CA-QFE64SD-L-N-T-01
Abstract: MOD-518
Text: 2.350" 5 1.975" 1 0.100" Top View 2 0.285" assembled Surface-mountable leadless -L foot. Side View 0.443" 1 Target Board 64 Position QFP Land Pattern 2 (QFE64SD Foot Print Spec) 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad.
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QFE64SD
FR4/G10
finish10µ
CA-QFE64SD-L-N-T-01
MOD-518
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qfp 64 land pattern
Abstract: pal 007 PAL 007 a SF-QFE64SD-L-01
Text: 0.8mm typ. 0.095" typ. Top View SA 0.720" 0.530" typ. typ. 0.018" typ. 0.780" 0.780" 1 Side View 0.300" SK-MGA8/64A-01 2 0.130"Assembled SF-QFE64SD-L-01 0.440" Target Board 64 Position QFP Land Pattern QFE64SD Foot Print Spec 1 Material: 0.0625" ± 0.007" Fr4/G10
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SK-MGA8/64A-01
SF-QFE64SD-L-01
QFE64SD
Fr4/G10
PC-QFP64SC/SD-L-S-01
P4SD-L-01
qfp 64 land pattern
pal 007
PAL 007 a
SF-QFE64SD-L-01
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PDF
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qfp 64 0.5 mm pitch land pattern
Abstract: CA-QFE64SD-L-Z-T-01 qfp 64 land pattern
Text: 2.350" 5 1.975" 1 0.100" Top View 2 1.078" assembled 0.285" assembled Surface-mountable leadless -L foot. Side View 0.443" 1 Target Board 64 Position QFP Land Pattern 2 (QFE64SD Foot Print Spec) 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad.
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QFE64SD
FR4/G10
finish10µ
CA-QFE64SD-L-Z-T-01
qfp 64 0.5 mm pitch land pattern
qfp 64 land pattern
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PDF
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R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.
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PC-ZIP/DIP20-01
PC-ZIP/DIP28-01
PC-ZIP/DIP28-02
PC-ZIP20/DIP18-01
R50-E2Y2-24
sk 8085
84 pin plcc ic base
Aromat TQ2E-24V
UT1553BCRTM
INTEL 486 dx2
soic40
plcc44 pinout numbers
XE4006E
68hc001
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PDF
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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PDF
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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2101dm
Abstract: qfp 64 land pattern
Text: Emulates QFP package: 14.0mm body 16.4mm/16.0mm tip to tip Top View 0.80mm pitch 15.37mm [0.605"] 13.84mm [0.545"] 15.37mm [0.605"] 0.47mm [0.018"] 1.27mm [0.050"] Side View 2 6.35mm [0.250"] 1.59mm [0.063"] 1 A 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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4mm/16
FR4/G10
SF-QFE64S
-L-01
SF-QFE064SA-L-01
2101dm
qfp 64 land pattern
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PDF
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1.27mm pitch zif socket 3M 21X21
Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •
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SK-MGAxx/xxxx-03
SK-MGAxx/xxxx-01
SK-MGAxx/xxxx-02
MGA10/100A-
1.27mm pitch zif socket 3M 21X21
1155 lga socket pins
17X17* BGA 289
1155 lga socket
PGA zif socket 289
amp bga 25x25
BGA169C
TEXTOOL 15x15 pga
Am29040
BGA432
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PDF
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CA-QFE64SD-L-Z-01
Abstract: qfp 64 0.5 mm pitch land pattern
Text: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in error, please return to IRONWOOD ELECTRONICS, INC. at the address listed below.
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QFE64SD
FR4/G10
finish10µ
CA-QFE64SD-L-Z-01
CA-QFE064SD-L-Z-01
qfp 64 0.5 mm pitch land pattern
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PDF
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SF-PLCC84-J-01
Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.
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SK-UGA12/48A-01
SK-MGA12/48A-01
SK-MGA10/48A-01
SK-MGA13/50B-01
SK-MGA12/56A-01
SK-MGA14/56A-01
SK-MGA12/56B-01
SF-PLCC84-J-01
PL-PLCC68-S-01
SO8A
SF-PLCC44-J-01
SF-PLCC28-J-01
SF-QFE128SD-K-01
PL-PLCC68-T-01
sf 128 transistor
SF 127
PLCC32 through hole socket
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PDF
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SF-QFE64RB-L-01
Abstract: No abstract text available
Text: see Detail A 0.635" 0.535" 0.770" 0.870" 0.050" typ. 0.018"±0.001" dia. 2 0.250" 1 1.0mm pitch Detail A 0.050" 0.020" 1 2 0.0156" dia. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel (min.).
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FR4/G10
SF-QFE64RB-L-01
SF-QFE064RB-L-01
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QFN-64 footprint
Abstract: No abstract text available
Text: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •
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DS51194Q
o-3-572-9526
DS51194Q-page
QFN-64 footprint
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FR4 substrate
Abstract: CA-QFE64SB-L-S-01 SF-QFE64SB-L-01
Text: 0.8mm typ. 0.095" typ. 0.018" typ. 0.720" Adaptor Accommodates and emulates the following package: 0.530" 14.0mm 0.8mm 17.2mm 0.530" Top View not to scale with drawing 0.720" 0.780" 0.107" 0.295" 1 0.232" 2 0.550" 0.390 (plugged) 3 1 0.250" 0.8mm pitch Side View
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FR4/G10
SF-QFE64SB-L-01
CA-QFE64SB-L-S-01
CA-QFE064SB-L-S-01
FR4 substrate
SF-QFE64SB-L-01
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DS51140
Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
Text: Transition Socket Specification 2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •
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DS51194R
DS51194R-page
DS51140
PIC32
PICC-18
XLT28QFN4
DS51298
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PDF
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0510 land pattern
Abstract: No abstract text available
Text: 0.510" 0.428" Bottom View 0.018" 0.050" 2 0.250" Side View 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Description: QFP surface mount emulator foot (leadless)
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FR4/G10
SF-QFE052SB-L-01
SF-QFE052-L-01
0510 land pattern
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PDF
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for
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12X12mm.
FR4/G10
PA-PGA181-02W
PA-SO42-S-01
actel 14100
BGA169C
PA-PGA68-01
ax 6001 mp3
PA-QIP90-01
PA-PLCC84-02
intel 82310
PA-PGA301-01
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PDF
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2029M
Abstract: No abstract text available
Text: 25.4mm [1.000"] SMT PAD DETAIL 0.020" 0.100" 1.00mm pitch QFP pin 1 20.29mm [0.799"] 30.48mm [1.200"] 25.37mm [0.999"] c 1992 I.E. 15.21mm [0.599"] -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 20.29mm [0.799"] 1 3.11mm 6.34mm [0.123"] [0.250"] 2 12.88mm
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FR4/G10
SB-PGA12/64B-01
PA-QFE064R-P-S-01
2029M
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PDF
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SF-QFE64RD-L-01
Abstract: qfp land pattern
Text: 0.930" 0.695" 1.0 mm Top View 0.018" 0.050" 2 0.250" 1 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . compatible
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FR4/G10
SF-QFE64RD-L-01
qfp land pattern
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PDF
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Untitled
Abstract: No abstract text available
Text: 0.930" 0.695" Top View 1.0 mm 0.018" 0.050" 2 0.250" 1 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . compatible
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FR4/G10
SF-QFE64RA-L-01
452-8aterial.
SF-QFE64RD-L-01
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PDF
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DM 0565
Abstract: SF-QFE64RC-L-01
Text: see Detail A 0.665" 0.565" 0.800" 0.900" 0.050" typ. 0.018"±0.001" dia. 2 0.250" 1 1.0mm pitch Detail A 0.050" 0.020" 1 2 0.0156" dia. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel (min.).
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FR4/G10
SF-QFE64RC-L-01
SF-QFE064RC-L-01
DM 0565
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PDF
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tqfp 64 pcb land pattern
Abstract: TQFP64 land package qfp 64 land pattern qfp land pattern
Text: 35.56mm [1.400"] 13.00mm [0.512"] 8.94mm [0.352"] C5 QFP pin 1 SSI B1-PLCC 27.94mm [1.100"] 1 7.80mm [0.307"] 2 0.50mm typ. [0.020"] 1 C1 2 1 C2 2 1 2 1 C3 2 C4 Top View NOTE: Device specific pin mapping. See PC-TQFP/PL68-P-01 Map document for details 1 1.59mm
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PC-TQFP/PL68-P-01
FR4/G10
PC-TQFP64/PL68-P-01
tqfp 64 pcb land pattern
TQFP64 land package
qfp 64 land pattern
qfp land pattern
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PDF
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FR4 substrate
Abstract: CA-QFE64SB-M-S-01
Text: 0.780" 0.018" typ. 0.720" 0.8mm typ. Top View 0.095" typ. 1 3 0.300" 2 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.125"±0.007" FR4/G10 or equivalent high temp material. Non-clad
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FR4/G10
finish10µ
CA-QFE64SB-M-S-01
FR4 substrate
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CA-QFE64S-M-S-01
Abstract: No abstract text available
Text: 0.780" 0.018" typ. 0.720" 0.530" 0.8mm typ. 0.095" typ. Top View 0.720" 0.780" 1 0.300" 3 0.237" Side View 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.125"±0.007" FR4/G10 or equivalent high
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FR4/G10
finish10µ
CA-QFE64S-M-S-01
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PHD64
Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle
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100MHz
PHD64
land pattern for vsop 8 pins
land pattern for vsop
DCA56
PFC80
PZT10
DED28
DFD64
DAP38
PWD14
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PDF
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