Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    INTEL 132 QFP Search Results

    INTEL 132 QFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MD82C288-10/R Rochester Electronics LLC Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MD87C51/BQA Rochester Electronics LLC Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MG87C196KC/B Rochester Electronics LLC Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy

    INTEL 132 QFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    132 pin PGA socket

    Abstract: INTEL 132 QFP land pattern QFP 132 80960JA SF-QFJ132SA-G-02 Cobra
    Text: Relative orientations top views 0.100" typ. PGA A1 1.450" Pin 1 QFP Pin 1 ( TRST ) A1 Top view Target PCB 80960JA QFP Land Pattern 1.450" The Surface mount foot (QFP Base) is symmetrical and can solder to the Target PCB in any of 4 90° rotations. The PGA top,


    Original     		PDF 80960JA SF-QFJ132SA-G-02 FR4/G10 PC-PGA/QFP80960JA-G-01 PC-PGA/QFP-80960JA-G-01 132 pin PGA socket INTEL 132 QFP land pattern QFP 132 80960JA Cobra

    D431000

    Abstract: INTEL 87C196 USER MANUAL D75304GF AIC6360Q d431000agw aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054
    Text: IC Test Clips Test Clip Selection Made Easy To select the Pomona IC Test Clip specifically designed for your chip, find the table for your chip type and follow the selection procedure outlined in this section. SSOP/QSOP JEDEC QFP Pomona IC Test Clips are uniquely designed to provide


    Original     		PDF SN74F32D, EPM5032, TMC1171 TMPN3120, HM628128, D431000AGW D431000 INTEL 87C196 USER MANUAL D75304GF AIC6360Q aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054

    132 pin PGA socket

    Abstract: 80960JA SF-QFJ132SA-L-01
    Text: Relative orientations top views 0.100" typ. PGA A1 1.450" Pin 1 QFP Pin 1 ( TRST ) Target PCB 80960JA QFP Land Pattern A1 Top view 1.450" 0.321" 1 2 The Surface mount foot (QFP Base) is symmetrical and can solder to the Target PCB in any of 4 90° rotations. The PGA top,


    Original     		PDF 80960JA SF-QFJ132SA-L-01 FR4/G10 100shell PC-PGA/QFP80960JA-L-01 PC-PGA/QFP-80960JA-L-01 132 pin PGA socket 80960JA

    d431000agw

    Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002
    Text: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and


    Original     		PDF ABT16244, ACT16245 FCT16223, FCT162511 d431000agw D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    AP-368

    Abstract: 82557 82557 user manual intel 82557 82557 specification update CRC-16 and CRC-32 CX 879 intel 82596 CRC-16 CRC-32
    Text: AP-368 APPLICATION NOTE 82557 10 100 Mbps PCI LAN Controller A Guide to 82596 Compatibility Technical Marketing Network Products Division November 1995 Order Number 644126-001 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in


    Original     		PDF AP-368 AP-368 82557 82557 user manual intel 82557 82557 specification update CRC-16 and CRC-32 CX 879 intel 82596 CRC-16 CRC-32

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    VCC166

    Abstract: 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb
    Text: L-71001-0D MITSUBISHI ELECTRIC REV Mitsubishi Memory Module Technical Direction Large Capacity 64MB 128MB 256MB 512MB 1GB High Speed EDO SDRAM Small outline DDR SDRAM RDRAMTM 72pin S.O.DIMM Memory Module 144pin S.O.DIMM 200pin DDR S.O. DIMM 72pin x36 168pin


    Original     		PDF L-71001-0D 128MB 256MB 512MB 72pin 144pin 200pin 168pin VCC166 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    c4460

    Abstract: trans C3150 BC518 TI486DX4-100 LC51-50 C5380 TM2SP64GPU TMS320C2X TMS320C204 seagate
    Text: EXTENDING YOUR REACHTM NORTH AMERICAN EDITION INTEGRATION AN UPDATE ON TEXAS INSTRUMENTS SEMICONDUCTORS VOL. 13 ▼ NO. 2 ▼ MARCH 1996 ThunderSWITCH meets bandwidth demands Spurred by rapid growth in the use of networked applications such as the Internet, groupware, client/server and


    Original     		PDF SFY49LXX603R 100-MIPS c4460 trans C3150 BC518 TI486DX4-100 LC51-50 C5380 TM2SP64GPU TMS320C2X TMS320C204 seagate

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    intel 82557

    Abstract: dec 21140 INTEL application notes digital 21140 dec21140 LS373 intel DOC Intel AP 82557 intel EPROM
    Text: E AP-373 APPLICATION NOTE Replacing the DEC 21140 with the Intel 82557 Controller for LAN Designs November 1996 Order Number: 645006-002 12/6/96 11:05 AM 64500602.DOC INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-373 10Mbps 10Mbps intel 82557 dec 21140 INTEL application notes digital 21140 dec21140 LS373 intel DOC Intel AP 82557 intel EPROM

    UG3D6464D7B8

    Abstract: No abstract text available
    Text: UG3D6464D7B8 512K Bytes 64K x 64 160 Pin SRAM DIMM based on 64K x 32 Features General Description The UG3D6464D7B8 is a 524,038 bits by 64 Sync Burst SRAM module. The UG3D6464D7B8 is assembled using 2 pcs of 64K x 32 Sync Burst SRAMs in 100-pin QFP packages and


    Original     		PDF UG3D6464D7B8 UG3D6464D7B8 100-pin 32Kx8 66MHz 1130mil) 64Kx32

    Untitled

    Abstract: No abstract text available
    Text: UG3D3264C7B8 256K Bytes 32K x 64 160 Pin SRAM DIMM based on 32K x 32 Features General Description The UG3D3264C7B8 is a 262,019 bits by 64 Sync Burst SRAM module. The UG3D3264C7B8 is assembled using 2 pcs of 32K x 32 Sync Burst SRAMs in 100-pin QFP packages and


    Original     		PDF UG3D3264C7B8 UG3D3264C7B8 100-pin 32Kx8 66MHz 1130mil) 32Kx32

    80386SL

    Abstract: No abstract text available
    Text: 1C Test Clips Pomona JEDEC PQFP Test Clips Pomona's JEDEC QFP test clips are designed to fit on surface-mounted plastic and ceramic JEDEC chips. Choose from three clip types designed to give you optimum func­ tionality and ease of use for testing, troubleshooting


    OCR Scan     		PDF

    XCS3201FN

    Abstract: ATT92020 80386SL MC68HC11A1FU
    Text: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable


    OCR Scan     		PDF

    9020 eeprom

    Abstract: adapter block diagram 9020 eprom 82596CA 9060ES 9036
    Text: PCI 9036 T E April 1995 Version 1.3 FOR NEW DESIGNS USE PCI 9060ES PCI Bus Master Interface Chip for Intel 82596CA LAN Controller Features_ _ General D escrip tio n _ • PCI Bus Master Interface for Intel 82596CA Ethernet


    OCR Scan     		PDF 9060ES 82596CA 9020BV, 9060ES bfiS514T 9020 eeprom adapter block diagram 9020 eprom 9036

    Untitled

    Abstract: No abstract text available
    Text: PCI 9036 T E C H N D L D E Y April 1995 Version 1 3 FOR NEW DESIGNS USE PCI 9060ES PCI Bus Master Interface Chip for Intel 82596CA LAN Controller Features General Description • PCI Bus Master Interface for Intel 82596CA Ethernet Controllers and other intelligent I/O controllers and


    OCR Scan     		PDF 9060ES 82596CA 9020BV, 9060ES

    Untitled

    Abstract: No abstract text available
    Text: FQL± PCI 9036 T E April 1995 Version 1 3 FOR NEW DESIGNS USE PCI 9060ES PCI Bus Master Interface Chip for Intel 82596CA LAN Controller Features_ General Description_ • PCI Bus Master Interface for Intel 82596CA Ethernet


    OCR Scan     		PDF 9060ES 82596CA 82596CA 9020BV, 9060ES

    82596

    Abstract: 82557
    Text: intei A P ' 3 6 8 APPLICATION NOTE 82557 10/100 Mbps PCI LAN Controller A Guide to 82596 Compatibility November 1995 Order Number: 644126-001 305 AP-368 1.0 INTRODUCTION Over the last few years, the networking environment has evolved to account for the needs of high-bandwidth. Fast Ethernet,* otherwise known as IEEE


    OCR Scan     		PDF AP-368 82557ch 82596 82557

    dec 21140

    Abstract: intel 82557 intel 21140 AP-373 digital 21140 intel EPROM parallel scrambler PCI 21140
    Text: in t e i* AP-373 APPLICATION NOTE Replacing the DEC 21140 with the Intel 82557 Controller for LAN Designs November 1996 Order Number: 645006-002 339 AP-373 1.0. INTRODUCTION This application note provides information on the differences between the DEC 21140 and the Intel 82557


    OCR Scan     		PDF AP-373 AP-373 10Mbps 10Mbps dec 21140 intel 82557 intel 21140 digital 21140 intel EPROM parallel scrambler PCI 21140

    Untitled

    Abstract: No abstract text available
    Text: Æ L T E C H N O L D PCI 9060 B Y PCI Bus Master Interface Chip for Adapters and Embedded Systems December, 1995 VERSION 1.2 Features General Description_ • PCI Bus Master Interface supporting adapters and embedded systems • Two independent DMA channels for local


    OCR Scan     		PDF PCI9060