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AMD XC2VP7-6FFG896C IC FPGA 396 I/O 896FCBGA
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DigiKey	XC2VP7-6FFG896C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP7-5FFG896C IC FPGA 396 I/O 896FCBGA
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DigiKey	XC2VP7-5FFG896C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP30-6FFG896I IC FPGA 556 I/O 896FCBGA
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DigiKey	XC2VP30-6FFG896I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP20-6FFG896C IC FPGA 556 I/O 896FCBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	XC2VP20-6FFG896C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP20-5FFG896I IC FPGA 556 I/O 896FCBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	XC2VP20-5FFG896I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now

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FFG896 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
CSG484 Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D	PDF
apple ipad schematic drawing Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller Text: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG012 apple ipad schematic drawing xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller	PDF
Lead Free reflow soldering profile BGA Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160 Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160	PDF
RSN 310 R37 Abstract: Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T Text: Virtex-5 FPGA Packaging and Pinout Specification UG195 v4.6 May 5, 2009 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG195 RSN 310 R37 Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T	PDF
ff1136 Abstract: w32 smd transistor K924 MS-034-AAR-1 transistor SMD MARKING CODE L33 TRANSISTOR SMD MARKING CODE W25 VIRTEX-5 LX110T AH42 FF665 SMD transistor n36 Text: Virtex-5 FPGA Packaging and Pinout Specification UG195 v4.8 December 9, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG195 ff1136 w32 smd transistor K924 MS-034-AAR-1 transistor SMD MARKING CODE L33 TRANSISTOR SMD MARKING CODE W25 VIRTEX-5 LX110T AH42 FF665 SMD transistor n36	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
UG195 Abstract: FX130T SX95T RSN 310 R37 VIRTEX-5 LX110T LX330T LX155T TRANSISTOR SMD K27 LX110T transistor SMD MARKING CODE L33 Text: Virtex-5 FPGA Packaging and Pinout Specification UG195 v4.7 December 11, 2009 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG195 UG195 FX130T SX95T RSN 310 R37 VIRTEX-5 LX110T LX330T LX155T TRANSISTOR SMD K27 LX110T transistor SMD MARKING CODE L33	PDF
XAPP427 Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING Text: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 XAPP427 BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF