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    POWER33

    Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
    Text: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related


    Original     		PDF AN-9040 Power33 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDM3622, FDM6296, FDMC2523P, IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P

    data circuit schematics satellite connector

    Abstract: TANS III GPS ipc 610D abb SOFT STARTER CIRCUIT DIAGRAM nmea 0183 buffer solder paste SAC305 alpha metal ICD-GPS-200 N00146 db9 pcb mount female trimble multi Track target
    Text: REFERENCE MANUAL USER GUIDE Copernicus GPS Receiver NORTH AMERICA Trimble Navigation Limited Corporate Headquarters 935 Stewart Drive Sunnyvale, CA 94086 +1-800-787-4225 +1-408-481-7741 EUROPE Trimble Navigation Europe Phone: +49-6142-2100-161 KOREA Trimble Export Ltd, Korea


    Original     		PDF

    IPC-SM-7525A

    Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
    Text: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN-9048 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDMF6700, FDMF6704, FDMF6704A, FDMF6704V, FDMF6730 IPC-SM-7525A ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D

    IPC-7525

    Abstract: IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B
    Text: AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN-9037 IPC-A-610-D, J-STD-001D, IPC-SM-7525A, JESD22-B102D, FDMF8700, FDMF8704, FDMF8704V, FDMF8705 IPC-7525 IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B

    ipc 610D

    Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
    Text: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related


    Original     		PDF AN9047 IPC-SM-7525A, JESD22-B102D, FPF1007, FPF1008, FPF1009, FPF2140, FPF2142, FPF2143, FPF2144, ipc 610D IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D

    ipc 610D

    Abstract: IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B
    Text: Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its


    Original     		PDF AN9046 Power56 JESD22-B102D, FDMS9600S, FDMS9620S ipc 610D IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B

    ipc 610D

    Abstract: IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C
    Text: www.fairchildsemi.com Application Note AN-9049 Assembly Guidelines for Fairchild’s TinyBuck Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild TinyBuck™ package is based on Molded Leadless Packaging MLP technology. This technology


    Original     		PDF AN-9049 FAN2103MPX, FAN2103EMPX, FAN2106MPX, FAN2106EMPX, FAN2106MPX AA3E249, FAN2108MPX, FAN2108EMPX, FAN21SV06MPX, ipc 610D IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C

    44xv

    Abstract: uPC610
    Text: kPC610 Polarized 10 Bit D/A Converter GENERAL DESCRIPTION FEATURES The fiPC610 is a high perform ance precision m o n o lith ic D /A converter fo r converting 10 b it binary Full Scale Temp. 1 0 0 p p m /°C MAX. Linearity E rror 0.2% MAX. coded digital signal in to an analog DC o u tp u t voltage.


    OCR Scan     		PDF uPC610 fiPC610 PC610D 44xv uPC610

    LM301 EQUIVALENT

    Abstract: UAF771 mpc1042c MPC319C mPC339c MC7812CP RC4558P equivalent lm324n equivalent MC7805CP MPC451C
    Text: CROSS REFERENCE GUIDE INDUSTRIAL TEMPERATURE RANGE FUNCTION General Purpose OP Amp. General Purpose OP Amp. Instrumentation OP Amp. Super Beta OP Amp. General Purpose OP Amp. High Speed Wide Band OP Amp. Micro Power OP Amp. {Programmable Instrumentation OP Amp.


    OCR Scan     		PDF uPC55D uPC151D uPC151C uPC151G uPC154D uPC156D uPC157D uPC157C uPC159D PC253D LM301 EQUIVALENT UAF771 mpc1042c MPC319C mPC339c MC7812CP RC4558P equivalent lm324n equivalent MC7805CP MPC451C