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    TSSOP48 Search Results

    TSSOP48 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    841604AGILF Renesas Electronics Corporation FemtoClock® Crystal-to-HCSL Clock Generator, TSSOP48/Tube Visit Renesas Electronics Corporation
    SF Impression Pixel

    TSSOP48 Price and Stock

    Dataman DIL48/TSSOP48 ZIF 240MIL

    |Dataman DIL48/TSSOP48 ZIF 240MIL
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    Newark DIL48/TSSOP48 ZIF 240MIL Bulk 1
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    Dataman DIL48/TSSOP48-240 ZIF MSP430-1

    The Dataman Dil48/Tssop48-240 Zif Msp430-1 Is A Device Specific Adapter For Ti Msp430Fr2033Ig48R/Msp430Fr4133Ig48R In Tssop48. |Dataman DIL48/TSSOP48-240 ZIF MSP430-1
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    Newark DIL48/TSSOP48-240 ZIF MSP430-1 Bulk 1
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    ROHM Semiconductor BD18333EUV-ME2

    LED Lighting Driver ICs CONSTANT CURRENT LED DRIVER
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    TTI BD18333EUV-ME2 Reel 126,000 2,000
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    Nexperia 74LVC16244ADGG,118

    Buffers & Line Drivers SOT362-1 BUFFERS & LINE DVRS
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    TTI 74LVC16244ADGG,118 Reel 6,000 2,000
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    Nexperia 74LVC16245ADGG,118

    Bus Transceivers SOT362-1 BUS TRANSCEIVER
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    TTI 74LVC16245ADGG,118 Reel 4,000 2,000
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    TSSOP48 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


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    TC74LCX164245FT TSSOP48 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX16244FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


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    TC74LCX16244FT TSSOP48 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT


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    TSSOP48: OT362-1 MO-153 PDF

    74HCXXX

    Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
    Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)


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    SO-14 SO-16L SO-16 SO-20 SO-24 TSSOP14 OT23-8L TSSOP20 TSSOP16 OT23-5L 74HCXXX 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW PDF

    TSSOP48

    Abstract: TSSOP48 outline JEDEC MO-153 jedec MO-153 48-led
    Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).


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    TSSOP48: OT362-1 MO-153 TSSOP48 TSSOP48 outline JEDEC MO-153 jedec MO-153 48-led PDF

    TSSOP48

    Abstract: No abstract text available
    Text: TSSOP48 Adapter thin shrink small outline package RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm


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    TSSOP48 RE933-09 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCXR164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


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    TC74LCXR164245FT TSSOP48 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A2 A 3 A1 pin 1 index A θ Lp L detail X 1 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


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    TSSOP48: OT480-1 MO-153 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCXR162245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


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    TC74VCXR162245FT TSSOP48 PDF

    sot362

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).


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    TSSOP48: OT362-1 OT362-1 MO-153ED sot362 PDF

    TSSOP48

    Abstract: SOT480-1
    Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


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    TSSOP48: OT480-1 MO-153 TSSOP48 SOT480-1 PDF

    TSSOP48

    Abstract: TSSOP48 outline
    Text: 48-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP48 Package Tape Dimensions Unit: mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 2.0 ±0.1 Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1


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    48-Pin TSSOP48 TSSOP48 TSSOP48 outline PDF

    TSSOP48

    Abstract: TSSOP48 outline TSSOP-48
    Text: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ~10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ~ 0.75 0.1 M 12.8 max


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    48pin TSSOP48 TSSOP48 TSSOP48 outline TSSOP-48 PDF

    TSSOP48

    Abstract: TSSOP48 outline
    Text: 48-Pin Thin Shrink Small Outline Package TSSOP48 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ~10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ~ 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05


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    48-Pin TSSOP48 TSSOP48 TSSOP48 outline PDF

    TSSOP48

    Abstract: No abstract text available
    Text: PDF: 2003 Apr 14 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).


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    TSSOP48: OT362-1 MO-153 TSSOP48 PDF

    sot480

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


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    TSSOP48: OT480-1 OT480-1 MO-153 sot480 PDF

    TSSOP48

    Abstract: TSSOP64 SPDT SPI STP08CL596M TSSOP24 5V SPST RELAY 74V1G66CTR 74V1G66STR 74V1T384CTR 74V1T384STR
    Text: Surface mounting packages Advanced Logic ICs SOT23-8L SOT23-5L SOT323-5L Selection guide TSSOP16 TSSOP20 LFBGA96 TSSOP24 TFBGA54 SO-16 SO-20 TSSOP24 exposed-pad TSSOP48 µTFBGA42 QFN16 SO-24 TSSOP64 Flip-Chip5 SSOP24 Flip-Chip11 H (inch) W (tape width mm)


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    OT23-8L OT23-5L OT323-5L TSSOP16 TSSOP20 LFBGA96 TSSOP24 TFBGA54 SO-16 SO-20 TSSOP48 TSSOP64 SPDT SPI STP08CL596M TSSOP24 5V SPST RELAY 74V1G66CTR 74V1G66STR 74V1T384CTR 74V1T384STR PDF

    TSSOP48

    Abstract: No abstract text available
    Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


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    TSSOP48: OT480-1 MO-153 TSSOP48 PDF

    TSSOP48

    Abstract: TSSOP48 outline TSSOP-48
    Text: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0


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    48pin TSSOP48 TSSOP48 TSSOP48 outline TSSOP-48 PDF

    Untitled

    Abstract: No abstract text available
    Text: TS SO P4 8 SOT362-1 TSSOP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 5 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape


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    OT362-1 TSSOP48; 001aak603 OT362-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original
    TC74VCX16245FT TSSOP48 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original
    TC74LCX16245FT TSSOP48 PDF

    4001 4011 cmos

    Abstract: 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be
    Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm) SO-8, TFBGA42


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    SO-14 SO-16L SO-16 SO-20 SO-24 TSSOP14 OT23-8L TSSOP20 TSSOP16 OT23-5L 4001 4011 cmos 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be PDF

    Untitled

    Abstract: No abstract text available
    Text: TOSHIBA TC74VCX16373FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74VCX16373FT LOW-VOLTAGE 16-BIT D-TYPE LATCH WITH 3.6V TOLERANT INPUTS AND OUTPUTS The TC74VCX16373FT is a high performance CMOS 16-bit D-TYPE LATCH. Designed for use in 1.8, 2.5 or 3.3 Volt


    OCR Scan
    TC74VCX16373FT 16-BIT TC74VCX16373FT TSSOP48-P-OQ61 PDF