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    TRAY 388 PIN BGA Search Results

    TRAY 388 PIN BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    TRAY 388 PIN BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 PDF

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		3027b 56mm carrier tape 28 pin ic TM 1628 PDF

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


    Original     		PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
    Text: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit fBGA package tray 12 x 19 FCCSP a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD PDF

    secucalm

    Abstract: SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 HT80C51 I18N 1Z89
    Text: Flash Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 1. System LSI (S) 2. Large Classification : Microcontroller(3) 3. Small Classification C : MASK ROM F : FLASH 3 : MCP 4. Core 1 : 51 4-bit 3 : 17 16-bit


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit SC-100 secucalm SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 I18N 1Z89 PDF

    secucalm

    Abstract: HT80C51 ARM10 H285 I18N SecuCalm16
    Text: Smart Card Controller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-be secucalm ARM10 H285 I18N SecuCalm16 PDF

    KGA0E000BA

    Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
    Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte


    Original     		16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC PDF

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    xc912dg128

    Abstract: MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60
    Text: MICROCONTROLLERS QUARTER 3, 2002 SG1006/D REV 1 WWW.MOTOROLA.COM/SEMICONDUCTORS What’s New! Product MC68HC908QT1 MC68HC908QT2 Description Introducing the Nitron Family of HC08s. This family of 8- and 16-pin microcontrollers includes six different devices featuring 1.5K to 4K bytes of FLASH, a 2-ch


    Original     		SG1006/D MC68HC908QT1 MC68HC908QT2 HC08s. 16-pin 16-bit MC68HC908QT4 MC68HC908QY1 MC68HC908QY2 xc912dg128 MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60 PDF

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48 PDF

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A PDF

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311 PDF

    AT32UC3A3

    Abstract: AT32UC3A4 bga-100 0.5
    Text: Features • High Performance, Low Power 32-bit AVR Microcontroller • • • • • • • • • • • • – Compact Single-Cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation


    Original     		32-bit 51DMIPS/MHz 92DMIPS 66MHz 36MHz 256KBytes, 128KBytes, 64KBytes 36MHz 32072G AT32UC3A3 AT32UC3A4 bga-100 0.5 PDF

    AT32UC3A4

    Abstract: AT32UC3A3 AT32UC3A464 AT32UC3A3256 embedded c programming of fibonacci series AT32UC3A364 AT32UC3A4256S AT32UC3A3256-ALUT AT32UC3A364-ALUR AT32UC3A3256S
    Text: Features • High Performance, Low Power 32-bit AVR Microcontroller • • • • • • • • • • • • – Compact Single-Cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation


    Original     		32-bit 51DMIPS/MHz 92DMIPS 66MHz 36MHz 256KBytes, 128KBytes, 64KBytes 32072D AT32UC3A4 AT32UC3A3 AT32UC3A464 AT32UC3A3256 embedded c programming of fibonacci series AT32UC3A364 AT32UC3A4256S AT32UC3A3256-ALUT AT32UC3A364-ALUR AT32UC3A3256S PDF

    AT32UC3A3256

    Abstract: AT32UC3A3256S AT32UC3A364 32072F M2 Memory Stick PRO CPU instructions 6810 sram AT32UC3A4 PX36 CMD56 372 ball VFBGA thermal resistance
    Text: Features • High Performance, Low Power 32-bit AVR Microcontroller • • • • • • • • • • • • – Compact Single-Cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation


    Original     		32-bit 51DMIPS/MHz 92DMIPS 66MHz 36MHz 256KBytes, 128KBytes, 64KBytes 32072F AT32UC3A3256 AT32UC3A3256S AT32UC3A364 M2 Memory Stick PRO CPU instructions 6810 sram AT32UC3A4 PX36 CMD56 372 ball VFBGA thermal resistance PDF

    32072S

    Abstract: SMC12 at32uc3a3256 AT32UC3 BOD33LEVEL AT32UC3A4 372 ball VFBGA thermal resistance
    Text: Features • High Performance, Low Power 32-bit Atmel AVR® Microcontroller • • • • • • • • • • • • – Compact Single-Cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation


    Original     		32-bit 51DMIPS/MHz 84MHz 42MHz 256KBytes, 128KBytes, 64KBytes 36MHz 32072SH AVR32 32072S SMC12 at32uc3a3256 AT32UC3 BOD33LEVEL AT32UC3A4 372 ball VFBGA thermal resistance PDF

    HTD12

    Abstract: 45x45 bga CBD62 cba8 373 ic HTD24 application of microprocessor in aircrafts 6-pin plastic A6 tray 45x45 CBD43
    Text: DATA SHEET MOS INTEGRATED CIRCUIT PD98410 1.2G ATM SWITCH LSI DESCRIPTION The PD98410 NEASCOT-X10TM is an LSI integrating ATM switch functions on a single chip. It has four UTOPIA level2 interfaces and can switch 24  24 circuits by using a multi-PHY connection. This LSI also realizes a switching


    Original     		PD98410 NEASCOT-X10TM) bits/40 16Kial: HTD12 45x45 bga CBD62 cba8 373 ic HTD24 application of microprocessor in aircrafts 6-pin plastic A6 tray 45x45 CBD43 PDF

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon PDF