SOT622 Search Results

SOT622 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT622-1		NXP Semiconductors	Footprint for reflow soldering SOT622-1		Original	PDF
SOT622-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm		Original	PDF

Catalog Datasheet	MFG & Type	PDF	Document Tags
LFBGA180 Abstract: 11-90 MO-151 sot622 Text: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K	Original	PDF	LFBGA180: OT622-1 MO-151 LFBGA180 11-90 MO-151 sot622
MO-205 Abstract: LFBGA180 Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N	Original	PDF	LFBGA180: OT622-1 OUT180 MO-205 MO-205 LFBGA180
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA180 OT622-1 OT622-1
Untitled Abstract: No abstract text available Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1	Original	PDF	LFBGA180: OT622-1 OT6221 MO-205