PA-PGA85-03
Abstract: No abstract text available
Text: 0.300" 1.100" 0.200" 0.100" typ. 1.500" Top View Bottom View only male pins shown for drawing clarity -03W version (3 level, 0.025" Sqr. WW pin) 0.100" 3 0.507" 0.165" 0.295" 2 0.700" 1 0.020" dia. typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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FR4/G10
finish10µ
nish10µ
PA-PGA85-03
PA-PGA085-03
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PGA zif socket
Abstract: PA-PGA108-03-Z
Text: 1.783" 1.600" 2.096" 1.800" 1.800" Top View 0.100" typ. 0.300" typ. Bottom View only male pins shown for drawing clarity 1 0.742" PA-PGA108-03Z Side View 3 0.020" dia.typ. 1.146" 0.025" sqr. PA-PGA108-03ZW Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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PDF
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PA-PGA108-03Z
PA-PGA108-03ZW
FR4/G10
finish10µ
PA-PGA108-03Z
PGA zif socket
PA-PGA108-03-Z
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PA-DIP28-CV-01
Abstract: No abstract text available
Text: 0.346" 28 15 0.600" 1 1 1.172" 14 3 2 0.132" Side View 0.100" typ. 0.020"±0.001" dia. 0.165" 0.050" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 0.100" End View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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PDF
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FR4/G10
finish10µ
PA-DIP28-CV-01
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PA-PGA192-01
Abstract: No abstract text available
Text: 1.800" 0.300" typ. 0.100" typ. 0.100" typ 2.400" Bottom View only male pins shown for drawing clarity Top View -01W version (3 level, 0.025" Sqr. WW pin) 1 3 0.297" 0.124" 2 0.700" 0.020" dia. typ. 0.507" Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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Original
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PDF
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FR4/G10View
finish10µ
termh10µ
PA-PGA192-01
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PA-PGA176-02
Abstract: No abstract text available
Text: 0.300" typ. 2.200" 0.100" typ. 2.200" Top View Bottom View only male pins shown for drawing clarity -02W version (3 level, 0.025" Sqr. WW pin) 1 2 0.297" 0.507" 0.124" 0.700" 3 0.020" dia. typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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Original
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PDF
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FR4/G10View
finish10µ
PA-PGA176-02
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Untitled
Abstract: No abstract text available
Text: 0.650" 0.100" typ. 0.750" 1 3 0.421" 4 0.207" 0.050" typ. 0.472" 1 3 4 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PDF
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FR4/G10
finish10µ
PC-PGA/PLCC32-01
PC-PGA/PLCC032-01
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DIP52
Abstract: C1494
Text: Top View 2.600" 1 2 3 0.900" Side View Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact
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FR4/G10
finish10µ
C1494
PC-PLCC/DIP52-01
C1494
DIP52
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PA-QFE160SC-C-N-01
Abstract: No abstract text available
Text: 2.000" Socket holes 0.5 mm pitch 2.295" 0.100" pitch typ. 1 0.250" 3 0.128" 0.018"±0.002" typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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PDF
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FR4/G10
finish10µ
20X23
PA-QFE160SC-C-N-01
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SOIC32
Abstract: No abstract text available
Text: SA P1699 1.600" 0.400" Top View 1 0.100" typ. 3 0.291" 0.020" square typ. 0.140" 0.050" typ. Side View 5 0.120" 0.800" 0.316" 1 3 5 Description: PACKAGE CONVERTOR 32 position Dip female sockets to male soic surface mount pins. Pin assignment; 1:1. PC-DIP/SOIC32-05 Drawing
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P1699
PC-DIP/SOIC32-05
FR4/G10
finish10µ
mate32-05
SOIC32
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PA-MLF20C-P-Z-01
Abstract: No abstract text available
Text: 17mm [0.669"] 2.19mm [0.086"] 0.83mm [0.032"] 3.84mm x 3.84mm thermal /GND pad 7.54mm [0.297"] 0.9mm [0.035"] SMT Pad Detail 0.42mm -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 1.06mm 27.2mm [1.071"] 0.65mm 17.78mm [0.672"] 12.88mm [0.523"] 6.36mm [0.250"]
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PA-MLF20C-P-Z-01
PA-MLF20C-P-ZNC.
finish10µ
FR4/G10
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SF-QFE80SD-L-01
Abstract: No abstract text available
Text: 0.620" top and bottom pad width only see side view for side pad width 0.017" typ. 0.620" 0.540" Top View 0.050" pitch typ. 0.018" dia. typ. 2 0.250" 1 Side View 0.156" typ. 0.65 mm pitch typ. B A compatible target board land dimensions A< 0.570" B> 0.670"
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PDF
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FR4/G10
finish10µ
SF-QFE80SD-L-01
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CA-QFE100SC-L-S-T-03
Abstract: No abstract text available
Text: 0.670" 0.100" 1.150" 0.550" Top View 1.550" Side View 1 0.535" 3 0.635" Plugged 2 0.250" 0.5 mm 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"
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PDF
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FR4/G10
finish10µ
CA-QFE100SC-L-S-T-03
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c1869
Abstract: sf 1020 ZIF pga 84
Text: 2.400" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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PDF
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FR4/G10
finish10µ
SF-QFJ84SE-L-01
C1869
PC-PGA/QFP-1020-M-Z-T-02
c1869
sf 1020
ZIF pga 84
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PA-MLF64A-P-Z-01
Abstract: No abstract text available
Text: 27mm [1.063"] SMT Pad Detail 0.28mm 0.79mm [0.031"] 0.69mm 5.63mm [0.222"] 3.34mm [0.131"] 7.58mm x 7.58mm thermal /GND pad 0.79mm [0.031"] 21.9mm [0.862"] 0.5mm 9.36mm [0.369"] Top View -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 7.98mm [0.314"]
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PDF
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FR4/G10
finish10µ
PA-MLF64A-P-Z-01
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PA-PGA52-03
Abstract: No abstract text available
Text: 0.600" 0.900" 0.100" typ. 2.600" 1 Top View Bottom View Only male pins shown for drawing clarity 0.173" 0.297" -03W version (3 level, 0.025" Sqr. WW pin) 3 2 0.020" dia.typ. 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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PDF
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FR4/G10
finish10µ
PA-PGA52-03
PA-PGA052-03
PA-PGA52-03
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PA-ZIP20-01
Abstract: No abstract text available
Text: 0.050" 0.050" 0.100" 0.850" 1 0.050" 0.100" 0.300" Top View 0.400" 0.173" 0.297" 2 Side View 3 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; shell finish- 10µ" Gold over 50µ" Nickel min. . Contact
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FR4/G10
finish10µ
Adaptor-20
PA-ZIP20-01
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SOIC-08
Abstract: SOIC08 BOX21151
Text: RoHS COMPLIANT 0.400" 1 0.400" 0.100" typ. 1 Adapter PCB - Substrate: 2.38mm ±0.18mm [0.094" ±0.007"] per IPC 4101/21, silver surface finish. 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PDF
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finish10µ
PC-DIP/SOIC08-03F
BOX21151
SOIC-08
SOIC08
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DIP14
Abstract: DIP-14
Text: 0.700" 0.200" 0.025" 0.088" 0.400" 0.125" 0.325" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)
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Original
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PDF
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finish10µ
FR4/G10
PC-SOIC/DIP14-01
PC-SOIC/DIP14-01W
PC-SOR/DIP14-01
PC-SOIC/DIP14-01
DIP14
DIP-14
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SOIC20
Abstract: No abstract text available
Text: PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in error, please return
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FR4/G10
finish10µ
PC-DIP/SOIC20-07
SOIC20
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CA-SO28U-Z-M-T-01
Abstract: No abstract text available
Text: 2.54mm [0.100"] Top View 2,1 4,3 6,5 8,7 10,9 12,11 14,13 1 28 14 15 27,28 25,26 23,24 17.78mm 21,22 [0.700"] 19,20 17,18 15,16 35.56mm [1.400"] 3 Side View 2 1 1 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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PDF
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FR4/G10
finish10µ
SF-SO28U-F-01
CA-SO28U-Z-M-T-01
CA-SO28U-Z-M-T-01Dwg
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PA-PGA121-01
Abstract: No abstract text available
Text: 1.300" 0.300" typ. 0.100" typ. 0.100" typ 1.400" Bottom View only male pins shown for drawing clarity Top View -01W version (3 level, 0.025" Sqr. WW pin) 1 0.507" 0.297" 0.124" 0.020" dia. typ. 0.700" 3 2 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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Original
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PDF
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FR4/G10View
finish10µ
PA-PGA121-01
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PA-PGA132-03
Abstract: No abstract text available
Text: 1.400" 0.300" typ. 0.100" typ. 0.100" typ. 1.700" Top View Bottom View only male pins shown for drawing clarity -03W version (3 level, 0.025" Sqr. WW pin) 0.507" 0.700" 1 3 0.297" 0.124" 0.020" dia. typ. Side View 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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Original
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PDF
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FR4/G10View
finish10µ
tesh10µ
PA-PGA132-03
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SF-QFE100SC-L-01
Abstract: No abstract text available
Text: 3 0.100 typ. 1.400 Top View 1.400 0.321 3 1 0.421" Plugged 2 0.250 1 Side View 0.5mm pitch 0.600 0.550 Bottom View (emulator foot only) 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" gold over 50µ" nickel (min.).
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Original
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PDF
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FR4/G10
finish10µ
SF-QFE100SC-L-01.
PC-PGA/QFP-80C186EC-L-03
SF-QFE100SC-L-01
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motorola 747
Abstract: 65516
Text: 1.172" 1 Top View 1.172" Side View 0.747" assembled 0.685" 0.175" 3 0.018" dia.typ. 0.050" typ. 2 1 2 0.605" 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"
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Original
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PDF
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FR4/G10
finish10µ
PC-PLCC/QFP-65516-01
motorola 747
65516
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