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    SOT532 Search Results

    SOT532 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT532-1 NXP Semiconductors Footprint for reflow soldering SOT532-1 Original PDF
    SOT532-1 NXP Semiconductors Plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm Original PDF
    SOT532-2 NXP Semiconductors Plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm Original PDF

    SOT532 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G


    Original     		PDF BGA388: OT532-2 MS-034

    MS-034

    Abstract: SOT532-1 BGA388
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y


    Original     		PDF BGA388: OT532-1 MS-034 MS-034 SOT532-1 BGA388

    388 transistor

    Abstract: No abstract text available
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K


    Original     		PDF BGA388: OT532-1 388 transistor

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AF AD AB Y V T P M K H F D B AE e AC AA W U R e2 N L 1/2 e J G


    Original     		PDF BGA388: OT532-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA388 package SOT532-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA388 OT532-1 OT532-1

    sot532

    Abstract: BGA388
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G


    Original     		PDF BGA388: OT532-1 sot532 BGA388

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316

    pnx7100

    Abstract: PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1
    Text: INTEGRATED CIRCUITS DATA SHEET PNX7100 MPEG AVG CODEC Objective specification File under Integrated Circuits, IC02 2002 Feb 28 Philips Semiconductors Objective specification MPEG AVG CODEC PNX7100 FEATURES Interfaces • 32-bit 133 MHz SDRAM interface supports up to two


    Original     		PDF PNX7100 32-bit 16-bit SCA74 753504/01/pp12 pnx7100 PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package