Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA1312 package SOT624-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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HBGA1312
OT624-1
OT624-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅w M C AW AU AR AN AL AJ AG
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HBGA1312:
OT624-1
MS-034
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SOT-623
Abstract: k 3683 MS-034
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AK AH AF AD AB Y V T P
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BGA658:
OT623-1
MS-034
SOT-623
k 3683
MS-034
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MS-034
Abstract: sot624
Text: PDF: 2001 Feb 13 Philips Semiconductors Package outline HBGA1312: plastic, heatsink ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm A B D SOT624-1 ball A1 index area A E A2 A1 detail X e1 C v M B b e ∅w M v M A AW AV AU AT AR AP AN AM AL AK AJ
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HBGA1312:
OT624-1
MS-034
MS-034
sot624
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LFBGA180
Abstract: 11-90 MO-151 sot622
Text: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K
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LFBGA180:
OT622-1
MO-151
LFBGA180
11-90
MO-151
sot622
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TFBGA81
Abstract: MO-216 sot627
Text: PDF: 2000 Jun 26 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B e y v C ∅w M b v M A J H G e F e1 E D C B A 1
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TFBGA81:
OT627-1
MO-216
TFBGA81
MO-216
sot627
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HVQFN16
Abstract: SOT629-1 MO-220 sot629
Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A A 1 E c detail X e1 C 1/2 e e 8 y y1 C v M C A B w M C
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HVQFN16:
OT629-1
MO-220
HVQFN16
SOT629-1
MO-220
sot629
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MO-205
Abstract: LFBGA180
Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N
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LFBGA180:
OT622-1
OUT180
MO-205
MO-205
LFBGA180
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LFBGA36
Abstract: No abstract text available
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA36: plastic low profile fine-pitch ball grid array package; 36 balls; body 6 x 6 x 1.05 mm D SOT620-1 A B ball A1 index area A2 A E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e F e E D
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LFBGA36:
OT620-1
LFBGA36
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LFBGA36
Abstract: sot620
Text: PDF: 2000 Jul 13 Philips Semiconductors Package outline LFBGA36: plastic low profile fine-pitch ball grid array package; 36 balls; body 6 x 6 x 1.05 mm D SOT620-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B y y1 C ∅w M b e v M A F E D e1 C e B A
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LFBGA36:
OT620-1
LFBGA36
sot620
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Untitled
Abstract: No abstract text available
Text: Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M K H F D B AJ e AG AE AC AA W U e2 R N
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BGA658:
OT623-1
MS-034
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HVQFN16
Abstract: No abstract text available
Text: PDF: 2000 Oct 03 Philips Semiconductors Package outline HVQFN16: plastic, heatsink very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A4 A E detail X e1 C v M B e 5 y y1 C w M b 8 L v M A 9 4 e e1
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HVQFN16:
OT629-1
MO-220
HVQFN16
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SOT-623
Abstract: MS-034 sot623 MS 034
Text: PDF: 2001 May 16 Philips Semiconductors Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C v M A
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BGA658:
OT623-1
MS-034
SOT-623
MS-034
sot623
MS 034
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA658 package SOT623-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA658
OT623-1
OT623-1
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TFBGA81
Abstract: MO-216
Text: PDF: 2002 Feb 15 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C J H e G F e2 E D C B
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TFBGA81:
OT627-1
MO-216
TFBGA81
MO-216
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MS-034
Abstract: HBGA1312
Text: PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M
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HBGA1312:
OT624-1
MS-034
MS-034
HBGA1312
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HVQFN16
Abstract: MO-220 jedec package MO-220 16 pin
Text: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN16: plastic, heatsink very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A4 A E detail X e1 C 1/2 e e ∅v M C A B b 5 y y1 C ∅w M C
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HVQFN16:
OT629-1
MO-220
HVQFN16
MO-220
jedec package MO-220 16 pin
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Untitled
Abstract: No abstract text available
Text: HV QF N1 6 SOT629-1 HVQFN16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 17 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT629-1
HVQFN16;
001aak603
OT629-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA180
OT622-1
OT622-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A A 1 E c detail X e1 C 1/2 e e 8 y y1 C v M C A B w M C b 5 L 9 4 e e2 Eh 1/2 e 1 12 terminal 1
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HVQFN16:
OT629-1
metal75
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1
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LFBGA180:
OT622-1
OT6221
MO-205
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A E A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C J H e G F e2 E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 X
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TFBGA81:
OT627-1
MO-216
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HVQFN16
Abstract: JESD22-A114 JESD22-A115 JESD78 PCA9531 PCA9554 PCF8574 TSSOP16
Text: PCA9531 8-bit I2C-bus LED dimmer Rev. 06 — 19 February 2009 Product data sheet 1. General description The PCA9531 is an 8-bit I2C-bus and SMBus I/O expander optimized for dimming LEDs in 256 discrete steps for Red/Green/Blue RGB color mixing and back light applications.
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PCA9531
PCA9531
HVQFN16
JESD22-A114
JESD22-A115
JESD78
PCA9554
PCF8574
TSSOP16
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Untitled
Abstract: No abstract text available
Text: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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