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    SSOP20 LAND PATTERN Search Results

    SSOP20 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    SSOP20 LAND PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		SSOP20 OT339-1 OT339-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		SSOP20 OT266-1 OT266-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: D 0.635 0.4 H E 5.2 L 1.4 C θ b A1 A2 A e Recommended Land Pattern A A1 A2 b C D E e H L θ Dimensions in Millimeters Min Max 1.35 1.75 0.10 0.25 1.25 1.65 0.20 0.30 0.18 0.25 8.56 8.74 3.80 4.00 0.635 TYP 5.80 6.20 0.40 1.27 0∘ 8∘ Dimensions in Inches


    Original     		2500pcs MO-137 SSOP-20 150mil) PDF

    SSOP20 LAND PATTERN

    Abstract: No abstract text available
    Text: D 0.65 0.43 H E 7.05 1.25 L C θ b A A2 e A1 Recommended Land Pattern Symbol A A1 A2 b C D E e H L θ Dimensions in Millimeters Min Max -2.00 0.05 0.23 1.40 1.60 0.22 0.38 0.09 0.25 6.90 7.50 5.00 5.60 0.65 TYP 7.40 8.20 0.55 0.95 0∘ 8∘ Dimensions in Inches


    Original     		2000pcs MO-150 SSOP-20 209mil) SSOP20 LAND PATTERN PDF

    land pattern ssop28

    Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
    Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder


    Original     		PDF

    land pattern ssop28

    Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
    Text: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).


    Original     		SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56 PDF

    land pattern ssop28

    Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20
    Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder


    Original     		PDF

    9554DH

    Abstract: SOT266-1 LAND PATTERN 9554ADH PCA9554 PCA9554ATS,112
    Text: PCA9554; PCA9554A 8-bit I2C-bus and SMBus I/O port with interrupt Rev. 9 — 19 March 2013 Product data sheet 1. General description The PCA9554 and PCA9554A are 16-pin CMOS devices that provide 8 bits of General Purpose parallel Input/Output GPIO expansion for I2C-bus/SMBus applications and


    Original     		PCA9554; PCA9554A PCA9554 PCA9554A 16-pin PCA9554/PCA9554A 9554A 9554DH SOT266-1 LAND PATTERN 9554ADH PCA9554ATS,112 PDF

    PCA8574 PCA8574A

    Abstract: smd transistor marking A7 p7 TRANSISTOR SMD MARKING CODE a6 PCA8574ATS,112
    Text: PCA8574; PCA8574A Remote 8-bit I/O expander for I2C-bus with interrupt Rev. 3 — 3 June 2013 Product data sheet 1. General description The PCA8574/74A provides general-purpose remote I/O expansion via the two-wire bidirectional I2C-bus serial clock (SCL , serial data (SDA).


    Original     		PCA8574; PCA8574A PCA8574/74A PCA8574 PCA8574 PCA8574A smd transistor marking A7 p7 TRANSISTOR SMD MARKING CODE a6 PCA8574ATS,112 PDF

    PCF9574

    Abstract: 8574ts pcf8574t PCF8574P equivalent TRANSISTOR SMD MARKING CODE p1 pcf8574 Application Note input id pcf8574 c code PCF8574P,112 PCF8574AT
    Text: PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Rev. 5 — 27 May 2013 Product data sheet 1. General description The PCF8574/74A provides general-purpose remote I/O expansion via the two-wire bidirectional I2C-bus serial clock (SCL , serial data (SDA).


    Original     		PCF8574; PCF8574A PCF8574/74A PCF8574 PCF9574 8574ts pcf8574t PCF8574P equivalent TRANSISTOR SMD MARKING CODE p1 pcf8574 Application Note input id pcf8574 c code PCF8574P,112 PCF8574AT PDF

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100 PDF

    c6822

    Abstract: pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603
    Text: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in


    Original     		21X23 91185A558 CY8C21002-24PVXI CY3250-21X23 SSOP56 CY8C21002-24PVXI) XT-PSoC-15-20H-10-01 20-Pin PDCR-9323 121R-32400 c6822 pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603 PDF

    Cu3Sn

    Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
    Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		AN10365 AN10365 Cu3Sn HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 PDF

    Lead Free reflow soldering profile BGA

    Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
    Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		AN10365 AN10365 Lead Free reflow soldering profile BGA HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products PDF

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3 PDF

    Cu3Sn

    Abstract: ipc 610 non-wetting
    Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.


    Original     		AN10365 Cu3Sn ipc 610 non-wetting PDF

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


    Original     		MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint PDF

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint PDF

    48 volt 25 amp smps circuit diagram

    Abstract: SSOP20 LAND PATTERN 12 volt 10 amp smps circuit diagram 48 VOLT 150 AMP smps schematic SMPS 12V 20A circuit for 12 VOLT 2 AMP smps adjustable output smps 12 VOLT 2 AMP smps circuit 20A smps Power Supply Schematic Diagram 1000 WATT smps circuit diagram
    Text: SC1401 High Performance Synchronous Buck Controller with LDO for Portable Power POWER MANAGEMENT Description Features ! ! ! ! ! ! ! ! The synchronous buck regulator is capable of achieving ! The SC1401 is a synchronous buck regulator designed to power the latest generation microprocessors in battery operated systems. The SC1401 may be used to


    Original     		SC1401 SC1401 SSOP-20 48 volt 25 amp smps circuit diagram SSOP20 LAND PATTERN 12 volt 10 amp smps circuit diagram 48 VOLT 150 AMP smps schematic SMPS 12V 20A circuit for 12 VOLT 2 AMP smps adjustable output smps 12 VOLT 2 AMP smps circuit 20A smps Power Supply Schematic Diagram 1000 WATT smps circuit diagram PDF

    transistor compatible 2SK3569

    Abstract: TK12A65D 2SK3569 equivalent tk6a65d equivalent TB-7005 TPCA8019-H TPCA8023-H tk10a60d equivalent TPCA8030-H p 181 Photocoupler
    Text: 2009-3 SYSTEM CATALOG Semiconductors for Power Supplies SEMICONDUCTOR http://www.semicon.toshiba.co.jp/eng AC-Input Switching Power Supply Circuits and Recommended New Product Series ● Secondary rectifier 1. Ultra-high-speed N-channel trench MOSFET U-MOSIII-H Series


    Original     		TLP285/TLP781) TB6818FG/TB6819FG) SCE0024B SCE0024C transistor compatible 2SK3569 TK12A65D 2SK3569 equivalent tk6a65d equivalent TB-7005 TPCA8019-H TPCA8023-H tk10a60d equivalent TPCA8030-H p 181 Photocoupler PDF

    prtr5v0u6s

    Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
    Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years


    Original     		2002/95/EC. PMBTA42 PMEG3005EL PMEG6010EP PMR780SN PTVS12VS1UR PZU13y PMBTA42DS PMEG3005ET PMEG6010ER prtr5v0u6s csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY PDF

    w2 mark 5 pin mosfet smd

    Abstract: Philips SC07 Small-signal Transistors transistor bf 175
    Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


    Original     		PDF

    TRANSISTOR SMD CODE PACKAGE SOT89 52 10A

    Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
    Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


    Original     		PDF

    TRANSISTOR S1A 64 smd

    Abstract: SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030
    Text: Discrete Semiconductors Selection Guide 2010 Diodes, transistors, ESD and signal conditioning devices Excellence in portfolio and performance Diodes Introducing new package technology Page 7 Portable and increasingly smaller end products fuel the race towards more sophisticated functionality in smaller form


    Original     		OT1061 OT1118 PSSI2021SAY PTVS10VP1UP TRANSISTOR S1A 64 smd SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030 PDF