DSA00219178.pdf by Xilinx

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1466 ball FCBGA 17S00A 3s250e 896-Ball amkor flip aos bar code AOS single digit year BFG95 BGA 31 x 31 mm BGA 6x6 tray bga rework BGG432 BGG560 CP132 FF676 FFG-1136 FFG1152 FFG1704 FFG1760 FFG668 FFG676 FFG676C FFG896 FG484 FGG484 footprint cqfp 240 FTG256C ipc 9850 jedec so8 Wire bond gap JESD22a121 land pattern for TSOP 2 86 parameters of FR4 substrate with dielectric parameters of FR4 substrate with dielectric const pcb footprint FS48, and FSG48 PCG84 PCN95013 PQG100 pqg208 qfg48 qfn 3x3 tray dimension reballing SF363 SFG363 SMD BGA 672 DRAWING SMD MARKING CODE C1G tda 3640 TQ144 TsoP 20 Package XILINX TSOP 54 land pattern TT 2076 UG112 Virtex-4 SF363 VOG48 VQ44I warpage qfn 7x7 WS609 XC2S50 PQG208 XC2V6000-ff1152 XC3S400AN-4FG400I XC3SD1800A-4CS484LI XC4013XL PIN BG256 XC4VLX25 cmos 668 fcbga XC4VLX60-10FFG668CS2 XC5VLX XC5VLX330T-1FF1738I xc9572xl vqg XCDAISY XCDAISY-FG676 XCMECH-FG676 XCS20 TQ144 country of origin XCS20XL pqg208 xilinx part marking xilinx topside marking xilinx XC2V6000-FF1152 xq2v6000