Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    JEDEC TRAY STANDARD 490 Search Results

    JEDEC TRAY STANDARD 490 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ102MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    JEDEC TRAY STANDARD 490 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC tray standard 490

    Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard 14490
    Text: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 36-pin Plastic FLGA (4×4) Quantity (pcs) 490 MAX. FBGA 4×4 ESP


    Original     		PDF 36-pin SSD-A-H7487 JEDEC tray standard 490 JEDEC TRAY DIMENSIONS JEDEC tray standard 14490

    JEDEC tray standard 490

    Abstract: FBGA
    Text: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 49-pin Plastic FBGA (4×4) 64-pin Plastic FBGA (4×4) Quantity (pcs)


    Original     		PDF 49-pin 64-pin SSD-A-H7393-1 JEDEC tray standard 490 FBGA

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard JEDEC tray standard 490
    Text: TRAY CONTAINER 3.35 8.80 7.90 3.35 135° C MAX. A' 9.20 8.15 FBGA3 x 3ESP A NEC 119.6 135.9 PPE 14 × 35=490 UNIT : mm 299.2 315.0 322.6 SECTION A-A' 3.35 5.62 (6.07) 7.62 3.00 Applied Package Quantity (pcs) 25-pin Plastic FLGA (3×3) 490 MAX. Tray FBGA3×3 ESP


    Original     		PDF 25-pin SSD-A-H7649 JEDEC TRAY DIMENSIONS JEDEC tray standard JEDEC tray standard 490

    h744

    Abstract: JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 14 x 35=490 NEC 119.6 135° CMAX. 4.8 8.15 9.20 FBGA4.5 × 4.5ESP 135.9 PPE A' A 4.8 8.80 7.90 299.2 315.0 322.6 SECTION A-A' (6.41) (5.62) 7.62 4.80 4.38 Applied Package 48-pin Tape FBGA (4.38×4.38) 48-pin Plastic FBGA (4.38×4.38)


    Original     		PDF 48-pin SSD-A-H7441-1 h744 JEDEC TRAY DIMENSIONS FBGA

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
    Text: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)


    Original     		PDF 65-pin 490MAX. 64-pin 85-pin 97-pin SSD-A-H7469-3 JEDEC tray standard JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12

    FBGA 63

    Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
    Text: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)


    Original     		PDF 61-pin 63-pin 97-pin SSD-A-H7519-2 FBGA 63 JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS

    JEDEC tray standard 490

    Abstract: FLGA
    Text: TRAY CONTAINER 135°C MAX. NEC 119.6 A' 5.30 9.20 FBGA 5x5ESP A 5.30 8.80 299.2 7.90 315.0 322.6 Section A – A' 5.30 (5.62) (5.79) 5.00 7.62 8.15 135.9 PPE 14×35=490 UNIT : mm Applied Package Quantity (pcs) 49-pin Plastic FLGA (5×5) 52-pin Plastic FLGA (5×5)


    Original     		PDF 64-pin 49-pin 52-pin SSD-A-H7179-2 JEDEC tray standard 490 FLGA

    84 FBGA

    Abstract: JEDEC FBGA 141-PIN tray fbga 84
    Text: TRAY CONTAINER NEC 135.9 119.6 PPE 14x35=490 UNIT : mm 135°C MAX. 7 FBGA 6×6ESP A' 6.50 8.15 9.20 A 6.50 8.80 299.2 7.90 315.0 322.6 Section A – A' 6.50 (6.16) (5.62) 7.62 6.00 Applied Package Quantity (pcs) Tray FBGA 6×6 ESP 64-pin Plastic FBGA (6×6)


    Original     		PDF 64-pin 65-pin 84-pin 85-pin 97-pin 141-pin SSD-A-H7453-3 84 FBGA JEDEC FBGA tray fbga 84

    H7665

    Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490
    Text: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A


    Original     		PDF 10-pin SSD-A-H7665 H7665 SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    JEDEC qfn tray

    Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
    Text: Packaging Product Specification PS007230-0812 Copyright 2012 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE THESE PRODUCTS IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN

    LVDS pin

    Abstract: 32-PIN ICS863401 ICS8634-01 ICS8634BY01L 348c
    Text: ICS8634-01 Integrated Circuit Systems, Inc. 1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY BUFFER GENERAL DESCRIPTION FEATURES The ICS8634-01 is a high performance 1-to-5 Differential-to-3.3V LVPECL Zero Delay Buffer and a HiPerClockS member of the HiPerClockS™ family of High Performance Clock Solutions from ICS. The ICS863401 has two selectable clock inputs. The CLKx,


    Original     		PDF ICS8634-01 ICS8634-01 ICS863401 700MHz 900mV LVDS pin 32-PIN ICS8634BY01L 348c

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    Untitled

    Abstract: No abstract text available
    Text: ICS8735-01 Integrated Circuit Systems, Inc. 1:5 DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR GENERAL DESCRIPTION FEATURES The ICS8735-01 is a highly versatile 1:5 Differential-to-3.3V LVPECL clock generator and a HiPerClockS member of the HiPerClockS™ family of High


    Original     		PDF ICS8735-01 ICS8735-01 25MHz 700MHz. 100mA 150mA 8735AY-01

    MFE3500CCA09

    Abstract: PEAK TRAY tx qfn tray qfn 6x6 se7351l SE7051 QFN-40L PEAK TRAY qfn 9 x 9 GRM1555C1H101JD01 mfe350 CONN d-SUB 9
    Text: SE7351L 3.3 - 3.8 GHz Front-End Transceiver Applications Product Description ƒ ƒ ƒ The SE7351L is a low noise, high linearity front-end transceiver for the 3.3 - 3.8 GHz band. The receiver provides a low noise down-conversion from RF to a 200 - 600 MHz intermediate frequency. 40 dB of gain


    Original     		PDF SE7351L SE7351L DST-00073 May-26-2009 MFE3500CCA09 PEAK TRAY tx qfn tray qfn 6x6 SE7051 QFN-40L PEAK TRAY qfn 9 x 9 GRM1555C1H101JD01 mfe350 CONN d-SUB 9

    CH7108a

    Abstract: CH7108
    Text: CH7108A Chrontel Brief Datasheet CH7108A HDMI to CVBS/S-Video Converter FEATURES • • • • • • • • • • • • • • GENERAL DESCRIPTION HDMI Receiver compliant with HDMI 1.4 specification Support CVBS and S-Video output in format of NTSC


    Original     		PDF CH7108A CH7108A CH7108A-BF 490/Tray CH7108A-BFI CH7108

    CH7107A-BF

    Abstract: rd2n CH7107
    Text: CH7107A Chrontel Brief Datasheet CH7107A HDMI to CVBS Converter FEATURES • • • • • • • • • • • • • • GENERAL DESCRIPTION HDMI Receiver compliant with HDMI 1.4 specification Support CVBS output in format of NTSC or PAL On-chip Audio encoder which support 2 channel IIS/


    Original     		PDF CH7107A CH7107A CH7107A-BF 490/Tray CH7107A-BFI CH7107A-BF rd2n CH7107