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    Skynet Electronics SNP-B158

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    FeNi42

    Abstract: whisker TSOP-II-54 "leadframe material" DIP
    Text: 06-June-03 Back-Up Block 2 Whisker on NiFe Whisker on NiFe 06-June-03 Ambient storage tin plated FeNi42 length of longest whisker in µm 10 TSOPII-54 FeNi42 ambient storage 8 3,7 µm Sn 6,6 µm Sn 9,5 µm Sn 6 11,7 µm Sn 14,7 µm Sn 4 2 time in days 100


    Original     		PDF 06-June-03 FeNi42 TSOPII-54 FeNi42) FeNi42 whisker TSOP-II-54 "leadframe material" DIP

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    Cu6Sn5

    Abstract: 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L
    Text: AN2035 Application note Control of whisker growth in Tin alloy coatings 1 Nature of whiskers and whisker mitigation techniques Some metals show an unusual metallurgical phenomenon: a single, microscopic crystal filament of the metal grows “spontaneously” from its surface. The metals concerned include


    Original     		PDF AN2035 Cu6Sn5 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L

    FeNi42

    Abstract: Sb2O3 leadframe
    Text: Material Composition Specification SOT-523 Case Available with Pb lead -free plating* Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.6mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+/-10%


    Original     		PDF OT-523 FeNi42 SnPb15 11-February FeNi42 Sb2O3 leadframe