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    BGA388 Price and Stock

    LSI Corporation APP1001APBGA388-DB

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    Bristol Electronics APP1001APBGA388-DB 76
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    ZF Micro Solutions, Inc. ZFX86BGA388-C-NZ

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    Bristol Electronics ZFX86BGA388-C-NZ 24
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    LSI Corporation L-APP1001APBGA388

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    Bristol Electronics L-APP1001APBGA388 17
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    ZF Micro Solutions, Inc. ZFX86BGA388E100

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    Bristol Electronics ZFX86BGA388E100 6
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    Others ZFX86BGA388-I-NZ

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    Chip 1 Exchange ZFX86BGA388-I-NZ 8
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    BGA388 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA388 NXP Semiconductors Footprint for reflow soldering Original PDF

    BGA388 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G


    Original     		PDF BGA388: OT532-2 MS-034

    sot582

    Abstract: BGA388
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 2.15 mm SOT582-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA


    Original     		PDF BGA388: OT582-1 sot582 BGA388

    MS-034

    Abstract: SOT532-1 BGA388
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y


    Original     		PDF BGA388: OT532-1 MS-034 MS-034 SOT532-1 BGA388

    388 transistor

    Abstract: No abstract text available
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K


    Original     		PDF BGA388: OT532-1 388 transistor

    0.4mm pitch BGA

    Abstract: pitch 0.4mm BGA 27mmx27mm SF-BGA388B-B-11
    Text: C Package Code: BGA388B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm [0.020"] dia pads


    Original     		PDF BGA388B FR4/G10 26X26 SF-BGA388B-B-11 0.4mm pitch BGA pitch 0.4mm BGA 27mmx27mm

    PBGA388

    Abstract: No abstract text available
    Text: P-BGA388-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF P-BGA388-3535-1 PBGA388

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AF AD AB Y V T P M K H F D B AE e AC AA W U R e2 N L 1/2 e J G


    Original     		PDF BGA388: OT532-1 MS-034

    SF-BGA388A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA388A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA388A FR4/G10 SF-BGA388A-B-11

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA388 package SOT532-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA388 OT532-1 OT532-1

    sot532

    Abstract: BGA388
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G


    Original     		PDF BGA388: OT532-1 sot532 BGA388

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316

    amd elan 520

    Abstract: smd transistor 857 data transistor SMD p12 EC2500ETT-8 u47 K SMD SOT23 transistor MARK Y2 ISL-8032VT PALCE22V10H-5JC ISL-8032
    Text: Élan SC520 Microcontroller Customer Development Platform User’s Manual Order #22450A Élan™SC520 Microcontroller Customer Development Platform User’s Manual Copyright 1999 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. "AMD" products. AMD


    Original     		PDF lanTMSC520 2450A lanSC520 amd elan 520 smd transistor 857 data transistor SMD p12 EC2500ETT-8 u47 K SMD SOT23 transistor MARK Y2 ISL-8032VT PALCE22V10H-5JC ISL-8032

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    IC354

    Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
    Text: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8


    Original     		PDF 300mil 400mil 600mil 750mil IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC354 IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4

    au1550-500mbd

    Abstract: au1100-400mbd AU1100-333MBC AGXD466EEXD0BD au1550 AGXD533AAXF0CD ElanSC520-133AD AU1100-333MBD AU1100-333MBF AM79C973BVD
    Text: Marketing Information Date: Q404 Update Products: All PCSG Products Originator: PCSG Business Operations Type: Product Update PCSG Lead-Free Pb-Free Product Status & RoHS AMD is aware that the European Union Directive entitled “Restriction on the use of certain Hazardous


    Original     		PDF 2002/95/EC, OGF453 ANXL1250FYC3S ANXL1250FYC3M ANXL1500FGC3S ANXL1500FGC3M ANXS1750FXC3S ANXS1750FXC3M au1550-500mbd au1100-400mbd AU1100-333MBC AGXD466EEXD0BD au1550 AGXD533AAXF0CD ElanSC520-133AD AU1100-333MBD AU1100-333MBF AM79C973BVD

    pnx7100

    Abstract: PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1
    Text: INTEGRATED CIRCUITS DATA SHEET PNX7100 MPEG AVG CODEC Objective specification File under Integrated Circuits, IC02 2002 Feb 28 Philips Semiconductors Objective specification MPEG AVG CODEC PNX7100 FEATURES Interfaces • 32-bit 133 MHz SDRAM interface supports up to two


    Original     		PDF PNX7100 32-bit 16-bit SCA74 753504/01/pp12 pnx7100 PR3940 karaoke video ac3 dts encoder audio encoder mpeg bt.656 to CVBS small size karaoke mixer circuit diagram MIPS16 philips home audio systems audio encoder mpeg 1

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    ARM926EJ-STM

    Abstract: IF VIDEO DEMODULATOR i2c 256QAM ARM926EJ-S LC74188BG video scaler MPEG2 pal 256-MBIT STB tuner half-nim
    Text: CATV数字电视机用内置DVB-C解调的单片解码 LC74188BG 采用中国第一个* 无卡CA系统（长城CA）! 高性价比STB成为现实 ! * 2008年3月 拥有50余年历史的三洋半导体公司，致力于电视机IC的开发已超过25年。


    Original     		PDF LC74188BG 50IC25 ICICDVB-C90nm LC74188BG2007STB LC74188BG 112X98 B-308, 12Xiang 256QAM ARM926EJ-STM IF VIDEO DEMODULATOR i2c 256QAM ARM926EJ-S video scaler MPEG2 pal 256-MBIT STB tuner half-nim

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50

    Transistor morocco 9740

    Abstract: Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS 388BGA
    Text: RELIABILITY REPORT Q98001 SICL BUSINESS UNIT REPORT NUMBER : Q98001 QUALIFICATION TYPE : NEW DEVICE - NEW PACKAGE DEVICE : STPC Client SIP101 SALES TYPES : STPCD0166BTC3 - STPCD0175BTC3 TECHNICAL CODE : MDBT*CHDT1BR PROCESS : HCMOS6 - CROLLES FAB LOCATION


    Original     		PDF Q98001 SIP101) STPCD0166BTC3 STPCD0175BTC3 388BGA Transistor morocco 9740 Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


    Original     		PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire