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    Vishay Intertechnologies FSOT7009E500R0KE

    Res Wirewound 500Ohm 10% 70W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7009E500R0KE)
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    Vishay Intertechnologies FSOT7009E25R00JE

    Res Wirewound 25Ohm 5% 70W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7009E25R00JE)
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    Vishay Intertechnologies FSOT7009E10K20JE

    Res Wirewound 10.2KOhm 5% 70W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7009E10K20JE)
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    Vishay Intertechnologies FSOT7009E1K200JE

    Res Wirewound 1.2KOhm 5% 70W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7009E1K200JE)
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    Avnet Americas FSOT7009E1K200JE Bulk 8 Weeks 10
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    Vishay Intertechnologies FSOT7009E500R0JE

    Res Wirewound 500Ohm 5% 70W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT7009E500R0JE)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT7009E500R0JE Bulk 8 Weeks 10
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    SOT70 Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT700-1 NXP Semiconductors Footprint for reflow soldering SOT700-1 Original PDF
    SOT700-1 NXP Semiconductors Plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm Original PDF
    SOT702-1 NXP Semiconductors Plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm Original PDF
    SOT702-1 NXP Semiconductors Footprint for reflow soldering SOT702-1 Original PDF
    SOT702-1_518 NXP Semiconductors Standard product orientation 12NC ending 518 Original PDF
    SOT706-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink Original PDF
    SOT707-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink Original PDF

    SOT70 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    jedec MO 225

    Abstract: VFBGA56
    Text: PDF: 2002 Aug 09 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 b e 1/2 C ∅v M C A B ∅w M C e y1 C y K J H e


    Original     		PDF VFBGA56: OT702-1 MO-225 jedec MO 225 VFBGA56

    sot706

    Abstract: No abstract text available
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v M b e ∅w M AG AD AB Y AE e AC


    Original     		PDF HBGA552: OT706-1 sot706

    SOT70-5

    Abstract: sot705 SOT70
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA480: plastic thermal enhanced ball grid array package; 480 balls; body 33 x 33 x 1.42 mm; heatsink B D SOT705-1 A ball A1 index area A A2 A1 E detail X C e1 e 1/2 ∅v M b e ∅w M AF AE AD AC AB


    Original     		PDF HBGA480: OT705-1 SOT70-5 sot705 SOT70

    sot704

    Abstract: No abstract text available
    Text: PDF: 2002 Nov 22 Philips Semiconductors Package outline HBGA380: plastic thermal enhanced ball grid array package; 380 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT704-1 ball A1 index area A A2 A1 E detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C


    Original     		PDF HBGA380: OT704-1 sot704

    b0245a

    Abstract: b0607 PH3055T FT3055 SOLITRON B0501A MJE280H MJE2801K MJE3055K
    Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 2N5877 SOT7732 SOT7732 SOT7732 SOT7742 SOT7742 SOT7742 SOT7762 ~g:gg~~ 35 40 SOT7012 SOT7475 2N2811 OTL8012 SOT3226 SOT3226 SOT3226 SOT85307 SD+;5~01 45 50 55 60 65 70 SOT85507 SOT85607 SOT85607


    Original     		PDF B0207 BOW21A B0501A OT7618 FT3055 SSP66A 2N6098 2N6099 b0245a b0607 PH3055T SOLITRON MJE280H MJE2801K MJE3055K

    044H11

    Abstract: KT808B 044H10 kt808BM BJG 36 kt808 2s021 B0313 2n1810
    Text: POWER SILICON NPN Item Number Part Number I C 5 10 20 SOT7S09 SOT7S09 2N3714 B0245B B0245B B0245B B0313 2S041 ~~~g~ 25 30 ST28143 2SC1115 2SC1115 OTL3203 SOT3207 SOT3207 SOT3207 2N500S ~~~~n 35 40 2N5S24 2N5730 2N4301 2NS128 BOY91 BOS11 GSDB10008 SOT701S


    Original     		PDF 044H10 KSP1152 KSP1172 OT7A09 OT7S09 2N3714 B0245B 044H11 KT808B kt808BM BJG 36 kt808 2s021 B0313 2n1810

    sot707

    Abstract: No abstract text available
    Text: PDF: 2002 Nov 22 Philips Semiconductors Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C AJ


    Original     		PDF HBGA584: OT707-1 sot707

    HBGA432

    Abstract: SOT70 IEC 292-1 sot703
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT703-1 ball A1 index area A A2 A1 E detail X C e1 e ∅v M b e 1/2 ∅w M AD AC AB AA Y W


    Original     		PDF HBGA432: OT703-1 HBGA432 SOT70 IEC 292-1 sot703

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF Y AE e AC AA W V heatsink U T e2 R P N M L K J H G F E D C B A 1


    Original     		PDF HBGA552: OT706-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF VFBGA56 OT702-1 OT702-1

    LBGA156

    Abstract: MO-192 sot700
    Text: PDF: 2001 Nov 06 Philips Semiconductors Package outline LBGA156: plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm A B D SOT700-1 ball A1 index area A A2 A1 E detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C P N e M L K J H


    Original     		PDF LBGA156: OT700-1 MO-192 LBGA156 MO-192 sot700

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LBGA156 package SOT700-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LBGA156 OT700-1 OT700-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LBGA156: plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm A B D SOT700-1 ball A1 index area A A2 A1 E detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1 index area


    Original     		PDF LBGA156: OT700-1 MO-192

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF AD AB Y V T P M K H F D B AJ AG e AE AC AA W heatsink U e2 R N L


    Original     		PDF HBGA584: OT707-1

    jedec MO 225

    Abstract: VFBGA56
    Text: PDF: 2001 Jun 26 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A2 A E A1 detail X e1 b e C ∅v M C A B ∅w M C 1/2 e y1 C y K J H e


    Original     		PDF VFBGA56: OT702-1 MO-225 jedec MO 225 VFBGA56

    Untitled

    Abstract: No abstract text available
    Text: SOT702-1 Standard product orientation 12NC ending 518 Rev. 01 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT702-1 518 (dry pack)


    Original     		PDF OT702-1 OT702-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 C ∅v M C A B b e ∅w M C 1/2 e y1 C y K J H e G F e2 E D 1/2 e C X B A ball A1 index area


    Original     		PDF VFBGA56: OT702-1 MO-225

    D1192

    Abstract: 2SC3593 BOT93 diode GG 71 RCA1C07 acrian inc diode 2U 66
    Text: POWER SILICON NPN Ie Item Number Part Number I C 5 10 15 20 25 30 40 2S0369Y SOT701S SOT701S SOT701S 2N3920 2N50S4 2SC3255R 2SC3593 2SC3255S Solitron PPC Product PPC Product Sid St Dvcs See Index See Index See Index Mallory Indust Mexi See Index :sanyo Elect


    Original     		PDF OT7A02 OT7B01 OT7602 2N3919 2N3715 PTC116 2S03690 2N5622 D1192 2SC3593 BOT93 diode GG 71 RCA1C07 acrian inc diode 2U 66

    SOT701-1

    Abstract: sot701 MS-034 HBGA420
    Text: PDF: 2001 Nov 15 Philips Semiconductors Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 1.6 mm; heatsink A B D SOT701-1 ball A1 index area A A2 A1 E A4 detail X C e1 e f1 1/2 e ∅v M C A B b y y1 C ∅w M C


    Original     		PDF HBGA420: OT701-1 MS-034 SOT701-1 sot701 MS-034 HBGA420

    SAA7119

    Abstract: saa7154 RSN 309 W 44H SAA7154H SAA7154E SAA7118 An RTCO 7AH SPLPL9 myson mtv048 SAA7154E/V2
    Text: SAA7154E; SAA7154H Multistandard video decoder with comb filter, component input and RGB output Rev. 02 — 6 December 2007 Product data sheet 1. General description The SAA7154E; SAA7154H is a high-quality multistandard video decoder supporting 10-bit Analog-to-Digital Converter ADC , enhanced PAL/NTSC comb filtering, more


    Original     		PDF SAA7154E; SAA7154H SAA7154H 10-bit 24-bit SAA7154E SAA7119 saa7154 RSN 309 W 44H SAA7118 An RTCO 7AH SPLPL9 myson mtv048 SAA7154E/V2

    SOT70 Package

    Abstract: No abstract text available
    Text: SN74LVC1G66ĆQ1 SINGLE BILATERAL ANALOG SWITCH SCES499D − OCTOBER 2003 − REVISED JANUARY 2008 D D D D D D D D DBV or DCK PACKAGE TOP VIEW Qualified for Automotive Applications 1.65-V to 5.5-V VCC Operation Inputs Accept Voltages to 5.5 V High On-Off Output Voltage Ratio


    Original     		PDF SN74LVC1G66Q1 SCES499D SN74LVC1G66 SOT70 Package

    SOT70 Package

    Abstract: 7Z04 MA05B MO-178 NC7SZ04 NC7SZ04L6X NC7SZ04M5X NC7SZ04P5X
    Text: Revised March 2002 NC7SZ04 TinyLogic UHS Inverter General Description Features The NC7SZ04 is a single inverter from Fairchild’s Ultra High Speed Series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static


    Original     		PDF NC7SZ04 NC7SZ04 SOT70 Package 7Z04 MA05B MO-178 NC7SZ04L6X NC7SZ04M5X NC7SZ04P5X

    7Z04

    Abstract: MA05B MO-178 NC7SZ04 NC7SZ04M5 NC7SZ04M5X NC7SZ04P5 NC7SZ04P5X
    Text: Revised June 2000 NC7SZ04 TinyLogic UHS Inverter General Description Features The NC7SZ04 is a single inverter from Fairchild’s Ultra High Speed Series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static


    Original     		PDF NC7SZ04 NC7SZ04 7Z04 MA05B MO-178 NC7SZ04M5 NC7SZ04M5X NC7SZ04P5 NC7SZ04P5X

    Untitled

    Abstract: No abstract text available
    Text: 74AVC16T245 16-bit dual supply translating transceiver with configurable voltage translation; 3-state Rev. 02 — 30 March 2010 Product data sheet 1. General description The 74AVC16T245 is a 16-bit transceiver with bidirectional level voltage translation and


    Original     		PDF 74AVC16T245 16-bit 74AVC16T245 16-bit