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    HBGA432

    Abstract: SOT70 IEC 292-1 sot703
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT703-1 ball A1 index area A A2 A1 E detail X C e1 e ∅v M b e 1/2 ∅w M AD AC AB AA Y W


    Original     		PDF HBGA432: OT703-1 HBGA432 SOT70 IEC 292-1 sot703

    FM20P5X

    Abstract: FM51S3X MAX809MEUR mp3 fm FM50S3X FM75M8 MAX811TEUS FAN 7701 SOT143-4 tcn75-3.3mua
    Text: Temperature Sensors & Supervisory Circuits Product Portfolio October, 2001 Selection Guideation Packages Overview Target Applications Fairchild offers a family of system management products including temperature sensors and microprocessor supervisors that target applications where size and


    Original     		PDF FM20/FM50/FM51 FM803/FM809/FM810 Power247TM, FM20P5X FM51S3X MAX809MEUR mp3 fm FM50S3X FM75M8 MAX811TEUS FAN 7701 SOT143-4 tcn75-3.3mua