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    QFP SHIPPING TRAYS Search Results

    QFP SHIPPING TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP SHIPPING TRAYS Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    QFP Shipping Trays Altera CUSTOMER ADVISORY Alternate QFP Shipping Trays Original PDF

    QFP SHIPPING TRAYS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    Kostat tray

    Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
    Text: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by


    Original     		PDF 14x20mm 28x28mm 32x32mm ND-1420-2 ND-2828-3 ND-3232-3 KS-8202* KS-8201* Kostat tray Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201

    ND-1420-2

    Abstract: QFP JEDEC tray 304-Pin 304 QFP
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin ND-1420-2 QFP JEDEC tray 304 QFP

    QFP Shipping Trays

    Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin QFP Shipping Trays ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray

    QFP JEDEC tray

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin QFP JEDEC tray

    TO-220 JEDEC

    Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin TO-220 JEDEC ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays

    QFP JEDEC tray

    Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
    Text: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin QFP JEDEC tray ND-3232-3 ND-2828-3 304-pin dimensions

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    IC51-0804-394

    Abstract: yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP
    Text: FIFO Surface-Mount Package Information First-In, First-Out Technology Tom Jackson and Mary Helmick Advanced System Logic – Semiconductor Group SSPA001A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		PDF SSPA001A IC51-0804-394 yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    SZZA002

    Abstract: 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91
    Text: Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits SZZA002 April 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		PDF SZZA002 B827-92, B825-92, B810-91, ANSI/EIA-638, SZZA002 2162 20-pin qfp QFP Shipping Trays ic shelf life 20-PIN EIA-638 B825-92 B810-91

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


    Original     		PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    ASE QFP

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical


    OCR Scan     		PDF 304-pin ASE QFP

    removal tool from EPLD socket

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical


    OCR Scan     		PDF 304pin removal tool from EPLD socket

    Untitled

    Abstract: No abstract text available
    Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


    OCR Scan     		PDF J4444444444444444444444444444

    fp1320

    Abstract: No abstract text available
    Text: Guidelines for Handling J-Lead & QFP Devices Ju n e 1996, ver. 2 Introduction Application Note 71 S u rfa c e -m o u n t J-lead a n d q u a d flat p ac k Q FP d ev ic e s a re c u rre n tly in h ig h d e m a n d . A ll d ev ic e p a c k a g e s re q u ire p ro te c tio n d u rin g


    OCR Scan     		PDF