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    PQG160 Search Results

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    PQG160 Price and Stock

    Microchip Technology Inc A42MX24-PQG160I

    IC FPGA 125 I/O 160QFP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A42MX24-PQG160I Tray 48 1
    • 1 $432.71
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    • 100 $432.71
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    Mouser Electronics A42MX24-PQG160I 24
    • 1 $432.71
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    • 100 $432.71
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    Microchip Technology Inc A42MX16-PQG160I

    IC FPGA 125 I/O 160QFP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A42MX16-PQG160I Tray 41 1
    • 1 $259.89
    • 10 $259.89
    • 100 $256.2216
    • 1000 $256.2216
    • 10000 $256.2216
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    Avnet Americas A42MX16-PQG160I Tray 10 Weeks 24
    • 1 $259.89
    • 10 $259.89
    • 100 $252.66
    • 1000 $230.29
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    Mouser Electronics A42MX16-PQG160I 27
    • 1 $259.89
    • 10 $259.89
    • 100 $256.22
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    Microchip Technology Inc A42MX16-PQG160M

    IC FPGA 125 I/O 160QFP
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    DigiKey A42MX16-PQG160M Tray 24 1
    • 1 $936.2
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    • 100 $936.2
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    Mouser Electronics A42MX16-PQG160M 24
    • 1 $936.2
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    • 1000 $936.2
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    Microchip Technology Inc A1425A-PQG160I

    IC FPGA 100 I/O 160QFP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A1425A-PQG160I Tray
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    Microchip Technology Inc A1460A-PQG160I

    IC FPGA 131 I/O 160QFP
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    DigiKey A1460A-PQG160I Tray
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    PQG160 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PQG160

    Abstract: PQ160 PK007
    Text: R PQFP PQ160/PQG160 Package PK007 (v1.2) June 18, 2004 2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF PQ160/PQG160) PK007 PQG160 PQ160 PK007

    XC95108

    Abstract: XC95108-10PQ160C xc95108-10pqg100i XC95108-20PQG160I TQG100 XC95108-15PC84C PGC84 XC95108-20PQ100I
    Text: – PRODUCT OBSOLETE / UNDER OBSOLESCENCE – XC95108 In-System Programmable CPLD R DS066 v5.0 May 17, 2013 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 108 macrocells with 2,400 usable gates


    Original     		PDF XC95108 DS066 36V18 PQ160 XCN11010 XC95108-10PQ160C xc95108-10pqg100i XC95108-20PQG160I TQG100 XC95108-15PC84C PGC84 XC95108-20PQ100I

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XC95216-20PQG160I

    Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
    Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but


    Original     		PDF XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500

    XC95144

    Abstract: XC95144-10PQG100I XC95144-10PQG160C xc9514415pqg160i Plastic Quad Flat Pack PQFP XC95144-10TQG100I xc95144-15pqg100i XC95144-7PQG160C XC95144-15PQG160C XC95144-15pqg160i
    Text: XC95144 In-System Programmable CPLD R DS067 v5.6 April 3, 2006 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 111 MHz • • • 144 macrocells with 3,200 usable gates Up to 133 user I/O pins 5V in-system programmable


    Original     		PDF XC95144 DS067 36V18 PQ160 XC95144-10PQG100I XC95144-10PQG160C xc9514415pqg160i Plastic Quad Flat Pack PQFP XC95144-10TQG100I xc95144-15pqg100i XC95144-7PQG160C XC95144-15PQG160C XC95144-15pqg160i

    XC95144 PQ100

    Abstract: XC95144 XC95144-15TQG100C XC95144-15TQG100I XC95144-10PQ100I PQ100 PQ160 TQ100 XC9500 XC95144-15PQ100
    Text: XC95144 In-System Programmable CPLD R DS067 v5.7 May 28, 2009 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 111 MHz • • • 144 macrocells with 3,200 usable gates Up to 133 user I/O pins 5V in-system programmable


    Original     		PDF XC95144 DS067 36V18 XC95144 PQ100 XC95144-15TQG100C XC95144-15TQG100I XC95144-10PQ100I PQ100 PQ160 TQ100 XC9500 XC95144-15PQ100

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    xc95216-20pq160c

    Abstract: No abstract text available
    Text: Product Obsolete/Under Obsolescence XC95216 In-System Programmable CPLD R DS068 v5.0 May 17, 2013 5 Product Specification Features Description • • 10 ns pin-to-pin logic delays on all pins fCNT to 111 MHz • • • 216 macrocells with 4,800 usable gates


    Original     		PDF XC95216 DS068 36V18 BG352 BGG252 XCN11010 352-pin XCN07010 xc95216-20pq160c

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    XC95216-10PQG160C

    Abstract: XC95216-10PQG160I XC95216-20PQG160I XC95216-10PQ160I XC95216-15PQ160 XC95216-20PQG160C XC95216 XC95216-15PQ160I
    Text: XC95216 In-System Programmable CPLD R DS068 v4.3 April 3, 2006 5 Product Specification Features Description • • 10 ns pin-to-pin logic delays on all pins fCNT to 111 MHz • • • 216 macrocells with 4,800 usable gates Up to 166 user I/O pins 5V in-system programmable


    Original     		PDF XC95216 DS068 36V18 XC95216-10PQG160C XC95216-10PQG160I XC95216-20PQG160I XC95216-10PQ160I XC95216-15PQ160 XC95216-20PQG160C XC95216-15PQ160I

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    XC95108-15TQ100C

    Abstract: XC95108-15PCG84C XC95108 XC95108-20TQ100I XC95108-15TQG100C XC95108-10PQG160I PQ100 PQG160 xc95108 tq100 XC95108-15TQ100I
    Text: XC95108 In-System Programmable CPLD R DS066 v4.4 April 3, 2006 5 Product Specification Features Description • • 7.5 ns pin-to-pin logic delays on all pins fCNT to 125 MHz • • • 108 macrocells with 2,400 usable gates Up to 108 user I/O pins 5V in-system programmable


    Original     		PDF XC95108 DS066 36V18 XC9500 PQ160 XC95108-15TQ100C XC95108-15PCG84C XC95108-20TQ100I XC95108-15TQG100C XC95108-10PQG160I PQ100 PQG160 xc95108 tq100 XC95108-15TQ100I

    XAPP427

    Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING
    Text: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 XAPP427 BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow

    ACTEL PQ160

    Abstract: PQ160 PQG160 C149
    Text: THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF ACTEL. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PROPRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE, AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS


    OCR Scan     		PDF C149-23 40max 65x39 23-B5 SY-RQG166, PQ160 PQG160 ACTEL PQ160 C149