Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA376
OT741-1
OT741-1
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BGA376
Abstract: MS-034 sot741 MS 034
Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 ∅v M C A B b 1/2 e e AB AA Y W V U T R P N M L K J H G F E
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BGA376:
OT741-1
MS-034
BGA376
MS-034
sot741
MS 034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape
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BGA376:
OT741-1
MS-034
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23X23
Abstract: PBGA376 BGA376 PRBG0376FA-A
Text: JEITA Package Code P-BGA376-23x23-1.00 RENESAS Code PRBG0376FA-A Previous Code 376FHP MASS[Typ.] 2.1g φb A A φx M S AB e A1 ZD e B D y S Index mark Laser mark S ZE E AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10111213141516171819202122
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P-BGA376-23x23-1
PRBG0376FA-A
376FHP
23X23
PBGA376
BGA376
PRBG0376FA-A
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Untitled
Abstract: No abstract text available
Text: Package outline BGA376: plastic ball grid array package; 376 balls SOT1094-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25
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BGA376:
OT1094-1
sot1094-1
MS-034
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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R2A25416SP
Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
Text: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.
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REJ01F0001-0300
R2A25416SP
SH7777
Renesas SH72546
Renesas SH72543
SH72544
car ECU training
sh72543
R5E72546RKBG
SH 72546
Wiring Diagram of NIPPON car center lock system
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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FSQ510 Equivalent
Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Text: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178
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GP-20)
FSQ510 Equivalent
BTA12 6008
bta16 6008
ZIGBEE interface with AVR ATmega16
Precision triac control thermostat
thyristor t 558 f eupec
gw 5819 diode
transistor a564
A564 transistor
BSM25GP120 b2
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