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    TSSOP20 Price and Stock

    Flip Electronics EFM8BB51F16G-C-TSSOP20R

    IC MCU 8BIT 16KB FLASH 20TSSOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EFM8BB51F16G-C-TSSOP20R Reel 319,500 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.54
    • 10000 $0.54
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    ams OSRAM Group AS5304B TSSOP20 LF T&RDP

    AS5304B TSSOP20 LF T&RDP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AS5304B TSSOP20 LF T&RDP Reel 500 500
    • 1 -
    • 10 -
    • 100 -
    • 1000 $6.28382
    • 10000 $6.28382
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    Artekit Labs DA-TSSOP20-P65

    TSSOP-20 TO DIP ADAPTER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DA-TSSOP20-P65 Bulk 401 1
    • 1 $2.12
    • 10 $1.962
    • 100 $1.7498
    • 1000 $1.53772
    • 10000 $1.53772
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    Silicon Laboratories Inc EFM8BB51F8G-C-TSSOP20

    IC MCU 8BIT 8KB FLASH 20TSSOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EFM8BB51F8G-C-TSSOP20 295 1
    • 1 $0.77
    • 10 $0.691
    • 100 $0.5389
    • 1000 $0.4125
    • 10000 $0.4125
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    Mouser Electronics EFM8BB51F8G-C-TSSOP20 668
    • 1 $1.1
    • 10 $0.934
    • 100 $0.717
    • 1000 $0.499
    • 10000 $0.434
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    Flip Electronics EFM8BB51F8G-C-TSSOP20 319,500
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    • 10000 -
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    Silicon Laboratories Inc EFM8BB52F32G-C-TSSOP20

    IC MCU 8BIT 32KB FLASH 20TSSOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EFM8BB52F32G-C-TSSOP20 241 1
    • 1 $1.57
    • 10 $1.4
    • 100 $1.0918
    • 1000 $0.71205
    • 10000 $0.63135
    		Buy Now
    Mouser Electronics EFM8BB52F32G-C-TSSOP20 936
    • 1 $1.57
    • 10 $1.33
    • 100 $1.1
    • 1000 $0.727
    • 10000 $0.618
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    Find more TSSOP20 price and stock on Findchips.com

    TSSOP20 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Type PDF
    TSSOP-20 Advanced Analog Circuits Mechanical Dimensions Original PDF
    TSSOP20 Zetex Semiconductors Surface mounted, 20 pin package Original PDF
    TSSOP20EV Microchip Technology Evaluation and Demonstration Boards and Kits, Programmers, Development Systems, BOARD EVAL FOR MCP43X Original PDF

    TSSOP20 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TSSOP20

    Abstract: TSSOP20J
    Text: SANYO Semiconductor Thin Shrink Small Outline Package 20Pin Plastic TSSOP20J 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		PDF 20Pin TSSOP20J 225mil) ED-7303A) TSSOP20J TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC273FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC273FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCT573AFT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCT573AFT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCXR2245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VCXR2245FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX374FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX374FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCV245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCV245FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC244FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VCX245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VCX245FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LVX244FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74ACT244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74ACT244FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCV540FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCV540FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74ACT540FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74ACT540FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC541FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Package information - TSSOP20 Surface mounted, 20 pin package Package outline D E1 E L c A2 A b DIM A A1 A2 D E L e b c e A1 Millimeters Min Max 1.20 0.05 0.15 0.80 1.05 6.40 6.60 6.40 BSC 0.45 0.75 0.65 BSC 0.19 0.30 0.09 0.20 Inches Min Max 0.047 0.002 0.006


    Original     		PDF TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Thin Shrink Small Outline Package 20pin TSSOP20 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 Y X’ 6.9 ±0.1 7.5 ±0.1 Y φ1.6 ±0.1 X 0.3 ±0.05 16.0 ±0.3 8.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1


    Original     		PDF 20pin TSSOP20 TSSOP20

    74HCXXX

    Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
    Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)


    Original     		PDF SO-14 SO-16L SO-16 SO-20 SO-24 TSSOP14 OT23-8L TSSOP20 TSSOP16 OT23-5L 74HCXXX 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC573FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC573FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC245FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC245FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC240FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC240FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX541FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX574FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74LCX574FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC9541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHC9541FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCV244FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCV244FT TSSOP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCV541FT Package Name: TSSOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s


    Original     		PDF TC74VHCV541FT TSSOP20