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    KOSTAT TRAY Search Results

    KOSTAT TRAY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38327WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation

    KOSTAT TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Kostat tray

    Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
    Text: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by


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    PDF 14x20mm 28x28mm 32x32mm ND-1420-2 ND-2828-3 ND-3232-3 KS-8202* KS-8201* Kostat tray Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


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    PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


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    PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    wireless mobile charger block diagram

    Abstract: Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460 CX20460-12 CX20505-14
    Text: PRODUCT SUMMARY CX20460 Power Management Integrated Circuit for GSM and GPRS Applications Description APPLICATIONS • GSM and GPRS handsets/data modules FEATURES • • • • • • • • • • Power on/off control Generation of system voltages from a single power source


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    PDF CX20460 48-pin 03185A 376-3000fax 376-3100sales wireless mobile charger block diagram Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460-12 CX20505-14

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


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    kostat tray qfn 5 x 3

    Abstract: ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the popular sizes of current modules. APPLICATION NOTE


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    PDF 101568E kostat tray qfn 5 x 3 ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


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    PDF AN-657-1 KS-886H Kostat tray

    EPAK TRAY

    Abstract: GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE


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    PDF 101568G EPAK TRAY GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


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    PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG

    Kostat

    Abstract: JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray
    Text: National Semiconductor Application Note 1126 September 1999 Printed Circuit Board PCB Layout Guidelines NSMD defined pads enhance vision registration of copper fiducials compared to the SMD defined pad. For SMD defined pads, any misregistration of the solder mask will contribute


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    PDF AN-1126 Kostat JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray

    101568i

    Abstract: SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE


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    PDF 101568I 101568i SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


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    PDF AN-659-1 FC-BGA T0812012 daewon tray

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


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    PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount


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    PDF SKY77155

    SKY77189

    Abstract: KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape
    Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range


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    PDF SKY77189 10-pad KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape

    design of multi section directional coupler

    Abstract: class d power amplifier Kostat tray MMIC code D sky77189 Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3
    Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range


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    PDF SKY77189 10-pad design of multi section directional coupler class d power amplifier Kostat tray MMIC code D Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3

    JESD-A115

    Abstract: SKY77155 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10
    Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount


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    PDF SKY77155 JESD-A115 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    IC TRAY DATASHEETS KOSTAT

    Abstract: Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65
    Text: Voice Direct 364 Data Book  Sensory, Inc. P/N 80-0179-F Table of Contents Copyright  Copyright 2000, Sensory, Inc. You may not copy, modify, or translate this document or any part of this document. Nor can you reduce any part of it to any machine-readable form.


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    PDF 80-0179-F 1N4148 IC TRAY DATASHEETS KOSTAT Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65

    Kostat tray

    Abstract: JEDEC Kostat Kostat KS-6100 package tray design dwg kostat 6 x 6 Kostat KS-6110 ks 1060 88051 Kostat KS-6120
    Text: KOSTAT 7.62 322.6±0.5 m 315.0 6.35 |«>| 0.20 H |A I X | DETAILV 1.” DETAILf t H I'i he l'Ë i'i hi IEhi I-E YE I '”I hi i. m 1 . “ I1;: -L m m |<H 0.20 ® 92,1 |A I X @ | EHHEHHEH jijj • ■m mg i m î-U 311.66 a s 135.9 m m m* B U S H S Ë ÎS s iH


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    PDF 00x15EA 30DETAIL Kostat tray JEDEC Kostat Kostat KS-6100 package tray design dwg kostat 6 x 6 Kostat KS-6110 ks 1060 88051 Kostat KS-6120

    Kostat tray

    Abstract: Kostat kostat 6 x 6 Kostat KS-6120 KS-87063 Kostat tray 2 X 2.5 shipping tray MSC-4901 Kostat 87063 MSA-3032
    Text: REVISIONS REV 02 03 D ESC RIP TIO N DATE CHANGE TO 140 deq C TRAY ADDED NEW PACKAGE - LG/LGG 64 APPROVED KK Thee KK Thee 03/28/08 05/20/09 7.62 6.35 DETAIL "F" V - œ i 4x2-R2.54 i T7- EEH 1 £ 7 0.76 - A - TRAY STACKING DETAIL LGA 9.0mm x 9.0mm KS - 87063


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    PDF MSC17011 MSC-4901 Kostat tray Kostat kostat 6 x 6 Kostat KS-6120 KS-87063 Kostat tray 2 X 2.5 shipping tray MSC-4901 Kostat 87063 MSA-3032

    Kostat tray

    Abstract: kostat Kostat KS-6110 shipping tray kostat 6 x 6 shipping tray BGA msc1701 KS-880356 MSA-3032
    Text: REVISIONS REV 00 01 DETAIL DESCRIPTION INITIAL RELEASE ADDED RED COLOR TRAY PART NUMBER DATE 03/06/09 04/09/09 APPROVED KK Thee KK Thee E 4 5 ' CHAMFER -29.20X9PLCS=262.8±0.25 DETAIL ’D’ 4x2—R2.54 £ 7 D.7B - A - EEH FCBGA 24.5 X 19.5mm K S-880356 REV.00


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    PDF 20X9PLCS KS-880356 KS-6110 MSA-3032. MSC-5824 MSC17011 Kostat tray kostat Kostat KS-6110 shipping tray kostat 6 x 6 shipping tray BGA msc1701 MSA-3032