SM76
Abstract: Pletronics LV78 SM11 PE33 pletronics LV11
Text: PRODUCT CHANGE NOTIFICATION Title Keywords Article: Covers removed on Pletronics FR4 based oscillators Product Change Notification, SM76, SM11, LV76, LV78, LV11, PE76, PE78, PE11, PE33, PE37, Covers, FR4 Products Affected: Pletronics SM76, SM11, LV76, LV78, LV11,
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FR4 substrate
Abstract: AP602 IMD3 equivalent
Text: Application Note Converting AP60x Ultralam Designs to FR4 This applications note outlines a method to convert our AP60x Ultralam designs to FR4. Currently all WJ AP60x reference designs use Ultralam as the substrate of choice as it provides the highest performance
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AP60x
1800MHz
AP602
1-800-WJ1-4401
FR4 substrate
IMD3 equivalent
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DTS1006
Abstract: No abstract text available
Text: D A T A S H E E T CERLED SMD Chip Detector SMD – Receiver PFD 10 Photo Pin Diode –H* *RohS-conform Description Real surface mount component with a FR4 chip base. The silicon Photo PIN Diode provides the positive side on the front and the negative side on the FR4 contact base.
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DTS1006
DTS1006
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Untitled
Abstract: No abstract text available
Text: PRODUCT DATASHEET PART NUMBER: CX2232NL • • • • • 1:1 RF Transformer 800-1900 MHz Suitable for MoCA Applications Surface Mount, FR4 Substrate RoHS Compliant Electrical Specifications @ 25°C Operating Temperature -40°C to +85°C INSERTION LOSS :
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CX2232NL
60308-A
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8751
Abstract: No abstract text available
Text: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 439 One-side prototyping boards for fast experiments with processors and logic circuits. Suitable for surface mounted circuits type QFP, SOP, SSOP and SDIP. Material : Epoxy FR4 , 1.5 mm Size : 160 x 100 mm
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8751
Abstract: SOL package smd diode nr smd electronic SMD Packages sol 20 Package Smd components
Text: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 461 SMD test board for soldering tests with SMD Components in different packages, e.g. 0603 up to 2220, SOT, SOL, PLCC, … Material : Epoxy FR4 , 1.5 mm Size : 140 x 100 mm Trace : Refer to picture Hole spacing :
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E28F008SA
Abstract: EDI7F341MC
Text: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F341MC
1Mx32
EDI7F341MC
EDI7F2341MC
E28F008SA
EDI7F341MC-BNC:
150ns
A0-A19
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1mx8
Abstract: E28F008SA EDI7F341MC
Text: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F341MC
1Mx32
EDI7F341MC
EDI7F2341MC
E28F008SA
EDI7F341MC-BNC:
150ns
A0-A19
1mx8
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5100 B3 transmitter
Abstract: NKG3184A VCTCXO Oscillators Crystals KSS 213 12Mhz crystal oscillator nkg3 TCXO KSS ACP550 kss japan tcxo LMX9820
Text: June 2004 Revision 0.6 Preliminary - Confidential LMX9820A Bluetooth Serial Port Module 1.0 General Description The National Semiconductor LMX9820A Bluetooth™ Serial Port module is a highly integrated radio, baseband controller and memory device implemented on an FR4
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LMX9820A
LMX9820A
5100 B3 transmitter
NKG3184A
VCTCXO Oscillators Crystals
KSS 213
12Mhz crystal oscillator
nkg3
TCXO KSS
ACP550
kss japan tcxo
LMX9820
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PRBS7
Abstract: AN1473 DS40MB200 DS42BR400 DS42MB100 AN1541 an-1541 national
Text: National Semiconductor Application Note 1541 Leo Chang December 2006 TABLE 1. XAUI Jitter Budget Allowances. 1.0 Introduction This paper demonstrates how National Semiconductor’s DS42MB100, DS40MB200, and DS42BR400 equalize XAUI backplane FR4 traces and reduce data dependent jitter to
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DS42MB100,
DS40MB200,
DS42BR400
AN-1541
PRBS7
AN1473
DS40MB200
DS42MB100
AN1541
an-1541 national
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1.5528
Abstract: EDI7F33512C AM29F040 2192
Text: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F33512C
512Kx32
EDI7F33512,
EDI7F233512
EDI7F433512
2x512Kx32
4x512Kx32
AM29F040
512Kx8
1.5528
EDI7F33512C
2192
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AM29LV004T
Abstract: EDI7F33512V
Text: EDI7F33512V 512Kx32 FLASH DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29LV004T - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F33512V
512Kx32
EDI7F33512,
EDI7F233512
EDI7F433512
2x512Kx32
4x512Kx32
AM29LV004T
512Kx8
EDI7F33512V
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transistor a226
Abstract: A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-BOARD ATR2406-DEV-KIT 1p5 sot 23
Text: Features • Close to production PCB-Layout • Small Footprint FR4 2-Layer Module • Integrated Antenna & SMA-Antenna Connector • Printed Transmit/Receive Filters • Few Low Cost External Components • High Receiver Sensitivity of up to –91 dBm at Antenna-Port
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STK500
ATR2406-DEV-BOARD
ATR2406-DEV-BOARD
7-Sep-04
transistor a226
A226 transistor
PHILIPS capacitors 0402
GJM1555C1H5R6CB01
0402 footprint
balun sma
GRM1555C1H4R7CB01
ATR2406-DEV-KIT
1p5 sot 23
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1mx8
Abstract: AM29LV008T EDI7F2331MV EDI7F331MV
Text: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MV
1Mx32
EDI7F331MV
EDI7F2331MV
AM29LV008T
EDI7F331MV-BNC:
150ns
A0-A19
1mx8
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MARK J3
Abstract: AM29F016 EDI7F332MC amd AM29F016
Text: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F332MC
2Mx32
EDI7F332MC
EDI7F2332MC
AM29F016
EDI7F332MC-BNC:
150ns
A0-A20
MARK J3
amd AM29F016
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EDI7F331MV
Abstract: AM29LV008T EDI7F2331MV
Text: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MV
1Mx32
EDI7F331MV
EDI7F2331MV
AM29LV008T
EDI7F331MV-BNC:
150ns
A0-A19
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28F016S3
Abstract: EDI7F342MV
Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F342MV
2Mx32
EDI7F342MV
7F2342MV
28F016S3-
EDI7F342MV-BNC:
150ns
A0-A20
28F016S3
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1.5528
Abstract: 1mx8 MARK J3 AM29F080 EDI7F331MC
Text: EDI7F331MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MC and EDI7F2331MC are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MC
1Mx32
EDI7F331MC
EDI7F2331MC
AM29F080
EDI7F331MC-BNC:
150ns
A0-A19
1.5528
1mx8
MARK J3
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AM29LV017B
Abstract: EDI7F332MV 15607
Text: EDI7F332MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MV and EDI7F2332MV are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F332MV
2Mx32
EDI7F332MV
EDI7F2332MV
AM29LV017B-
EDI7F332MV-BNC:
120ns
A0-A20
AM29LV017B
15607
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28F016S3
Abstract: EDI7F342MV
Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F342MV
2Mx32
EDI7F342MV
7F2342MV
28F016S3-
EDI7F342MV-BNC:
150ns
A0-A20
28F016S3
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Untitled
Abstract: No abstract text available
Text: ZXLD1320EV3 USER GUIDE DESCRIPTION The ZXLD1320EV3, Figure 1, is a PCB constructed using an FR4 base for evaluating the ZXLD1320 LED driver, which is connected to an external switch for high current LED applications. The evaluation board can be used to drive an external
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ZXLD1320EV3
ZXLD1320EV3,
ZXLD1320
D-81541
A1103-04,
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1mx8
Abstract: AM29F080 EDI7F4331MC
Text: EDI7F4331MC 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MC is organized as four banks of 1Mx32. The module is based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MC-BNC:4x1Mx32 80 PIN SIMM
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EDI7F4331MC
4x1Mx32
EDI7F4331MC
1Mx32.
AM29F080
EDI7F4331MC-BNC
150ns
A0-A19
4x1Mx32
1mx8
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Untitled
Abstract: No abstract text available
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural
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LMX9820
Abstract: lmx9820asm block diagram bluetooth headset history of bluetooth bluetooth report 001C LMX9820A LMX9820SB TCXO 4322 190 LMX9820ADEV
Text: National Semiconductor Software Users Guide October 2006 Revision 1.6.4 Introduction The National Semiconductor LMX9820A Bluetooth Serial Port Module is a highly integrated radio, baseband, and memory implemented on a FR4 substrate. All hardware and firmware is included to provide a complete solution from antenna
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LMX9820A
LMX9820
lmx9820asm
block diagram bluetooth headset
history of bluetooth
bluetooth report
001C
LMX9820SB
TCXO 4322 190
LMX9820ADEV
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