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    SFG363 Price and Stock

    AMD XC4VLX25-10SFG363I

    IC FPGA 240 I/O 363FCBGA
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    DigiKey XC4VLX25-10SFG363I Tray 1
    • 1 $479.7
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    Avnet Americas XC4VLX25-10SFG363I Tray 12 Weeks 1
    • 1 $466.785
    • 10 $459.405
    • 100 $437.265
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    Mouser Electronics XC4VLX25-10SFG363I 1
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    Avnet Asia XC4VLX25-10SFG363I 12 Weeks 1
    • 1 $485.5263
    • 10 $455.55557
    • 100 $434.11765
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    AMD XC4VLX15-10SFG363I

    IC FPGA 240 I/O 363FCBGA
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    DigiKey XC4VLX15-10SFG363I Tray 90
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    Avnet Americas XC4VLX15-10SFG363I Tray 12 Weeks 1
    • 1 $241.615
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    • 100 $226.335
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    XC4VLX15-10SFG363I Tray 12 Weeks 1
    • 1 $241.615
    • 10 $237.795
    • 100 $226.335
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    Mouser Electronics XC4VLX15-10SFG363I
    • 1 $264
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    AMD XC4VLX25-11SFG363C

    IC FPGA 240 I/O 363FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC4VLX25-11SFG363C Tray 1
    • 1 $479.7
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    Avnet Americas XC4VLX25-11SFG363C Tray 12 Weeks 1
    • 1 $466.785
    • 10 $459.405
    • 100 $437.265
    • 1000 $437.265
    • 10000 $437.265
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    Mouser Electronics XC4VLX25-11SFG363C
    • 1 $479.65
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    AMD XC4VFX12-11SFG363C

    IC FPGA 240 I/O 363FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC4VFX12-11SFG363C Tray 90
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    • 100 $280.8
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    Avnet Americas XC4VFX12-11SFG363C Tray 25 Weeks 1
    • 1 $273.24
    • 10 $268.92
    • 100 $255.96
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    Mouser Electronics XC4VFX12-11SFG363C
    • 1 $300
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    AMD XC4VLX15-10SFG363C

    IC FPGA 240 I/O 363FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC4VLX15-10SFG363C Tray 90
    • 1 -
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    • 100 $198.9
    • 1000 $198.9
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    Avnet Americas XC4VLX15-10SFG363C Tray 12 Weeks 1
    • 1 $193.545
    • 10 $190.485
    • 100 $181.305
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    Mouser Electronics XC4VLX15-10SFG363C 18
    • 1 $211
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    SFG363 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sf363

    Abstract: MO-216-BAM-1 SFG363 MO-216
    Text: R Flip-Chip BGA SF363/SFG363 Package PK080 (v1.2) June 10, 2008 363-BALL FLIP-CHIP BGA (SF363/SFG363) 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF SF363/SFG363) PK080 363-BALL MO-216-BAM-1. sf363 MO-216-BAM-1 SFG363 MO-216

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    VIRTEX-4

    Abstract: Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15
    Text: ` R Virtex-4 Family Overview DS112 v3.0 September 28, 2007 Product Specification General Description Combining Advanced Silicon Modular Block (ASMBL ) architecture with a wide variety of flexible features, the Virtex™-4 Family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC


    Original     		PDF DS112 DS302) XC4VFX40 FF676 XC4VLX40, XC4VLX60, XC4VSX25, XC4VSX35, VIRTEX-4 Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15

    Untitled

    Abstract: No abstract text available
    Text: R Virtex-4 Family Overview DS112 v1.4 June 17, 2005 Preliminary Product Specification General Description The Virtex-4 Family is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL™ column-based architecture is unique in the programmable logic industry. Virtex-4 FPGAs contain three families


    Original     		PDF DS112 DSP48

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    XC4vfx12 ff668

    Abstract: DS-112 XC4VLX25-10FFG668CS2 Virtex-4 User Guide
    Text: ` R Virtex-4 Family Overview DS112 v1.6 October 10, 2006 Preliminary Product Specification General Description The Virtex -4 Family is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL™ column-based architecture is unique in the programmable logic industry. Virtex-4 FPGAs contain three families


    Original     		PDF DS112 DSP48 XC4vfx12 ff668 DS-112 XC4VLX25-10FFG668CS2 Virtex-4 User Guide

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    DS112

    Abstract: FFG676 Virtex-4 SF363 IBM powerpc 405 virtex 2 Virtex-4 OPTIMIZED FPGA IMPLEMENTATION OF MULTI-RATE FIR F SFG363 virtex 4 Virtex-4 datasheet PPC405
    Text: ` R Virtex-4 Family Overview DS112 v3.1 August 30, 2010 Product Specification General Description Combining Advanced Silicon Modular Block (ASMBL ) architecture with a wide variety of flexible features, the Virtex -4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC


    Original     		PDF DS112 FF676 XC4VLX40, XC4VLX60, XC4VSX25, XC4VSX35, XC4VFX12 DS302, XCN09028, XC4VLX25 DS112 FFG676 Virtex-4 SF363 IBM powerpc 405 virtex 2 Virtex-4 OPTIMIZED FPGA IMPLEMENTATION OF MULTI-RATE FIR F SFG363 virtex 4 Virtex-4 datasheet PPC405

    FF1148 raw material properties

    Abstract: BIM G18 Y1 XQ4VSX55 xc4vlx25-10ffg668 XC4VFX60 ROCKETIO H8 hitachi programming manual Hearing Aid Circuit Diagram spartan ucf file 6 Virtex4 XC4VFX60 UG072 xi
    Text: QPro Virtex-4 Extended Temperature FPGAs DC and Switching Characteristics R DS595 v1.2 December 20, 2007 Preliminary Product Specification QPro Virtex-4 Electrical Characteristics QPro Virtex™-4 FPGAs are available in -10 speed grade and qualified for industrial (TJ = –40°C to +100°C), and for


    Original     		PDF DS595 10CESnL 10CESnR 10CES 10CESn UG075 FF1148 raw material properties BIM G18 Y1 XQ4VSX55 xc4vlx25-10ffg668 XC4VFX60 ROCKETIO H8 hitachi programming manual Hearing Aid Circuit Diagram spartan ucf file 6 Virtex4 XC4VFX60 UG072 xi

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    Untitled

    Abstract: No abstract text available
    Text: R Virtex-4 Family Overview DS112 v1.3 March 26, 2005 Preliminary Product Specification General Description The Virtex-4 Family is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL™ column-based architecture is unique in the programmable logic industry. Virtex-4 FPGAs contain three families


    Original     		PDF DS112 DSP48

    FFG668

    Abstract: Virtex4 XC4VFX60 XC4VLX25-10FFG668CS2 Virtex 4 XC4VFX60 FFG676 FFG1517 PPC405 risc processor PCB layout guidelines tri mode ethernet TRANSMITTER DS112 XC4VLX100
    Text: ` R Virtex-4 Family Overview DS112 v2.0 January 23, 2007 Preliminary Product Specification General Description Combining Advanced Silicon Modular Block (ASMBL ) architecture with a wide variety of flexible features, the Virtex™-4 Family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC


    Original     		PDF DS112 DSP48 FFG668 Virtex4 XC4VFX60 XC4VLX25-10FFG668CS2 Virtex 4 XC4VFX60 FFG676 FFG1517 PPC405 risc processor PCB layout guidelines tri mode ethernet TRANSMITTER DS112 XC4VLX100

    XAPP427

    Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING
    Text: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 XAPP427 BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow

    XQ4VSX55

    Abstract: FFG668 XC4VLX25-10FFG668CS2 UG071
    Text: QPro Virtex-4 Extended Temperature FPGAs DC and Switching Characteristics R DS595 v1.4 May 5, 2008 Preliminary Product Specification QPro Virtex-4 Electrical Characteristics QPro Virtex -4 FPGAs are available in -10 speed grade and qualified for industrial (TJ = –40°C to +100°C), and for


    Original     		PDF DS595 DS302) XC4VFX40 FF676 DS112 XC4VLX40, XC4VLX60, XC4VSX25, XC4VSX35, XQ4VSX55 FFG668 XC4VLX25-10FFG668CS2 UG071