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    LQFP 64 SHIPPING TRAYS Search Results

    LQFP 64 SHIPPING TRAYS Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    UE36C1620005011 Amphenol Communications Solutions 1x1 QSFP-DD cage with the clip ship loose, no heat sink Visit Amphenol Communications Solutions
    M301N2F8TFP#U3 Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), LQFP, /Tray Visit Renesas Electronics Corporation
    D12373RVFQ33V Renesas Electronics Corporation Microcontrollers for General Purpose System Control Applications (Non Promotion), LQFP, /Tray Visit Renesas Electronics Corporation
    DF2212FP24V Renesas Electronics Corporation Microcontrollers for Mobile Device Applications (Non Promotion), LQFP, /Tray Visit Renesas Electronics Corporation
    M30280F6HP#U9B Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), LQFP, /Tray/Embossed tape Visit Renesas Electronics Corporation
    M30280FAHP#U5B Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), LQFP, /Tray/Embossed tape Visit Renesas Electronics Corporation

    LQFP 64 SHIPPING TRAYS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    antistatic epe foam

    Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
    Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.


    Original     		PDF 200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220

    mp 9141 es

    Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
    Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of


    Original     		PDF SG187Q42010 mp 9141 es MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L

    MPXY8600

    Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
    Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.


    Original     		PDF SG187Q42009 MPC5668G S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 MPC5553 MPXY8600 MPC5674 MPC5603 MPC56xx MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    TDUHC122A

    Abstract: TDUHC122 OXU200-LQAG tduhc OXU200 TDUHC12
    Text: Data Sheet TDUHC122 USB Host Controller Features DS-0051 Mar 07 „ USB host controller for embedded applications set-top box, PDA, cell phone, digital camera, Bluetooth USB HCI physical bus, etc. „ Compatible with the Universal Serial Bus Specification, Revision 2.0


    Original     		PDF TDUHC122 DS-0051 TDUHC122A TDUHC122 OXU200-LQAG tduhc OXU200 TDUHC12

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    MS08QD4

    Abstract: MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx
    Text: SG1000mini Freescale Semiconductor Product Selector Guides Quarter 2, 2009 Product Selector Guide Cross-Reference, SG1000CR Automotive, SG187 Analog and Mixed Signal Power Management, SG1002 Digital Signal Processors DSP , SG1004 Network/Embedded Processors, SG1007


    Original     		PDF SG1000mini SG1000CR SG187 SG1002 SG1004 SG1007 SG1009 SG1010 SG1013 32-Bit MS08QD4 MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx

    xc68hc912b32

    Abstract: mc68hc16y5 MC33491 xc68hc805p18 mc68hc916y5 XC68HC908AZ60 MC33286DW XC68HC705B32 XC68HC908AS60 obd usb
    Text: SG187/D Rev. 2 Automotive Selector Guide Quarter 1, 2000 http://sps.motorola.com/automotive Product information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and Power PC Automotive SMARTMOS Automotive Sensors ™ Digital DNA and SMARTMOS are trademarks of Motorola, Inc.


    Original     		PDF SG187/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX com/ics08 xc68hc912b32 mc68hc16y5 MC33491 xc68hc805p18 mc68hc916y5 XC68HC908AZ60 MC33286DW XC68HC705B32 XC68HC908AS60 obd usb

    9s08dz32

    Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
    Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad


    Original     		PDF SG187Q42007 9s08dz32 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882

    chrysler ecu diagrams

    Abstract: chrysler* j1850 xc68hc805p18 TPMS MEMS BASED PRESSURE SENSORS MC68HC912BE32 chrysler sci XC68HC912DG128 diagram ecu 5v supply chrysler HC912BE32 chrysler ecu
    Text: SG187/D Rev. 3 Automotive Selector Guide Quarter 3, 2000 http://sps.motorola.com/automotive/ Product information for: Automotive SMARTMOS Automotive Sensors 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX, PowerPC™, and M•CORE™


    Original     		PDF SG187/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX, com/ics08 chrysler ecu diagrams chrysler* j1850 xc68hc805p18 TPMS MEMS BASED PRESSURE SENSORS MC68HC912BE32 chrysler sci XC68HC912DG128 diagram ecu 5v supply chrysler HC912BE32 chrysler ecu

    XC68HC912BD32

    Abstract: xc68hc805p18 HC912BE32 chrysler ecu diagrams Common rail injector driver MC68HC16Y5 mc68hc916y5 ECU "ford" fiesta ford MC33093
    Text: SG187/D Rev. 5 Automotive Selector Guide Quarter 1, 2001 http://sps.motorola.com/automotive/ Product information for: Automotive SMARTMOS Automotive Sensors Automotive Microcontrollers: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX, PowerPC™, and M•CORE™


    Original     		PDF SG187/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX, 68HC08 XC68HC912BD32 xc68hc805p18 HC912BE32 chrysler ecu diagrams Common rail injector driver MC68HC16Y5 mc68hc916y5 ECU "ford" fiesta ford MC33093

    SC510727

    Abstract: chrysler ecu diagrams xc68hc805p18 PPAP MANUAL XC68HC908AZ60 MC68HC16Y5 TPM relay HC912D60 NOx sensor XC68HC912BD32
    Text: SG187/D Rev. 6 Automotive Selector Guide Quarter 2, 2001 motorola.com/semiconductors/automotive/ Product information for: Automotive SMARTMOS Automotive Sensors Automotive Microcontrollers: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX, PowerPC™, and M•CORE™


    Original     		PDF SG187/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX, MPXAZ4100 SC510727 chrysler ecu diagrams xc68hc805p18 PPAP MANUAL XC68HC908AZ60 MC68HC16Y5 TPM relay HC912D60 NOx sensor XC68HC912BD32

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24

    OBD II Protocol ISO 9141

    Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
    Text: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q3/2005 MMA7260Q MC56F8335VFG60 MC56F8335MFG60 MAC7101 SG187 OBD II Protocol ISO 9141 SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver switch circuit diagram af remote control door lock

    OBD II Protocol ISO 9141

    Abstract: knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010
    Text: Automotive Quarter 4, 2004 SG187 Rev 18 About This Revision–Q4/2004 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q4/2004 MM908E621 SG187-6e SG187 OBD II Protocol ISO 9141 knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1

    TX6 transmitter

    Abstract: TX14 TX15 VN16218
    Text: Advance Information VN16218 2.5 Gigabit SERDES Transceiver Applications •= Fast serial backplane transceiver •= High-speed point-to-point links General Description The VN16218 is a low power single chip, 2.5GBd transceiver. It provides a 2.5GBd serial link interface in


    Original     		PDF VN16218 VN16218 20-bit MDSN-0003-00 VN16218L2 TX6 transmitter TX14 TX15

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


    Original     		PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    Intersil

    Abstract: MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		PDF JM38510/ 1-888-INTERSIL Intersil MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23

    S1D15719

    Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
    Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4


    Original     		PDF S1L70000 S1L60000 S1L50000 S1L30000 16-bit 32-bit S1D15719 S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B