TFBGA81
Abstract: MO-216 sot627
Text: PDF: 2000 Jun 26 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B e y v C ∅w M b v M A J H G e F e1 E D C B A 1
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TFBGA81:
OT627-1
MO-216
TFBGA81
MO-216
sot627
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TFBGA81
Abstract: MO-216
Text: PDF: 2002 Feb 15 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C J H e G F e2 E D C B
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PDF
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TFBGA81:
OT627-1
MO-216
TFBGA81
MO-216
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A E A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C J H e G F e2 E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 X
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TFBGA81:
OT627-1
MO-216
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TFBGA81
Abstract: pcb diagram of mini ups system "mini usb connector" footprint
Text: Speed-up your portable data transfers STw8100 low power, high-speed, complete USB-OTG solution The STw8100 from STMicroelectronics is a stand-alone, high-speed USB-OTG chip designed to simply extend the connectivity capabilities of portable devices. The STw8100 provides both the control of the USB protocol
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STw8100
FLSTW81000206
TFBGA81
pcb diagram of mini ups system
"mini usb connector" footprint
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