Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT746-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA64
OT746-1
OT746-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA376
OT741-1
OT741-1
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Untitled
Abstract: No abstract text available
Text: Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm A B D SOT740-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C T R e P N M L K J e2 H 1/2 e G F E D C B A ball A1 index area
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LBGA256:
OT740-1
MO-192
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Untitled
Abstract: No abstract text available
Text: Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-2 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-2
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b0245a
Abstract: b0607 PH3055T FT3055 SOLITRON B0501A MJE280H MJE2801K MJE3055K
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 2N5877 SOT7732 SOT7732 SOT7732 SOT7742 SOT7742 SOT7742 SOT7762 ~g:gg~~ 35 40 SOT7012 SOT7475 2N2811 OTL8012 SOT3226 SOT3226 SOT3226 SOT85307 SD+;5~01 45 50 55 60 65 70 SOT85507 SOT85607 SOT85607
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B0207
BOW21A
B0501A
OT7618
FT3055
SSP66A
2N6098
2N6099
b0245a
b0607
PH3055T
SOLITRON
MJE280H
MJE2801K
MJE3055K
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SOT-74
Abstract: SOT74 CDIP16 CDIP-16 philips 23
Text: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP16: ceramic dual in-line package; 16 leads; glass seal SOT74-1 8.25 max seating plane 19.94 max 296 mm Datasheet 27 mm 5.08 max 3.4 2.9 0.51 min 0.32 0.23 1.27 max 2.54 (14x) 0.51 0.38 0.254 M 7.62
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CDIP16:
OT74-1
MBB908
SOT-74
SOT74
CDIP16
CDIP-16
philips 23
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Untitled
Abstract: No abstract text available
Text: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E
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LFBGA72:
OT745-1
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LFBGA64
Abstract: sot744
Text: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E
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LFBGA64:
OT744-1
LFBGA64
sot744
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MO-195
Abstract: sot747
Text: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A
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TFBGA72:
OT747-1
FBGA72:
MO-195
MO-195
sot747
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
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LFBGA72:
OT745-1
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Untitled
Abstract: No abstract text available
Text: Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-3 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-3
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D010
Abstract: sot748
Text: PDF: 2002 Apr 26 Philips Semiconductors Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-1
D010
sot748
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SOT-74
Abstract: SOT74
Text: Philips Semiconductors Package outlines SOT74 16-lead dual in-line; ceramic cerdip Dimensions in mm. August 1994 1
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16-lead
SOT-74
SOT74
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LBGA256
Abstract: MO-192 SOT740-1 sot740
Text: PDF: 2002 Jan 09 Philips Semiconductors Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm A B D SOT740-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C T R e P N M L K
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LBGA256:
OT740-1
MO-192
LBGA256
MO-192
SOT740-1
sot740
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Untitled
Abstract: No abstract text available
Text: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape
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BGA376:
OT741-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-4 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-4
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA72 package SOT745-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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PDF
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LFBGA72
OT745-1
OT745-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT747-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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PDF
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TFBGA72
OT747-1
OT747-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
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PDF
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TFBGA72:
OT747-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm A B D SOT740-2 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b 1/2 e y y1 C ∅w M C T R e P N M L K J e2 H G 1/2 e F E D C B A ball A1 index area
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LBGA256:
OT740-2
MO-192
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Untitled
Abstract: No abstract text available
Text: Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
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LFBGA64:
OT744-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
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TFBGA64:
OT746-1
MO-195
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D010
Abstract: sot748
Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-3 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.
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OT748-3
D010
sot748
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