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    JEDEC TRAY STANDARD DIMENSION Search Results

    JEDEC TRAY STANDARD DIMENSION Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ102MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    JEDEC TRAY STANDARD DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
    Text: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		PDF 44-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
    Text: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,


    Original     		PDF 32-pin 865495TG5 T944G 545-FRAM, JEDEC TRAY DIMENSIONS JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


    Original     		PDF

    p31b

    Abstract: FUSE 451 P03cm TGS 813 TGS 823 P0080SAL P0080SBL P0080SAMCL P1200SDL p48a
    Text: 9 Mechanical Data 9 Mechanical Data The following section describes the mechanical specifications of products in this Telecom Design Guide. Telecom Design Guide • 2006 Littelfuse, Inc. 9-1 www.littelfuse.com /GEJCPKECN &CVC Gas Plasma Arresters—Package Dimensions / Specifications . . . . . . . . . . . . . . . . . . . . . . . . 9-3


    Original     		PDF SL1122A SL0902A SL1002A O-220 p31b FUSE 451 P03cm TGS 813 TGS 823 P0080SAL P0080SBL P0080SAMCL P1200SDL p48a

    QFP JEDEC tray

    Abstract: JEDEC TRAY QFP MQFP40 7746
    Text: TRAY CONTAINER A 44.50 77.46 29.22 135.9 UNIT : mm A' 50.56 31.10 44.50 252.80 315.0 322.6 SECTION A-A' 44.50 3.62 7.62 6.35 39.75 MQFP40 x 40 × 3.8mm Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C less than 1 × 1012 Ω / The tolerance of tray's dimensions are based on


    Original     		PDF MQFP40 304-pin SSD-A-H5789-2 QFP JEDEC tray JEDEC TRAY QFP MQFP40 7746

    JEDEC tray standard dimension

    Abstract: strapex daewon DAEWON JEDEC TRAY PEAK TRAY TMS320C44 JEDEC tray standard 13
    Text: TMS320C44 DSP Packaging Guide 1997 Digital Signal Processing Solutions Printed in U.S.A., June 1997 SPRZ114 TMS320C44 DSP Packaging Guide Literature Number: SPRZ114 June 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		PDF TMS320C44 SPRZ114 JEDEC tray standard dimension strapex daewon DAEWON JEDEC TRAY PEAK TRAY JEDEC tray standard 13

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    KU82596CA33

    Abstract: n177 ng88c196ecdb KU80386EXTC25 KU80386EXTC33 pqfp132 KU80486SXSA33 KU82596CA25 KU80386EXTB25 NG88C196EC
    Text: Product Change Notification # 948 Rev. 1 Information in this document is provided in connection with Intel  products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as


    Original     		PDF 6CA33 KU82596DX25 KU82596DX33 KU82596SX20 NG88C196EC NG88C196ECDB PQFP100L PQFP132L PQFP196L KU82596CA33 n177 ng88c196ecdb KU80386EXTC25 KU80386EXTC33 pqfp132 KU80486SXSA33 KU82596CA25 KU80386EXTB25 NG88C196EC

    JEDEC tray standard dimension

    Abstract: strapex daewon tray daewon PACKING TRAYS JEDEC tray standard 13 DAEWON JEDEC TRAY filler TMS320C44 Package tray dimension
    Text: TMS320C44 DSP Packaging Guide 1997 Digital Signal Processing Solutions Printed in U.S.A., June 1997 SPRZ114 TMS320C44 DSP Packaging Guide Literature Number: SPRZ114 June 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		PDF TMS320C44 SPRZ114 JEDEC tray standard dimension strapex daewon tray daewon PACKING TRAYS JEDEC tray standard 13 DAEWON JEDEC TRAY filler Package tray dimension

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48

    intel 04195

    Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
    Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel


    Original     		PDF paC/85 intel 04195 BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A