sot751
Abstract: No abstract text available
Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J
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LFBGA80:
OT751-1
sot751
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA80
OT751-2
OT751-2
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sot751
Abstract: No abstract text available
Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A
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LFBGA80:
OT751-2
sot751
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA80
OT751-1
OT751-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2
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LFBGA80:
OT751-2
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Abstract: No abstract text available
Text: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e
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OT751-1
LFBGA80:
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H
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OT751-1
LFBGA80:
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MTC20166
Abstract: ST70138T mtc-20174 MTK20170 MTC20174-TQ-C1 TR-048 MTC20174 ST20138 ST70137 ST70138
Text: ST20138 Unicorn II PCI/USB ADSL CHIPSET: ST70138 + MTC20174 FOR ULTRA LOW COST ADSL MODEM DATA BRIEF 1 DESCRIPTION The Unicorn II chipset is designed to simplify the development of low-cost ADSL CPE modems for Windows, Mac and Linux based environments and
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ST20138
ST70138
MTC20174
MTC20166
ST70138T
mtc-20174
MTK20170
MTC20174-TQ-C1
TR-048
MTC20174
ST20138
ST70137
ST70138
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shadow detector circuits
Abstract: 20532 C165UTAH PEB20534 SAB82532 infineon SAB 82532 Infineon Design Link
Text: P R O D U C T B R I E F 3.3 V, 2 Channel, Serial Optimized Communications Controller, with µP Interface Building on Infineon's expertise, the SEROCCO satisfies a system designer's need for a multiprotocol serial communications controller that operates at 3.3 V. Additionally, the SEROCCO
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B119-H7670-X-X-7600
shadow detector circuits
20532
C165UTAH
PEB20534
SAB82532
infineon SAB 82532
Infineon Design Link
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PCF87752
Abstract: PCF87750 Ericsson pbc PCF87755 BGB100 BGB101 BGB121 Bluetooth RSSI
Text: PCF87752 Blueberry DATA 2nd generation Bluetooth™ baseband controller optimized for hosted applications The PCF87752 is the most highly-integrated single-chip baseband solution designed for Bluetooth* applications. Known as ‘Blueberry* DATA,’ it contains everything required to provide
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PCF87752
PCF87752
PCF87750
Ericsson pbc
PCF87755
BGB100
BGB101
BGB121
Bluetooth RSSI
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MTC20166
Abstract: ADSL2 Modem circuit diagram MTC20174 Diagram of ADSL CPE Analog Front End TQFP144 DIMENSION ST20138 ST70137 ST70138 ST70138B ST70138T
Text: ST20138 Unicorn II USB ADSL modem chipset: ST70138 + MTC20174 for ultra-low-BOM ADSL modem designs Data Brief Description The Unicorn II chipset consists of the ST70138 digital chip and the MTC20174 analog front end with integrated line driver. Performance, cost and time to market are key
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ST20138
ST70138
MTC20174
MTC20174
ST70138
LBGA80
TQFP144.
ST70138T,
TQ144,
MTC20166
ADSL2 Modem circuit diagram
Diagram of ADSL CPE Analog Front End
TQFP144 DIMENSION
ST20138
ST70137
ST70138B
ST70138T
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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circuit diagram adsl modem board
Abstract: mtc-2016
Text: ST20138 Unicorn II USB ADSL modem chipset: ST70138 + MTC20174 for ultra-low-BOM ADSL modem designs Data Brief Description The Unicorn II chipset consists of the ST70138 digital chip and the MTC20174 analog front end with integrated line driver. Performance, cost and time to market are key
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ST20138
ST70138
MTC20174
circuit diagram adsl modem board
mtc-2016
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