm
05-Apr-05
ILSB-1206
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8900E
Abstract: Si8900EDB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for MOSFETs Part Numbers: Si8900EDB MICRO FOOTr 2X5: 0.8-mm PITCH, 0.275-mm BUMP HEIGHT Part Number Method Si8900EDB T2 Device on Tape Orientation 8900E xxx 8900E xxx 8900E
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Si8900EDB
275-mm
8900E
Specification--PACK-0023-2
S-50073,
8900E
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analog ics
Abstract: diode t5 DG3537DB DG3538DB DG3539DB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for Analog ICs Part Numbers: DG3537DB DG3538DB DG3539DB MICRO FOOTr 3X3: 0.5-mm PITCH, 0.238-mm BUMP HEIGHT Part Number Method DG3537DB T5 DG3538DB T5 DG3539DB T5 Device on Tape Orientation
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DG3537DB
DG3538DB
DG3539DB
238-mm
Specification--PACK-0023-7
S-50073,
31-Jan-05.
analog ics
diode t5
DG3537DB
DG3538DB
DG3539DB
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3001 transistor
Abstract: DG3000DB DG3001DB DG3002DB DG3003DB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for Analog ICs Part Numbers: DG3000DB DG3001DB DG3002DB DG3003DB MICRO FOOTr 3X2: 0.5-mm PITCH, 0.165-mm BUMP HEIGHT Part Number Method DG3000DB T1 DG3001DB T1 DG3002DB T1
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DG3000DB
DG3001DB
DG3002DB
DG3003DB
165-mm
Specification--PACK-0023-4
3001 transistor
DG3000DB
DG3001DB
DG3002DB
DG3003DB
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ILSB-0805
Abstract: No abstract text available
Text: ILSB-0805 Vishay Dale Monolithic Chip Inductors FEATURES • • • • • High reliability. Surface mountable. Magnetically self shielded. Nickel barrier plating virtually eliminates silver migration. 100 % Lead Pb -free and RoHS compliant. ENVIRONMENTAL SPECIFICATIONS
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ILSB-0805
160mm
390mm
05-Apr-05
ILSB-0805
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sec 545 a614 y
Abstract: CPU12X HCS12 MC9S12KT256 S12EETS4KV2 S12FTS256K2ECCV1 TBC 547 B* TRANSISTOR bf416 TRANSISTOR HANDLING 2A 2L33V
Text: MC9S12KT256 Data Sheet HCS12 Microcontrollers MC9S12KT256 Rev. 1.16 06/2010 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
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MC9S12KT256
HCS12
CPU12-1
CPU12
CPU12X
MC9S12KT256V1
sec 545 a614 y
HCS12
MC9S12KT256
S12EETS4KV2
S12FTS256K2ECCV1
TBC 547 B* TRANSISTOR
bf416
TRANSISTOR HANDLING 2A
2L33V
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Si8413DB
Abstract: si8409db Si8401DB Si8402DB Si8405DB Si8411DB Si8415DB Si8419DB t1/Si8413DB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for MOSFETs Part Numbers: Si8401DB Si8402DB Si8405DB Si8409DB Si8411DB Si8413DB Si8415DB Si8419DB MICRO FOOTr 2X2: 0.8-mm PITCH, 0.275-mm BUMP HEIGHT Part Number Method Si8401DB
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Si8401DB
Si8402DB
Si8405DB
Si8409DB
Si8411DB
Si8413DB
Si8415DB
Si8419DB
275-mm
t1/Si8413DB
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3408 diode
Abstract: S5007 DG3015DB DG3408DB DG3409DB 72733
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for Analog ICs Part Numbers: DG3015DB DG3408DB DG3409DB MICRO FOOTr 4X4: 0.5-mm PITCH, 0.238-mm BUMP HEIGHT Part Number Method DG3015DB T2 DG3408DB T2 DG3409DB T2 Device on Tape Orientation
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DG3015DB
DG3408DB
DG3409DB
238-mm
Specification--PACK-0023-5
S-50073,
31-Jan-05.
3408 diode
S5007
DG3015DB
DG3408DB
DG3409DB
72733
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Untitled
Abstract: No abstract text available
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for Analog ICs Part Number: DG3540DB MICRO FOOTr 3X3: 0.5-mm PITCH, 0.238-mm BUMP HEIGHT Part Number Method DG3540DB T1 xxx 3540 xxx 3540 xxx 3540 xxx 3540 xxx 3540 Device on Tape Orientation
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DG3540DB
238-mm
Specification--PACK-0023-9
S-50073,
31-Jan-05.
05-Apr-05
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atmel 424
Abstract: AT90SC AT90SC12872RCFT ISO14443 ISO7816-3
Text: Features General • High-performance, Low-power secureAVR Core Enhanced RISC Architecture • • • • • • • – 137 Powerful Instructions Most Executed in a Single Clock Cycle Bond Pad Locations Conforming to ISO 7816-2 ESD Protection to ± 6000V
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6502AS
05Apr05
atmel 424
AT90SC
AT90SC12872RCFT
ISO14443
ISO7816-3
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Untitled
Abstract: No abstract text available
Text: 293D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Commercial, Surface Mount FEATURES • Terminations: 100 % Tin, standard. SnPb available. Molded case available in six case codes. Compatible with "High Volume" automatic pick and place equipment.
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QC300801/US0001
535BAAC.
EIA-481-1.
05-Apr-05
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Digital Weighing Scale
Abstract: by 228 PH vfd display 2x40 centronics to serial converter 7 segment display duplex led type IP54
Text: VT 500 Vishay Transducers Weighing Controller FEATURES • Process weighing control terminal • Special control software available for hopper scales and bagging scales • High sample rate, up to 228 conversions per second • Four serial interface ports for printing and networking
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RS-232/
RS-485)
05-Apr-05
Digital Weighing Scale
by 228 PH
vfd display 2x40
centronics to serial converter
7 segment display duplex led type
IP54
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DG3514DB
Abstract: DG3515DB DG3516DB DG3517DB
Text: Device Orientation—MICRO FOOTr Packages Vishay Siliconix Device Orientation Options for Analog ICs Part Numbers: DG3514DB DG3515DB DG3516DB DG3517DB DG3535DB DG3536DB MICRO FOOTr 4X3: 0.5-mm PITCH, 0.238-mm BUMP HEIGHT Part Number Method DG3514DB T5 DG3515DB
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DG3514DB
DG3515DB
DG3516DB
DG3517DB
DG3535DB
DG3536DB
238-mm
DG3514DB
DG3515DB
DG3516DB
DG3517DB
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AMP MODU 2
Abstract: AMPMODU II AMP MODU II modu amp J826 63- 477-1 AMP-EN-555
Text: ï 4 MODO I I SHROUDED P 0 5 T 5 MODO I I S I N G L E ROW 3 TO 5 0 P O S . E i n r e i h i g 3 b i s 50 p o i N CD x 10 r\ CD 3 ï 2 ZEICHNUNG NICHT VERHASSTE KANTEN ÄNDERUNGEN N ISC H EN S IN D NICHT M A ßS TÄ B LIC H S tiftle is te DOUBLE ROW 2 x 3 TO 2 x 5 0 P 0 5
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P05T5
C78mm
5-APR-05
AMP-EN-554
eq005694
AMP MODU 2
AMPMODU II
AMP MODU II
modu amp
J826
63- 477-1
AMP-EN-555
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Untitled
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - By - 6 5 4 2 3 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. REVISIONS DIST AD 00 LTR DESCRIPTION REVISED PER ÌA MATERIAL: 2A SURFACE DATE DWN RK HMR 11 MAR 11 ECO-11-004835 APVD ZINC ALLOY DIE CASTING. FINISH:
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05APR05
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Untitled
Abstract: No abstract text available
Text: Z EI CHNUNG GESCHÜTZT c c O P Y R I GHT en LO ANP ALLE DEUTSCHLAND RECHTE DURCH Ä N D E R U N G E N , 1989 T E C H N IS C H E N GMBH VORBEHALTEN S C H R IT T HALTEN D IE DATUN ÄNDERUNG NANE FORT D IE N E N , W IR REV DEN UNS BE VOR m r\j co Z) cn
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AMP-EN-554
05-APR-05
eq005694
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104439-2
Abstract: No abstract text available
Text: 4 T H IS D R AW IN G IS U N P U B L IS H E D . CO PYRIG H T 3 R E L E A S E D FO R P U B LIC A T IO N BY TYCO ELEC TR O N IC S CO RPO RATIO N. A L L R IG H T S R E S E R V E D . FLTÏÏ- J -{I D ¿A -52 .08 HOUSING SEE TABLE FOR PERT NO C POSITION #1 INDICATOR
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31MAR2000
\dmtmod\ECs\e076004clndia\1
04439-c
ECO-09-021826
05APR05
28AUG09
104439-2
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Untitled
Abstract: No abstract text available
Text: 8 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 7 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. DIST AD BY TYCO ELECTRONIC5 CORPORATION. REVISIONS 00 LTR l\ DESCRIPTION OWN DATE RELEASED PER EC 0 5 1 2 - 0 1 0 1 - 0 5 APVD JDP RAP 05A P R 05 MATERIAL: ZINC ALLOY DIE CASTING.
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05APR05
05APR05
31MAR2000
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Untitled
Abstract: No abstract text available
Text: ZEICHNUNG GESCHÜTZT c c O P Y R I GHT (X) r- ANP ALLE DURCH 1989 DEUTSCHLAND RECHTE GMBH VORBEHALTEN Ä N D E RU N G EN , D I E DEN T E C H N IS C H E N F O R T S C H R IT T D IE N E N , B E H A L T E N W IR UNS VOR R EV . DATUN ÄNDERUNG NANE m
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AMP-EN-554
05-APR-05
eq005694
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Untitled
Abstract: No abstract text available
Text: 4 T H IS D R A W IN G IS 3 U N P U B L IS H E D . R ELEASED FO R 2 P U B L IC A T IO N ALL R IG H TS LOC D IS T R E V IS IO N S RESERVED. C O P Y R IG H T LTR MODU SHROUDED MODU S IN G L E ROW Einreihig D 3 3 TO bis 50 50 RETENTION S t i f 11 e i s t e POS.
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05APR05
19FEB10
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5223957-1
Abstract: No abstract text available
Text: 4 T H IS D R A W IN G IS 3 U N P U B L IS H E D . RELEASED FO R ALL C O P Y R IG H T By 2 P U B L IC A T IO N R IG H TS A RESERVED. - R E V IS IO N S 00 LTR D E S C R IP T IO N A1 D !A RE VISED PER DATE ECO-11-004835 DWN A PVD RK HMR MAR1 MATERIAL: ZINC ALLOY DIE CASTING, ZAMAK 3.
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MAR11
05APR05
5223957-1
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6-32-UNC-2B
Abstract: 6-32UNC-2B A 2039 I A 2039
Text: 4 T H IS D R A W IN G IS 3 U N P U B L IS H E D . R ELEASED FO R ALL C O P Y R IG H T B Y TYCO E L E C T R O N IC S P U B L IC A T IO N R IG H T S - 2 , - RESERVED. C O R P O R A T IO N . R E V IS IO N S LOC D IS T AD 00 D E S C R IP T IO N G REVISED PER
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ECO-09-008995
09APR09
6-32-UNC-2B
6-32UNC-2B
A 2039 I
A 2039
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