Cu3Sn
Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Cu3Sn
Solder Paste, Indium, Type 3
SSOP20 LAND PATTERN
Solder Paste Indium reflow process control
Solder Paste, Indium 5.1, Type 3
HVQFN48
SSOP20
philips pb-free products
SOT266-1 LAND PATTERN
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT COMPONENTS Introduction Fabrication considerations Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. Since circuit
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U111U1U1
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT COMPONENTS Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. And since circuit densities are increasing as more
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Fuses 202
Abstract: No abstract text available
Text: Surface Mount Fuses Subminiature Surface Mount & Dip Types FLAT-PAK Fast Acting Fuse 202 Series ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak® Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting.
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202GFLAT-
Fuses 202
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003G
Abstract: No abstract text available
Text: SURFACE MOUNT FUSES SUBMINIATURE SURFACE MOUNT & DIP TYPES FLAT-PAK Slo-Blo® Fuse ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting. These fuse
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GL521
Abstract: GP1U101X GP1U102X GP1U107X GP1U10X GP1U90X PD49PI home appliances with remote control T430
Text: GP1U10X Series GP1U10X Series Compact, Surface Mount and Reflow Soldering Type IR Detecting Unit for Remote Control • Features ■ Outline Dimensions 1. Compact and surface mount type Mounting area : 4/5 compared with GP1U90X (0.9 ) Detector center as a result of adoption of built-in constant voltage circuit
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GP1U10X
GP1U90X)
GL521
GP1U101X
GP1U102X
GP1U107X
GP1U90X
PD49PI
home appliances with remote control
T430
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S2082
Abstract: Soldering guidelines pin in paste CR-14 gold embrittlement
Text: S2082 Surface Mounting Instructions CR-9, 11, 12, 13, 14 Ceramic 16 and 24 PIN Packages Board and Solder Footprint Guidelines Application Note Recommended Mounting Solder footprints Cont’d For optimal performance of surface mount switches and attenuators in ceramic packages, grounding is critical. The
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S2082
packag80
S2082
Soldering guidelines pin in paste
CR-14
gold embrittlement
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1206 pads layout
Abstract: 1812 pads layout IPC-SM-782
Text: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were
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S-PGSM00M301-R
1206 pads layout
1812 pads layout
IPC-SM-782
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Untitled
Abstract: No abstract text available
Text: Surface Mounting Instructions M538 V4 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the
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J-STD-020
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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HSMD-C660
Abstract: HSMG-C660 HSMH-C660 HSMS-C660 HSMY-C660
Text: Agilent HSMx-C660 Right Angle Surface Mount Chip LEDs Data Sheet Features • Right Angle Mounting • Compatible with IR Reflow Soldering Process • Available in a Wide Variety of Colors • Available in 8 mm Tape on 178 mm 7" Diameter Reels Description
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HSMx-C660
HSMx-C660
mm-360
5988-0364EN
5988-4446EN
HSMD-C660
HSMG-C660
HSMH-C660
HSMS-C660
HSMY-C660
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2225 capacitor footprint dimension
Abstract: ipc-SM-782 IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 1825 footprint dimension 3530 novacap 0402 capacitor ipc-SM-782
Text: Ceramic Surface Mount Mounting Pad Dimensions and Considerations The objective of this document is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be extended to all NOVACAP standard and non-standard part sizes including assumptions for pick & place
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IPC-SM-782
2225 capacitor footprint dimension
IPC-SM-782 0805
2211 size footprint
0603 footprint IPC
1206 footprint IPC
ceramic capacitor footprint 0402 dimension
1825 footprint dimension
3530 novacap
0402 capacitor ipc-SM-782
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Untitled
Abstract: No abstract text available
Text: 194D www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT , Conformal Coated FEATURES • 8 mm, 12 mm, 16 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3, 7" [178 mm] standard • Mounting: Surface mount • Material categorization: For definitions of
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EIA-481
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Panasonic Selection Guide 2012
Abstract: No abstract text available
Text: ＳＵＲＦＡＣＥ ＭＯＵＮＴ ＲＥＳＩＳＴＯＲＳ ＴＥＣＨＮＩＣＡＬ ＧＵＩＤＥ Ver.3 Circuit Components Business Division Automotive & Industrial Systems Company Panasonic Corporation TECHNICAL GUIDE Ver.3 Contents 1. First:
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32.768 khz crystal 5ppm
Abstract: ISO-14001 RC-1009B VT-200 Quartz Crystals 1MHz overtone SPT1A Specification Quartz Crystals 1Mhz sii Product Catalog
Text: Quartz Crystals Product Catalog Components Headquaters Product Catalog CMOS IC Quartz Crystals Micro Batteries Fiber Optics MATERIALS Liquid Crystal Display Custom LCD Module Contents [Quartz Crystal Units] Quartz Crystal Unit Handling Precautions . 3
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1-9807-020-MS/AC
32.768 khz crystal 5ppm
ISO-14001
RC-1009B
VT-200
Quartz Crystals 1MHz overtone
SPT1A
Specification Quartz Crystals 1Mhz
sii Product Catalog
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4116r resistor pack
Abstract: bourns fuel card chip resistors bourns bourns torque angle sensor 0201-size Battery chargers for portable dvd china rs485 fuel level sensor "steering Angle Sensor" chassis PT90 bourns 3549
Text: Bourns Product Profile Automotive Sensors Circuit Protection Solutions Magnetics Products Microelectronic Modules Precision Potentiometers Panel Controls & Encoders Resistive Products Bourns® Product Profile Table of Contents Components Trimpot® Trimming
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50M/K0809
4116r resistor pack
bourns fuel card
chip resistors bourns
bourns torque angle sensor
0201-size
Battery chargers for portable dvd china
rs485 fuel level sensor
"steering Angle Sensor"
chassis PT90
bourns 3549
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light switch
Abstract: SKPGAAE010 carbon DETECTOR CIRCUIT DIAGRAM Surface Mount Type Slide Switch EC-19S-8 tamura EC-19S-8 SURFACE MOUNT TYPE
Text: TACT SwitchTM High Operation Force with 5mm Height Surface Mount Type SKPG Series Low-profile surface mount type with high operation force most suitable for in-car components. Detector Push Slide Rotary Encoders Power Product Line Dual-in-line Package Type
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SKPGACE010
SKPGAAE010
SKPGABE010
000cycles
EC-19S-8
light switch
SKPGAAE010
carbon DETECTOR CIRCUIT DIAGRAM
Surface Mount Type Slide Switch
EC-19S-8 tamura
SURFACE MOUNT TYPE
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CMMR1U-02
Abstract: CMMR1U-04 CMMR1U-06
Text: CMMR1U SERIES SURFACE MOUNT ULTRA FAST RECOVERY SILICON RECTIFIER 1 AMP, 200 THRU 600 VOLTS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMMR1U Series are high quality 1.0 Amp Surface Mount Silicon Rectifiers, well constructed, highly reliable components
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OD-123F
reliaCMMR1U-06)
CMMR1U-02)
CMMR1U-04)
CMMR1U-06)
36mm2
CMMR1U-02
CU02F
CMMR1U-02
CMMR1U-04
CMMR1U-06
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Duplexers
Abstract: No abstract text available
Text: I §• SPECTRUM CONTROL INC- ■II . Spectrum Control duplexers are designed using the same tools and components as the BP Series bandpass filters. Duplexers are available in the same thru-hole and surface mount package designs. Spectrum duplexers allow for a
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Melf composition
Abstract: No abstract text available
Text: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original
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Untitled
Abstract: No abstract text available
Text: SSESD11B Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that
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ESD11B
SSESD11B/D
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metal film fused resistor 47 ohm
Abstract: microcircuit catalog 48 VOLT 120 AMP smps Micro-D connectors 56FU04-017 Pi tubular capacitor RF Power Feed-Through Capacitors with Band Conductor, Class 1 Ceramic marking E01 sci-r2130 Pi capacitor tubular
Text: Spectrum Control Short Form Catalog Spectrum Control Innovative Solutions from Components to Complex Assemblies Spectrum Control was founded in 1968 as a designer and manufacturer of custom application-specific solutions to suppress or eliminate Electromagnetic Interference EMI .
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TVS 0201 Diode
Abstract: PNC0106A 024 marking bidirectional diode
Text: ESD11N5.0ST5G Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11N is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage,
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ESD11N5
ESD11N
TVS 0201 Diode
PNC0106A
024 marking bidirectional diode
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024 marking bidirectional diode
Abstract: laptop pcb circuits smd diode marking coding smd diode marking code 0s
Text: ESD11B5.0ST5G Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that
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ESD11B5
ESD11B
024 marking bidirectional diode
laptop pcb circuits
smd diode marking coding
smd diode marking code 0s
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