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AMD XCF04SVOG20C IC PROM SRL FOR 4M GATE 20-TSSOP
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DigiKey	XCF04SVOG20C	Tube				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XCF01SVOG20C IC PROM SRL FOR 1M GATE 20-TSSOP
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DigiKey	XCF01SVOG20C	Tube			222	1 - 10 - 100 - 1000 $12.995 10000 $12.995	Buy Now
AMD XCF02SVOG20C IC PROM SRL FOR 2M GATE 20-TSSOP
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AMD Xilinx XCF02SVOG20C
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Bristol Electronics	XCF02SVOG20C		1,268			1 - 10 - 100 - 1000 - 10000 -	Get Quote
ComSIT USA	XCF02SVOG20C		70			1 - 10 - 100 - 1000 - 10000 -	Get Quote
NexGen Digital	XCF02SVOG20C		3			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Velocity Electronics	XCF02SVOG20C		850			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Chip 1 Exchange	XCF02SVOG20C		296			1 - 10 - 100 - 1000 - 10000 -	Get Quote

Win Source Electronics	XCF02SVOG20C		9,760			1 - 10 $13.2747 100 $10.9859 1000 $10.9859 10000 $10.9859	Buy Now
AMD Xilinx XCF04SVOG20C
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Bristol Electronics	XCF04SVOG20C		12			1 - 10 - 100 - 1000 - 10000 -	Get Quote
NexGen Digital	XCF04SVOG20C		9			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Win Source Electronics	XCF04SVOG20C		2,200			1 $88.7324 10 $76.0564 100 $76.0564 1000 $76.0564 10000 $76.0564	Buy Now

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VOG20 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
VOG20 Abstract: VO20 VOG-20 PK068 Text: R TSSOP VO20/VOG20 Package PK068 (v1.3) December 12, 2008 X-Ref Target - Figure 1 2006–2008 Xilinx, Inc. All Rights Reserved. XILINX, the Xilinx logo, the Brand Window and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.	Original	VO20/VOG20) PK068 VOG20 VO20 VOG-20 PK068	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
XCF04S Abstract: xcf16pfs XCF32P-VOG48 XCF02S RELIABILITY REPORT 48-pin TSOP Package VO48 Xilinx Spartan-II 2.5V FPGA Family FSG48 XCF02S pcb Text: 47 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.13.1 April 3, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process	Original	DS123 XCF04S xcf16pfs XCF32P-VOG48 XCF02S RELIABILITY REPORT 48-pin TSOP Package VO48 Xilinx Spartan-II 2.5V FPGA Family FSG48 XCF02S pcb	PDF
XC3S250E design guide Abstract: csb 485 E2 Text: <BL Blue> R DS123 v2.11 February 1, 2007 Platform Flash In-System Programmable Configuration PROMs Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs ♦ • 3.3V supply voltage Low-Power Advanced CMOS NOR FLASH Process	Original	DS123 LVCMOS25 XC3S250E design guide csb 485 E2	PDF
XCF32PVO48 Abstract: 48-pin TSOP Package VO48 XCF08PVO48C XCF32PVOG48C XCF32PVO48C ieee 1532 XCF04SVO20C pcb footprint for XCF08PFSG48C Platform XCF01SVOG20C XCF08PFS48C Text: 35 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.17 October 26, 2009 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process	Original	DS123 VOG20 XCF32PVO48 48-pin TSOP Package VO48 XCF08PVO48C XCF32PVOG48C XCF32PVO48C ieee 1532 XCF04SVO20C pcb footprint for XCF08PFSG48C Platform XCF01SVOG20C XCF08PFS48C	PDF
48-pin TSOP Package VO48 Abstract: XCF16PFSG48C XCF08PFS48C XCF02SVO20C XCF16PFS48C XCF32PFSG48C XCF02SVOG20C pcb footprint FS48, and FSG48 XCF16PVOG48C XCF02SVO20C RELIABILITY REPORT Text: 35 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.18 May 19, 2010 Product Specification Features • XCF01S/XCF02S/XCF04S • In-System Programmable PROMs for Configuration of Xilinx FPGAs • 3.3V Supply Voltage • Low-Power Advanced CMOS NOR Flash Process	Original	DS123 XCF01S/XCF02S/XCF04S VOG20 48-pin TSOP Package VO48 XCF16PFSG48C XCF08PFS48C XCF02SVO20C XCF16PFS48C XCF32PFSG48C XCF02SVOG20C pcb footprint FS48, and FSG48 XCF16PVOG48C XCF02SVO20C RELIABILITY REPORT	PDF
Virtex-6 reflow Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320 Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the	Original	UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320	PDF
XCF02S Abstract: pcb footprint FS48, and FSG48 XCF32P DS123 FS48 VO20 VO48 XCF01S XCF32PVO48C XCF08PFS48C Text: R DS123 v2.6 March 14, 2005 4 2 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS NOR FLASH Process • Endurance of 20,000 Program/Erase Cycles	Original	DS123 XCF08P/XCF16P/XCF32P VOG48, FSG48 XCF01S/XCF02S/XCF04S XCF02S pcb footprint FS48, and FSG48 XCF32P DS123 FS48 VO20 VO48 XCF01S XCF32PVO48C XCF08PFS48C	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
CSG484 Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D	PDF
XCF08PFSG48C Abstract: XCF01S Xilinx XCF04S pcb footprint FS48, and FSG48 XC3S500E XCF01SVO20 XCF32P DS123 FS48 VO20 Text: 47 Platform Flash In-System Programmable Configuration PROMS R DS123 v2.8 December 29, 2005 Product Specification Features • • • • • • • • • • In-System Programmable PROMs for Configuration of Xilinx FPGAs Low-Power Advanced CMOS NOR FLASH Process	Original	DS123 XCF08PFSG48C XCF01S Xilinx XCF04S pcb footprint FS48, and FSG48 XC3S500E XCF01SVO20 XCF32P DS123 FS48 VO20	PDF
csb 485 E2 Abstract: Xilinx XCF08P XCF01SVO20 XCF32P XCF128X fs48 xc3s400 pinout XCF32PVO48 DS123 VO48 Text: 48 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.16 November 14, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process	Original	DS123 VOG20 csb 485 E2 Xilinx XCF08P XCF01SVO20 XCF32P XCF128X fs48 xc3s400 pinout XCF32PVO48 DS123 VO48	PDF
XCF32P Abstract: XCF32PFS48C XCF08 xcf02s-vo20 pcb footprint FS48, and FSG48 XCF01S xcf32p-vog48 DS123 FS48 VO20 Text: <BL Blue> Platform Flash In-System Programmable Configuration PROMS R DS123 v2.9 May 09, 2006 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs ♦ • 3.3V supply voltage Low-Power Advanced CMOS NOR FLASH Process	Original	DS123 VOG20 LVCMOS25 XCF32P XCF32PFS48C XCF08 xcf02s-vo20 pcb footprint FS48, and FSG48 XCF01S xcf32p-vog48 DS123 FS48 VO20	PDF

CHN 936 Abstract: CHN G4 019 xcf16pfs XCF02S RELIABILITY REPORT XCF04S XILINX SPARTAN XC2S50 XCF32PVO48 FG48 XC2V80 SPARTAN 3a dsp board schematics Text: 47 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.12 January 28, 2008 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR FLASH Process	Original	DS123 CHN 936 CHN G4 019 xcf16pfs XCF02S RELIABILITY REPORT XCF04S XILINX SPARTAN XC2S50 XCF32PVO48 FG48 XC2V80 SPARTAN 3a dsp board schematics	PDF
XCF04S pcb Abstract: XC2V80 Text: R DS123 v2.4 July 20, 2004 3 9 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS FLASH Process • Endurance of 20,000 Program/Erase Cycles	Original	DS123 VOG20, FSG48, VOG48. XC2VP125 XCF04S pcb XC2V80	PDF
XCF02S Abstract: AEC-Q100 TS16949 XAF01S XAF04S XA2S200E Text: R DS316-1 v1.0 October 18, 2004 2 3 Platform Flash In-System Programmable Configuration XA PROMS Advance Product Specification Features • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade. •	Original	DS316-1 XAF01S/XAF02S/XAF04S VOG20 QS-9000, TS16949 XAF04S XAF01S XAF02S XAF04S XCF02S AEC-Q100 XAF01S XA2S200E	PDF
camera-link to hd-SDI converter Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400 Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6	Original		PDF
UG161 Abstract: XCF128X COOLRUNNER-II example led xc6slx75t XC3SD3400A xc5vlx220t XCF02S RELIABILITY REPORT virtex 6 XC6VSX475T xc6slx75 XC6VLX365T Text: Platform Flash PROM User Guide UG161 v1.5 October 26, 2009 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG161 XAPP694, XAPP544, XCF02S/XCF04S XAPP389, UG002, UG071, UG191, UG332, UG360, UG161 XCF128X COOLRUNNER-II example led xc6slx75t XC3SD3400A xc5vlx220t XCF02S RELIABILITY REPORT virtex 6 XC6VSX475T xc6slx75 XC6VLX365T	PDF
Lead Free reflow soldering profile BGA Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160 Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160	PDF
XCF32P Abstract: pcb footprint FS48, and FSG48 TANTALUM SMD CAPACITOR CROSS-REFERENCES XCP32P fpga JTAG Programmer Schematics XAPP986 VOG20 DS123 V020 XCF02S Text: Platform Flash PROM User Guide UG161 v1.4 October 17, 2008 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG161 XAPP544, XCF02S/XCF04S WP152, XAPP389, UG002, UG071, UG191, UG332, XCF32P pcb footprint FS48, and FSG48 TANTALUM SMD CAPACITOR CROSS-REFERENCES XCP32P fpga JTAG Programmer Schematics XAPP986 VOG20 DS123 V020 XCF02S	PDF
XC3S250E TQ144 STARTER KIT BOARD Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55 Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6	Original		PDF
F5044 Abstract: XCF02SVOG20C Xilinx XCF08P xcf04svOg20c XCF16PFS48C XCF04S fit XCF01S-VO20C F50450 marking aab 8 tsop XCF04SVO20C0936 Text: R DS123 v2.4 July 20, 2004 3 9 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS FLASH Process • Endurance of 20,000 Program/Erase Cycles	Original	DS123 PCN2004-18 F5044 XCF02SVOG20C Xilinx XCF08P xcf04svOg20c XCF16PFS48C XCF04S fit XCF01S-VO20C F50450 marking aab 8 tsop XCF04SVO20C0936	PDF
spartan 3a Abstract: 48-pin TSOP Package VO48 XCF02S RELIABILITY REPORT xcf128x XCF32PFS48C Virtex 4 XC4VFX60 XC3S400 XCF02S pcb XCF32P Device Reliability report XILINX Text: 48 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.15 July 07, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process	Original	DS123 VOG20 spartan 3a 48-pin TSOP Package VO48 XCF02S RELIABILITY REPORT xcf128x XCF32PFS48C Virtex 4 XC4VFX60 XC3S400 XCF02S pcb XCF32P Device Reliability report XILINX	PDF

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