74HCXXX
Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)
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SO-14
SO-16L
SO-16
SO-20
SO-24
TSSOP14
OT23-8L
TSSOP20
TSSOP16
OT23-5L
74HCXXX
74HCxx
TSSOP48
CMOS4000
STMicroelectronics package outline dip
74LX1G
M013TR
M74HCXXXM1R
TC74HCTXXXAP
SN74ACTXXXPW
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area
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TFBGA96:
OT597-1
MO-195
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA96 package SOT597-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA96
OT597-1
OT597-1
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TFBGA96
Abstract: MO-195
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e y1 C y ∅w M C P N M L K J H G
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TFBGA96:
OT597-1
MO-195
TFBGA96
MO-195
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TFBGA96
Abstract: sot597
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A
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TFBGA96:
OT597-1
TFBGA96
sot597
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TFBGA96
Abstract: MO-195
Text: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA96: plastic thin fine-pitch ball grid array package; 96 balls; body 8 x 8 x 0.8 mm A B D SOT597-1 ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M P N M L K J H G F E D C B A y y1 C v M A
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TFBGA96:
OT597-1
MO-195
TFBGA96
MO-195
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4001 4011 cmos
Abstract: 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be
Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm) SO-8, TFBGA42
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SO-14
SO-16L
SO-16
SO-20
SO-24
TSSOP14
OT23-8L
TSSOP20
TSSOP16
OT23-5L
4001 4011 cmos
4049 DIP14
4013 datasheet hct
lcx 574
CMOS 4541
str 4512
C3245
4017 14 pin package
CMOS4000
hcf 4541 be
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lcx 574
Abstract: STR 4512 HC 4093 4001 4011 cmos HC 40106 4017 14 pin package 4011 cmos logic gate HC 4011 logic gate hcf 4541 equivalent hct 4049
Text: Standard Logic ICs Selection guide August 2007 www.st.com/logic Family selector HCT 0 to VCC 4 12 4.5 to 5.5 0 to VCC 4 12 AC 2 to 6 0 to VCC 24 4 ACT 4.5 to 5.5 0 to VCC 24 4 VHC 2 to 5.5 0 to 5.5 8 4 VHCT 4.5 to 5.5 0 to 5.5 8 4 V1G 2 to 5.5 0 to 5.5 8 4
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DIP-14/16
DIP-14
DIP-24
SGSTDLOG0307
lcx 574
STR 4512
HC 4093
4001 4011 cmos
HC 40106
4017 14 pin package
4011 cmos logic gate
HC 4011 logic gate
hcf 4541 equivalent
hct 4049
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07d7
Abstract: No abstract text available
Text: P-TFBGA96-0707-0.65A4
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OCR Scan
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-07D7-mflMP-TFWiA
-07D7-mflM
07d7
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Untitled
Abstract: No abstract text available
Text: Uniti nn P—TFBGA96—0707—0.65A4 p /n r n z i W im !►— m § § o 10. 651 0. 575±0. 03 •4- oo oo oo oo oo pb ooooooooooooopoooo oo oo oo oo o_i_b oo oo oo oo oOOOO o o o 'T OiO'oo oooooo o o o o o lo o o o o OOOOOpOOOO oooooooooo
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