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    TE Connectivity DBA 74H 37-0 PDC-A5664

    DBA 74H 37-0 PDC-A5664
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    Interstate Connecting Components DBA 74H 37-0 PDC-A5664
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    PHD64

    Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
    Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle


    Original     		PDF 100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14

    SLMA002

    Abstract: "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004
    Text: Application Report SLMA002E – November 1997 – Revised January 2010 PowerPAD Thermally Enhanced Package Steven Kummerl. ABSTRACT


    Original     		PDF SLMA002E SLMA002 "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004