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    TSOP PACKAGE TRAY Search Results

    TSOP PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    TSOP PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SIGNETICS

    Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches


    Original     		12x20 SIGNETICS JEDEC tray standard 13 Signetics OR Mullard package tray outline signetics data PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead


    Original     		12x20 TSOP 48 thermal resistance TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48 PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024 PDF

    TSOP package tray

    Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
    Text: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)


    Original     		28-pin 32-pin SSD-A-H7033-1 TSOP package tray JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1 PDF

    TSOP package tray

    Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
    Text: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)


    Original     		400MIL21 32-pin 400mil) 50-pin 400MIL21 TSOP package tray JEDEC TRAY DIMENSIONS 10936 TSOP TRAY PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
    Text: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)


    Original     		400MIL21 32-pin 50-pin 400MIL21 SSD-A-H6115-2 JEDEC tray standard JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2 PDF

    TSOP package tray

    Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)


    Original     		400MIL18 28-pin 44-pin SSD-A-H6111-2 TSOP package tray TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)


    Original     		400MIL22 54-pin 66-pin 86-pin SSD-A-H6023-4 TSOP 86 Package TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package PDF

    TSOP package tray

    Abstract: 300mil JEDEC TRAY DIMENSIONS tsop 1230
    Text: UNIT : mm HEAT PROOF 111.3 7 PPE NEC 135°C MAX 11.13 12.30 TSOP 2 300MIL17 135.9 11x16=176 A A' 9.2 16.4 19.14 13.95 287.1 315.0 (322.6) SECTION A-A' 16.4 (6.35) 7.62 12.0 5.62 Applied Package Quantity (pcs) 26-pin Plastic TSOP(II)(300mil) MAX. 176 Tray


    Original     		300MIL17 26-pin 300mil) TSOP package tray 300mil JEDEC TRAY DIMENSIONS tsop 1230 PDF

    TSOP 48 package tray

    Abstract: 48-pin TSOP package tray tsop 48 PIN tray TSOP package tray TSOP I JEDEC TRAY DIMENSIONS TRAY TSOP
    Text: 150° MAX. 14.90 A 8x12=96 15.80 104.3 TSOP I 12.0×20.0mm A' 12.3 20.3 25.50 17.25 280.5 315.0 322.6 SECTION A – A' 5.62 (6.35) 20.3 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12×20) MAX. 96 Tray Material Heat Proof Temp.


    Original     		48-pin TSOP 48 package tray 48-pin TSOP package tray tsop 48 PIN tray TSOP package tray TSOP I JEDEC TRAY DIMENSIONS TRAY TSOP PDF

    TSOP 48 package tray

    Abstract: 48-pin TSOP package tray tsop 48 PIN tray JEDEC tray standard TSOP package tray tsop TRAY TSOP TRAY 40 PIN
    Text: TRAY CONTAINER UNIT : mm 8x13=104 NEC 7 135°C MAX. 14.90 15.80 A' 23.50 12.10 104.3 TSOP 1 12×18 135.9 PPE A 18.40 282.0 315.0 (322.6) 16.50 SECTION A – A' 5.62 (6.35) 7.62 18.40 Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12 × 18) MAX. 104


    Original     		48-pin SSD-A-H6761 TSOP 48 package tray 48-pin TSOP package tray tsop 48 PIN tray JEDEC tray standard TSOP package tray tsop TRAY TSOP TRAY 40 PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: 1C 197 SERIES TSOP 0.5rwn pitch •O u tlin e Dimensions CD FEATURES • SMT type sockets for TSOP Type-1 mounting. • Require no jigs for IC removal. • Mounting in IC identical foot patterns. • Low profile design with package height 2.45 to 2.50mm.


    OCR Scan     		500MO at500VDC 250VAC IC197â PDF

    TSOP package tray

    Abstract: No abstract text available
    Text: TRAY CONTAINER Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4)


    Original     		LA-2542B-1 28-pin 32-pin SSD-A-H5869-1 TSOP package tray PDF

    TSOP package tray

    Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
    Text: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117


    Original     		400MIL21 50-pin 400mil) TSOP package tray TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117 PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
    Text: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)


    Original     		400MIL22 54-pin 400mil) 66-pin 86-pin TSOP 86 Package TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray PDF

    TSOP 62 Package

    Abstract: TSOP-II 44 TSOP package tray
    Text: UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 PP 137.5±0.5 A A' 13.1 180±1.0 21.25±0.5 32±0.1 NEC LA–2541B–1 HEAT PROOF 24.3 SECTION A – A' 24.3 6.2 5.8 8.8 21.3 Applied Package 28-pin Plastic TSOP II (400mil) 44-pin Plastic TSOP (II)(400mil)


    Original     		2541B 28-pin 400mil) 32-pin 50-pin LA-2541B-1 44-pin TSOP 62 Package TSOP-II 44 TSOP package tray PDF

    Untitled

    Abstract: No abstract text available
    Text: Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4) Quantity (pcs)


    Original     		LA-2542B-1 28-pin 32-pin PDF

    Untitled

    Abstract: No abstract text available
    Text:  LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 0.5 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package


    Original     		LY62L12916 44-pin 48-pin 48-ball PDF

    Untitled

    Abstract: No abstract text available
    Text: LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Rev. 0.6 Rev. 1.0 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package


    Original     		LY62L12916 LY62L12916GL-45SL LY62L12916GL-70LLET LY62L12916GL-70LLI LY62L12916GL-70LLIT PDF

    intel standard marking

    Abstract: No abstract text available
    Text: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED DATA I/O ProMaster 970 • ■ ■ ■ Programs, sorts, and marks up to 110 devices per hour Supports memory, microcontroller, and logic devices Package support: µBGA*, SOP, SSOP, TSOP and others Media supported: tube, tray, and


    Original     		84PLCC/ 208QFP) intel standard marking PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
    Text: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		44-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944 PDF

    tsop Shipping Trays

    Abstract: No abstract text available
    Text: Section 4 Thin Sm all O utline P a c k a g e T H IN SMALL O U TLIN E PACKAGE TSO P DES C R IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry’s leading edge plastic, surface mountable memory package today. System requirements for higher den­


    OCR Scan     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
    Text: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		32-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D PDF

    Unmanned Solutions

    Abstract: No abstract text available
    Text: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED UNMANNED SOLUTIONS AH 500 • ■ ■ ■ ■ No more bent leads Program Intel Flash memory and other programmable devices in 3256 TSOP and other package standards User-friendly interface Programmer options: System


    Original     		PDF