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    LAND PATTERN BGA 0.75 Search Results

    LAND PATTERN BGA 0.75 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    LAND PATTERN BGA 0.75 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern BGA 0.75

    Abstract: land pattern BGA 0,50 FBGA 63 flip chip
    Text: BGA LAND PATTERN DIMENSIONS b2 b e e b2 Unit : mm Land Pattern Dimensions Pin pitch e 1.50 P-BGA 0.63 P-BGA (Flip Chip type) P-BGA(C/D) (Advanced type) P-FBGA P-FBGA (Flip Chip type) T-BGA (TAB type) T-FBGA (Wire type) Land dimeter φ b 2 1.27 1.00 0.80


    Original     		PDF

    pitch 0.75mm BGA

    Abstract: BOX21151 LS-BGA54C-61
    Text: Tooling hole X2 BGA54C 3.75mm [0.148"] See BGA pattern code to the right for actual pattern layout Y 6.00mm [0.236"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern


    Original     		PDF BGA54C FR4/G10 LS-BGA54C-61 BOX21151 pitch 0.75mm BGA

    bga48

    Abstract: BOX21151 LS-BGA48N-61 pitch 0.75mm BGA
    Text: Tooling hole X2 BGA48N 5.25mm [0.207"] See BGA pattern code to the right for actual pattern layout Y 3.75mm [0.148"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern


    Original     		PDF BGA48N FR4/G10 LS-BGA48N-61 BOX21151 bga48 pitch 0.75mm BGA

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		PDF CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide

    SF-BGA255A-B-11

    Abstract: No abstract text available
    Text: D SF-BGA255A-B-11 C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X Top View reference only 19.05mm [0.750"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"] [0.210"]


    Original     		PDF SF-BGA255A-B-11 FR4/G10 SF-BGA255A-B-11

    sm 0038

    Abstract: SF-BGA256B-B-11
    Text: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA256B FR4/G10 SF-BGA256B-B-11 sm 0038

    16X16

    Abstract: SF-BGA256F-B-11
    Text: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA256F 16X16 SF-BGA256F-B-11 16X16

    16X19

    Abstract: SF-BGA303A-B-11
    Text: D Package Code: BGA303A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 22.86mm [0.900"] X Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1 3 Top View: Recommended PCB Layout


    Original     		PDF BGA303A 16X19 SF-BGA303A-B-11 16X19

    sm 0038

    Abstract: SF-BGA252A-B-11
    Text: D Package Code: BGA252A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA252A FR4/G10 SF-BGA252A-B-11 sm 0038

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    LS-BGA860A-41

    Abstract: No abstract text available
    Text: Top View 0.75mm [0.030"] 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 42x42 LS-BGA860A-41

    LS-BGA1704A-41

    Abstract: No abstract text available
    Text: Top View 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 42x42 LS-BGA1704A-41

    LS-BGA1696A-41

    Abstract: No abstract text available
    Text: Top View 42.50mm [1.673"] 0.75mm [0.030"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 42x42 LS-BGA1696A-41

    LS-BGA625C-61

    Abstract: No abstract text available
    Text: Top View 21mm [0.827"] 0.9mm [0.035"] 0.9mm [0.035"] 21mm [0.827"] 0.8mm typ. 19.2mm square [0.756"] 1 3.52mm [0.139"] 2 1.68mm [0.066"] 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		PDF FR4/G10 25x25 LS-BGA625C-61

    land pattern BGA 0.75

    Abstract: BGA reflow guide BGA and CSP bo 137
    Text: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus


    Original     		PDF 96GKE/114GKF com/design/flcomp/packdata/297846 land pattern BGA 0.75 BGA reflow guide BGA and CSP bo 137

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		PDF AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Text: Table of Contents Introduction . 2 Package Overview . 3


    Original     		PDF AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement

    samtec ASP

    Abstract: ASP-65067-01 LA-BGA92D-DDR2-SDRAM-01 LS-BGA92D-61 land pattern BGA 0.75 0.8mm pitch BGA Mictor
    Text: 30.00mm [1.181"] Top View 11.00mm 35.00mm [1.378"] 19.00mm 1 DDR IC not included Side View SMT interface 3.25mm [0.128"] LS-BGA92D-61 (Sold separately) 2 3 1 4.67mm [0.184"] assembled 2 11.00mm Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"]


    Original     		PDF LS-BGA92D-61 63Sn37Pb FR4/G10 LS-BGA92D-61 LA-BGA92D-DDR2-SDRAM-01 LA-BGA92D-DDR2-SDRAM-01 samtec ASP ASP-65067-01 land pattern BGA 0.75 0.8mm pitch BGA Mictor

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    SF-BGA256B-B-05

    Abstract: No abstract text available
    Text: 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"] 0-80 Threaded Insert


    Original     		PDF 725mm FR4/G10 Sn63Pb37 00lating. SF-BGA256B-B-05

    SF-BGA256B-B-05F

    Abstract: No abstract text available
    Text: RoHS COMPLIANT 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"]


    Original     		PDF 725mm FR4/G10 SF-BGA256B-B-05F

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga