mil-prf-39006
Abstract: marking code M35 M35C336 M35C
Text: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors
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2002/95/EC
18-Jul-08
mil-prf-39006
marking code M35
M35C336
M35C
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Untitled
Abstract: No abstract text available
Text: M35 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available • Industry standard ratings • Model M35 wet tantalum electrolytic chip
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PDF
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: M35 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available • Industry standard ratings • Model M35 wet tantalum electrolytic chip
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PDF
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2002/95/EC
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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M34C1
Abstract: No abstract text available
Text: M34 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 F to 470 μF 6 V to 125 V, - 55 °C to + 125 °C
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
M34C1
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POWER33
Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
Text: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related
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AN-9040
Power33
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDM3622,
FDM6296,
FDMC2523P,
IPCA610D
sac 305
IPC-SM-7525A
J-STD-001C
IPC-A-610D
IPC-4101B
FDMC8554
IPC-7525
FDMC2523P
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93026
Abstract: M34C1
Text: M34 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 F to 470 μF 6 V to 125 V, - 55 °C to + 125 °C
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Original
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PDF
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2002/95/EC
11-Mar-11
93026
M34C1
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Wet Tantalum Capacitors
Abstract: tag 8739 TAG 8634 arcotronics 1.27.6 MT 8223 tag 8708 TAG 8643 castanet capacitor tag 8807
Text: v i s h ay i N T e R T e C h N O L O Gy, i N C . INTERACTIVE data book wet tantalum capacitors vishay vse-db0030-11F Notes: 1. To navigate: a Click on the vishay logo on any datasheet to go to the Contents page for that section. Click on the vishay logo on any Contents
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PDF
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vse-db0030-11
Wet Tantalum Capacitors
tag 8739
TAG 8634
arcotronics 1.27.6
MT 8223
tag 8708
TAG 8643
castanet capacitor
tag 8807
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Untitled
Abstract: No abstract text available
Text: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors
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Original
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PDF
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18-Jul-08
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MIL-PRF-39006
Abstract: M35C106 M35C
Text: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors
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Original
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PDF
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2002/95/EC
18-Jul-08
MIL-PRF-39006
M35C106
M35C
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J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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PDF
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TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
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IPC-SM-7525A
Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Text: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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PDF
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AN-9048
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDMF6700,
FDMF6704,
FDMF6704A,
FDMF6704V,
FDMF6730
IPC-SM-7525A
ipc 610D
IPC-7525
J-STD-001C
IPC-4101B
entek ht plus
JSTD001D
7525A smt
j-std-001d
IPC610D
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Untitled
Abstract: No abstract text available
Text: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors
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Original
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PDF
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08-Apr-05
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IPC-7525
Abstract: IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B
Text: AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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Original
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PDF
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AN-9037
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDMF8700,
FDMF8704,
FDMF8704V,
FDMF8705
IPC-7525
IPC-SM-7525A
FDMF8705
QFN 52 8x8 footprint
AN-9037
100C
IPC610D
JESD22-B102D
J-STD-001C
IPC-4101B
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40106
Abstract: 40106 be M34C476 M34C1
Text: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR
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PDF
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18-Jul-08
40106
40106 be
M34C476
M34C1
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JESD22-B102D
Abstract: J-STD-002 ipc 610D ISO 1073-2
Text: Application Report SCEA038 – November 2007 Factors That Influence Side-Wetting Performance on IC Terminals Donald C. Abbott, Bernhard Lange, Douglas W. Romm, and John Tellkamp . ABSTRACT A designed experiment evaluated the influence of several variables on appearance and
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SCEA038
JESD22-B102D
J-STD-002
ipc 610D
ISO 1073-2
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ipc 610D
Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
Text: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related
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AN9047
IPC-SM-7525A,
JESD22-B102D,
FPF1007,
FPF1008,
FPF1009,
FPF2140,
FPF2142,
FPF2143,
FPF2144,
ipc 610D
IPC-SM-7525A
IPC-7525
IPC610D
JSTD001D
Intel reflow soldering profile BGA
IPC-4101B
Lead Free reflow soldering profile BGA
J-STD-001C
IPC-A-610D
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ipc 610D
Abstract: IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B
Text: Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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Original
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AN9046
Power56
JESD22-B102D,
FDMS9600S,
FDMS9620S
ipc 610D
IPC-7525
IPC-SM-7525A
J-STD-001C
7525a
AN9046
Intel reflow soldering profile BGA
voids
J-STD-001
IPC-4101B
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M34C1
Abstract: No abstract text available
Text: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C Pb-free Available
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Original
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PDF
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18-Jul-08
M34C1
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I 40106
Abstract: No abstract text available
Text: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available Available RoHS* COMPLIANT • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C
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Original
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PDF
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08-Apr-05
I 40106
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not 40106
Abstract: M34C1
Text: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR
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Original
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PDF
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11-Mar-11
not 40106
M34C1
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C2556
Abstract: No abstract text available
Text: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors
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Original
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PDF
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2002/95/EC
11-Mar-11
C2556
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J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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Original
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PDF
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TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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TB488
Abstract: No abstract text available
Text: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.
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TB488
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40106
Abstract: M34C106 40106 data sheet not 40106 DSCC93026 I 40106 40106 be m34 series Zss 34 MIL-STD-1276
Text: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR
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Original
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PDF
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18-Jul-08
40106
M34C106
40106 data sheet
not 40106
DSCC93026
I 40106
40106 be
m34 series
Zss 34
MIL-STD-1276
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