JEDEC TQFP 10*10 1.0 MM
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A73B-1
S64GB-50-9EU-1
JEDEC TQFP 10*10 1.0 MM
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144 pin qfp
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3523A-1 TQFP 20x20 1.4mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end C D S R Q 144 1 37 36 F G H I M J K P M N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3523A-1
S144GJ-50-8EU-2
144 pin qfp
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A87A-1 TQFP 28x28 1.4mm 208 pin QFP 28 × 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end C D S Q 53 52 208 1 F G H I J M K P M N NOTE L ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A87A-1
S208GD-50-8EU-2
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A68A-1
ST-TQ242414TJ-1
S176GM-50-8EU-2
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S100GC-50-8EU
Abstract: f 630
Text: Mounting Pad Packing NEC Tray Name LA-3566A-1 LA-0566A-1 JEDEC Tray TQFP 14x14×1.4 100 pin LQFP 14 × 14 A B 75 76 51 50 detail of lead end S C D Q R 26 25 100 1 F G H I M J K P M N NOTE Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
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LA-3566A-1
LA-0566A-1
S100GC-50-8EU
S100GC-50-8EU
f 630
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard TQFP JEDEC tray JEDEC tray standard TQFP TRAY DIMENSIONS TRAY CONTAINER tray container dimensions TQFP 100 PACKAGE TQFP 80 PACKAGE TRAY DIMENSIONS TQFP 64
Text: TRAY CONTAINER 7 A' 14.7 17.90 14.30 14.7 135 °C MAX. 18.00 13.95 TOFP12x12×1.0 A NEC 108.0 135.9 PPE 7×17=119 UNIT : mm 286.4 315.0 322.6 SECTION A – A' 14.70 Applied Package 6.22 (6.35) 7.62 12.00 Quantity (pcs) 64-pin Plastic TQFP(1.0mm thick) 80-pin Plastic TQFP(1.0mm thick)
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OFP12
80-pin
100-pin
64-pin
SSD-A-H6567-1
JEDEC TRAY DIMENSIONS
JEDEC tray standard
TQFP JEDEC tray
JEDEC tray standard TQFP
TRAY DIMENSIONS
TRAY CONTAINER
tray container dimensions
TQFP 100 PACKAGE
TQFP 80 PACKAGE
TRAY DIMENSIONS TQFP 64
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128-PIN
Abstract: TQFP 100 PACKAGE nec tqfp TQFP JEDEC tray
Text: TRAY CONTAINER HEAT PROOF 7 PPE NEC 16.2 135°C MAX A' 15.45 A 6x15=90 21.00 105.0 TQFP 14×14×1.0 135.9 UNIT : mm 20.30 16.2 284.2 315.0 322.6 15.40 SECTION A – A' Applied Package 6.12 (6.35) 7.62 16.2 14.0 Quantity (pcs) 100-pin Plastic TQFP(1.0mm thick)
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100-pin
120-pin
128-pin
SSD-A-H6571-1
TQFP 100 PACKAGE
nec tqfp
TQFP JEDEC tray
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Untitled
Abstract: No abstract text available
Text: 125°C BAKE/140°C MAX 109.9 13.00 15.70 TQFP 10x10 1.0T 135.9 UNIT : mm 12.37 A A' 15.20 12.37 288.8 13.1 315.0 322.6 SECTION A-A' 6.35 7.62 12.37 6.401 Applied Package Quantity (pcs) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 160 Tray Material
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BAKE/140
64-pin
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TRAY DIMENSIONS TQFP 64
Abstract: No abstract text available
Text: TRAY CONTAINER 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' Applied Package 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick)
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48-pin
64-pin
SSD-A-H6413-2
TRAY DIMENSIONS TQFP 64
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TQFP JEDEC tray
Abstract: No abstract text available
Text: HEAT PROOF 105.0 7 135°C MAX PPE 17.5 A' 15.45 21.00 A TQFP 14x20×1.0 6×12=72 135.9 UNIT : mm 23.5 25.40 17.80 279.4 315.0 322.6 SECTION A – A' Applied Package 100-pin Plastic TQFP (1.0mm thick) 5.62 6.35 7.62 23.5 Quantity (pcs) MAX. 72 Tray Material
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100-pin
TQFP JEDEC tray
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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TQFP-28
Abstract: QFP JEDEC tray TQFP JEDEC tray
Text: HEAT PROOF A' 7 150°C MAX PPE 19.65 32.2 96.6 A TQFP 28 x 28 1.4mm 135.9 UNIT : mm 30.8 30.8 32.2 28.7 257.6 315 322.6 SECTION A-A' 30.8 6.02 6.35 7.62 27.85 Applied Package 208-pin • Plastic QFP Fine Pitch (1.4mm thick) Quantity (pcs) MAX. 36 Tray Material
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208-pin
TQFP-28
QFP JEDEC tray
TQFP JEDEC tray
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Untitled
Abstract: No abstract text available
Text: 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' 6.12 (6.35) 7.62 9.1 6.5 Applied Package Quantity (pcs) 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 250 Tray Material
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48-pin
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink
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MS-026
TQFP 100 pin ic
tqfp 7x7 1.4 tray
tqfp 7x7 tray
MS-026
JEDEC tray standard 17 x 17
tqfp 64 thermal resistance
MS-026 TQFP
TQFP Package 44 lead
tqfp 32 thermal resistance
CO-124
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100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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LQFP Package tray
Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Text: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray
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100-pin
TQFP14
LQFP Package tray
TQFP 1414 1.4mm
JEDEC tray standard TQFP 1414
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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PDF
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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ICS83210
Abstract: ICS83210AY ICS83210AYLF MS-026 IDT Package Marking format TQFP 100 pin Socket
Text: Low Skew, 1-to-10, HSTL Fanout Buffer ICS83210 DATA SHEET GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout Buffer. The class II HSTL outputs are balanced push-pull in design, capable of delivering 16mA into a 10pF load. This class allows
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1-to-10,
ICS83210
ICS83210
1-to-10
150MHz
110ps
ICS83210AY
ICS83210AYLF
MS-026
IDT Package Marking format
TQFP 100 pin Socket
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Untitled
Abstract: No abstract text available
Text: Low Skew, 1-to-10, HSTL Fanout Buffer ICS83210 DATA SHEET GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout Buffer. The class II HSTL outputs are balanced push-pull in design, capable of delivering 16mA into a 10pF load. This class allows
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1-to-10,
ICS83210
ICS83210
1-to-10
150MHz
110ps
-TO-10,
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jedec MS-026 ABA
Abstract: ICS83210AYT MS-026 CY2HH8110 ICS83210 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP
Text: ICS83210 LOW SKEW, 1-TO-10 HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout ICS Buffer and a member of the HiPerClockS Family HiPerClockS™ of High Performance Clock Solutions from IDT. The class II HSTL outputs are balanced push-pull
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ICS83210
1-TO-10
ICS83210
150MHz
110ps
199707558G
jedec MS-026 ABA
ICS83210AYT
MS-026
CY2HH8110
ICS83210AY
ICS83210AYLF
idt cross
TQFP JEDEC tray
JEDEC tray standard TQFP
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ATSAMD21G18
Abstract: No abstract text available
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
ATSAMD21G18
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tqfp 7x7 tray
Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Text: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1
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OCR Scan
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A40553.
A40626.
tqfp 7x7 tray
DAEWON tray drawing
DAEWON JEDEC TRAY
tray drawing tqfp 7x7
daewon 7x7
DAEWON JEDEC TRAY 10 X 10
TQFP Shipping Trays
shipping tray
daewon 7x7 1.0T
JEDEC TRAY 10 X 10
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