Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PCG84 Search Results

    SF Impression Pixel

    PCG84 Price and Stock

    AMD XC9572-10PCG84C

    IC CPLD 72MC 10NS 84PLCC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC9572-10PCG84C Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Buy Now

    AMD XC9572-15PCG84C

    IC CPLD 72MC 15NS 84PLCC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC9572-15PCG84C Tray
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Buy Now

    AMD XC95108-15PCG84C

    IC CPLD 108MC 15NS 84PLCC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95108-15PCG84C Tube
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Buy Now

    AMD Xilinx XC9572-7PCG84C

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics XC9572-7PCG84C 60
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Get Quote

    PCG84 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PC84/PCG84

    Abstract: PCG84 pc84
    Text: R PLCC PC84/PCG84 Package PK006 (v1.2) June 18, 2004 2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original
    PDF PC84/PCG84) PK006 PC84/PCG84 PCG84 pc84

    XC95108

    Abstract: XC95108-10PQ160C xc95108-10pqg100i XC95108-20PQG160I TQG100 XC95108-15PC84C PGC84 XC95108-20PQ100I
    Text: – PRODUCT OBSOLETE / UNDER OBSOLESCENCE – XC95108 In-System Programmable CPLD R DS066 v5.0 May 17, 2013 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 108 macrocells with 2,400 usable gates


    Original
    PDF XC95108 DS066 36V18 PQ160 XCN11010 XC95108-10PQ160C xc95108-10pqg100i XC95108-20PQG160I TQG100 XC95108-15PC84C PGC84 XC95108-20PQ100I

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XC9572

    Abstract: xc9572 data sheet XC9572-15PC84C XC9572-7PCG84C XC9572-15PQG100I XC9572-10PQ100C XC9572-7TQG100C XC9572-15PCG44C XC9572-10PQ100I XC9572-10PC44I
    Text: XC9572 In-System Programmable CPLD R DS065 v4.3 April 3, 2006 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 72 macrocells with 1,600 usable gates Up to 72 user I/O pins 5V in-system programmable


    Original
    PDF XC9572 DS065 36V18 xc9572 data sheet XC9572-15PC84C XC9572-7PCG84C XC9572-15PQG100I XC9572-10PQ100C XC9572-7TQG100C XC9572-15PCG44C XC9572-10PQ100I XC9572-10PC44I

    XC9572

    Abstract: XC9572-15PQG100C XC9572-10TQG100I XC9572-15TQG100C XC9572-10PQ100I XC9572 pcg84 XC9572-15PCG84C XC9572-10PQG100C XC9572-15PCG44C XC9572 PC84
    Text: XC9572 In-System Programmable CPLD R DS065 v4.3 April 3, 2006 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 72 macrocells with 1,600 usable gates Up to 72 user I/O pins 5V in-system programmable


    Original
    PDF XC9572 DS065 36V18 XC9572-15PQG100C XC9572-10TQG100I XC9572-15TQG100C XC9572-10PQ100I XC9572 pcg84 XC9572-15PCG84C XC9572-10PQG100C XC9572-15PCG44C XC9572 PC84

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original
    PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original
    PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original
    PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    xc9572

    Abstract: XILINX XC9572 xc9572-15PQ100 XC9572-10PC44C XC95727PC84C XC9572-10PC84C xc9572-10pq100c XC9572-15PCG84i
    Text: – PRODUCT OBSOLETE / UNDER OBSOLESCENCE – XC9572 In-System Programmable CPLD R DS065 v5.0 May 17, 2013 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 72 macrocells with 1,600 usable gates


    Original
    PDF XC9572 DS065 36V18 XCN11010 XILINX XC9572 xc9572-15PQ100 XC9572-10PC44C XC95727PC84C XC9572-10PC84C xc9572-10pq100c XC9572-15PCG84i

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    XC95108-15TQ100C

    Abstract: XC95108-15PCG84C XC95108 XC95108-20TQ100I XC95108-15TQG100C XC95108-10PQG160I PQ100 PQG160 xc95108 tq100 XC95108-15TQ100I
    Text: XC95108 In-System Programmable CPLD R DS066 v4.4 April 3, 2006 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 108 macrocells with 2,400 usable gates Up to 108 user I/O pins 5V in-system programmable


    Original
    PDF XC95108 DS066 36V18 XC9500 PQ160 XC95108-15TQ100C XC95108-15PCG84C XC95108-20TQ100I XC95108-15TQG100C XC95108-10PQG160I PQ100 PQG160 xc95108 tq100 XC95108-15TQ100I

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original
    PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow