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    PGA PACKAGE WEIGHT Search Results

    PGA PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PGA PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    O28 Package

    Abstract: No abstract text available
    Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed


    Original     		PDF WS128K32-15XX 128Kx32 66-pin, 128Kx32; 256Kx16 512Kx8 WS128K32-XG2X WS128K32-XHX 128Kx32 O28 Package

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS1M32-XXX 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply • 84 lead, 28mm CQFP, Package 511 Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)*


    Original     		PDF 1Mx32 512Kx32, 2Mx16 WS1M32-XXX WS1M32-XH2X* WS1M32-XG3X I/O10 512Kx32

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS512K32V-XXX ADVANCED* 512Kx32 SRAM 3.3V MODULE FEATURES Access Times of 70, 85, 100, 120ns TTL Compatible Inputs and Outputs Packaging Low Voltage Operation: • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401


    Original     		PDF 512Kx32 120ns 66-pin, 512Kx32; 1024Kx16 WS512K32V-XXX WS512K32V-XG2TX WS512K32V-XHX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic


    Original     		PDF WS512K32V-XXX 512Kx32 66-pin, 512Kx32; 2x512Kx16 4x512Kx8 WS512K32V-XG2UX WS512K32NV-XH1X 512Kx32

    WS512K32V-XXX

    Abstract: WS512K32V-XG2UX
    Text: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic


    Original     		PDF WS512K32V-XXX 512Kx32 66-pin, 512Kx32; 2x512Kx16 4x512Kx8 WS512K32V-XG2UX WS512K32NV-XH1X 512Kx32 WS512K32V-XXX

    WF128K32-XXX5

    Abstract: No abstract text available
    Text: WF128K32-XXX5 White Electronic Designs 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES n Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400 n 5 Volt Programming. 5V ± 10% Supply


    Original     		PDF WF128K32-XXX5 128KX32 150ns 02H8X 03H8X 04H8X 05H8X 01H9X 02H9X 03H9X WF128K32-XXX5

    CQFP

    Abstract: WF512K32 WF512K32N-XH1X5 WF512K32-XXX5
    Text: White Electronic Designs WF512K32-XXX5 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES Access Times of 60, 70, 90, 120, 150ns Packaging Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400(1 .


    Original     		PDF WF512K32-XXX5 512Kx32 150ns 04HTX1 01HZX 120ns 02HZX 03HZX 04HZX CQFP WF512K32 WF512K32N-XH1X5 WF512K32-XXX5

    WF128K32-XXX5

    Abstract: No abstract text available
    Text: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400


    Original     		PDF WF128K32-XXX5 128KX32 150ns 02HNX 03HNX 04HNX 05HNX 01HAX 120ns WF128K32-XXX5

    WF1M32B-XXX3

    Abstract: WF1M32B-XG2TX3 1m 0880
    Text: White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES • Access Times of 100, 120, 150ns ■ Boot Code Sector Architecture Bottom Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401)


    Original     		PDF WF1M32B-XXX3 1Mx32 150ns 16KByte, 32KByte, 64kBytes WF1M32B-XXX3 WF1M32B-XG2TX3 1m 0880

    A11A17

    Abstract: WF1M32B-XXX3
    Text: White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES „ Access Times of 100, 120, 150ns • Boot Code Sector Architecture Bottom ■ Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400)


    Original     		PDF WF1M32B-XXX3 1Mx32 150ns 16KByte, 32KByte, 64kBytes A11A17 WF1M32B-XXX3

    WF128K32-XXX5

    Abstract: 5962-9471604HAX
    Text: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400


    Original     		PDF WF128K32-XXX5 128KX32 150ns 02HNX 03HNX 04HNX 05HNX 01HAX 120ns WF128K32-XXX5 5962-9471604HAX

    Untitled

    Abstract: No abstract text available
    Text: WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES • Access Times of 50*, 60, 70, 90, 120, 150ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400


    Original     		PDF WF128K32-XXX5 128KX32 150ns 16KBytes 05HMX 120ns

    WSF41632-22XX

    Abstract: No abstract text available
    Text: WSF41632-22XX 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE PRELIMINARY* FEATURES FLASH MEMORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Packaging • 66-pin, PGA Type, 1.385 inch square HIP, Hermetic Ceramic HIP (Package 402)


    Original     		PDF WSF41632-22XX 128KX32 512Kx32 120ns 66-pin, 64KBytes 120ns WSF41632-22XX

    WS128K32V-XG1UX

    Abstract: WS128K32V-XG2TX WS128K32V-XH1X
    Text: WS128K32V-XXX 128Kx32 3.3V SRAM MULTICHIP PACKAGE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35ns ■ 3.3 Volt Power Supply ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic


    Original     		PDF WS128K32V-XXX 128Kx32 66-pin, WS128K32V-XG2TX WS128K32V-XG1UX 128Kx32 256Kx16 512Kx8 WS128K32V-XH1X

    RTU A08

    Abstract: RTU A01 BUS-66300 bus-65112 BUS-65600 bus-66312 smd code A04 tpw14 A07 smd smd code A06
    Text: CT2566 MIL-STD-1553 to Microprocessor Interface Unit Features A E RO www.aeroflex.com C F LE X LA ISO 9001 E I NC . • 78 Pin, 2.1" x 1.87" x .25" PGA type package • 82 Lead, 2.2" x 1.61 x .18" Flat Package CIRCUIT TECHNOLOGY S Second Source Compatible to the BUS-66300


    Original     		PDF CT2566 MIL-STD-1553 BUS-66300 BUS-66312) MIL-STD-1750 CT2565 CT2512 SCDCT2566 CT2566-FP RTU A08 RTU A01 BUS-66300 bus-65112 BUS-65600 bus-66312 smd code A04 tpw14 A07 smd smd code A06

    5962-9461110HAX

    Abstract: No abstract text available
    Text: WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES ! Access Times of 15*, 17, 20, 25, 35, 45, 55ns ! TTL Compatible Inputs and Outputs ! Packaging ! 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .


    Original     		PDF 512Kx32 WS512K32-XXX WS512K32N-XH1X WS512K32-XG2UX WS512K32-XG4TX1 WS512K32-esign 5962-9461110HAX

    WS512K32

    Abstract: WS512K32-XXX
    Text: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .


    Original     		PDF WS512K32-XXX 512Kx32 WS512K32N-XH1X WS512K32-XG2UX WS512K32 140A00143 WS512K32-XXX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .


    Original     		PDF 512Kx32 WS512K32-XXX WS512K32N-XH1X WS512K32-XG2UX WS512K32-XG4TX1 WS512K32-XG2LX 140A00143

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5V Power Supply ■ Packaging ■ Low Power CMOS • 66 pin, PGA H 1 Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).


    Original     		PDF WS512K32-XXX 512Kx32 120ns 512Kx32, 1Mx16 WS512K32-XG2TX1 WS512K32N-XHX1 100ns