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Infineon Technologies AG FF1700XTR17IE5DBPSA1 PP IHM I
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DigiKey	FF1700XTR17IE5DBPSA1	Tray	2		1	1 $899.12 10 $899.12 100 $899.12 1000 $899.12 10000 $899.12	Buy Now
Avnet Americas	FF1700XTR17IE5DBPSA1	Tray	2	13 Weeks	2	1 - 10 $999.827 100 $999.827 1000 $999.827 10000 $999.827	Buy Now
Mouser Electronics	FF1700XTR17IE5DBPSA1		24			1 $899.12 10 $899.12 100 $899.12 1000 $899.12 10000 $899.12	Buy Now
Newark	FF1700XTR17IE5DBPSA1	Bulk	2		1	1 $935.08 10 $935.08 100 $935.08 1000 $935.08 10000 $935.08	Buy Now
EBV Elektronik	FF1700XTR17IE5DBPSA1		2	14 Weeks	2	1 - 10 - 100 - 1000 - 10000 -	Buy Now

New Advantage Corporation	FF1700XTR17IE5DBPSA1		2		1	1 $1397.52 10 $1293.23 100 $1293.23 1000 $1293.23 10000 $1293.23	Buy Now
AMD XC2VP70-7FF1704C IC FPGA 996 I/O 1704FCBGA
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DigiKey	XC2VP70-7FF1704C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP70-5FF1704C IC FPGA 996 I/O 1704FCBGA
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DigiKey	XC2VP70-5FF1704C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP70-6FF1704I IC FPGA 996 I/O 1704FCBGA
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DigiKey	XC2VP70-6FF1704I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2VP70-6FF1704C IC FPGA 996 I/O 1704FCBGA
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DigiKey	XC2VP70-6FF1704C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now

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FF170 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
FF1704 Abstract: No abstract text available Text: R FF1704: Plastic Flip-Chip BGA Package PK066 v1.0 October 30, 2002 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.	Original	FF1704: PK066 FF1704	PDF
BLVDS-25 Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000 Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)	Original	FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
Untitled Abstract: No abstract text available Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit FF1148) FF1517) FF1696) DS083-4	PDF
vf152 Abstract: vf170 NET125 VM MARKING CODE SOT23-5 DD157 VF140-1 VF154 NET127 NET128 DB105 Text: sig n TSM105 • CONSTANT VOLTAGE AND CONSTANT Part Number Package Temperature Range TSM105CLT TSM105CD Marking L ew ■ ■ ■ ■ ORDER CODE CURRENT CONTROL LOW VOLTAGE OPERATION PRECISION INTERNAL VOLTAGE REFERENCE LOW EXTERNAL COMPONENT COUNT CURRENT SINK OUTPUT STAGE	Original	TSM105 TSM105CLT TSM105CD TSM105 vf152 vf170 NET125 VM MARKING CODE SOT23-5 DD157 VF140-1 VF154 NET127 NET128 DB105	PDF
Untitled Abstract: No abstract text available Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.3 November 20, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit DS083-4	PDF
QF32 Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176 Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)	Original	TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176	PDF
AB38R Abstract: tag l9 225 400 XC2VP20 XC2VP50 Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on	Original	DS083-1 18-bit and255-7778 DS083-4 AB38R tag l9 225 400 XC2VP20 XC2VP50	PDF
xc2vp1257 Abstract: 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50 Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.2 September 27, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four Rocket I/O™ embedded	Original	DS083-1 18-bit XC2VP30, FF1152 DS083-4 xc2vp1257 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50	PDF
vhdl code for uart communication Abstract: XC2VP50 Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit FG676 XC2VP20, XC2VP30, XC2VP40. FF1517 vhdl code for uart communication XC2VP50	PDF
vhdl code for uart communication Abstract: XC2VP50 XC2VP70 FF1704 pinout Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit DS083-4 vhdl code for uart communication XC2VP50 XC2VP70 FF1704 pinout	PDF
ra1613 Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations	Original	210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27	PDF
Untitled Abstract: No abstract text available Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on	Original	DS083-1 18-bit	PDF
fox 515 abb Abstract: AM29BX8 tqm860 FE1600 GPR circuit schematic diagram full MPC5200 schematic TQM860L ALL TYPE IC DATA AND manual substitution BOOK FE8700 LXT971ALE Text: Lite5200B User’s Manual Devices Supported: MPC5200B LITE5200BUM Rev. 0 10/2005 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road	Original	Lite5200B MPC5200B LITE5200BUM CH370 603-specific) fox 515 abb AM29BX8 tqm860 FE1600 GPR circuit schematic diagram full MPC5200 schematic TQM860L ALL TYPE IC DATA AND manual substitution BOOK FE8700 LXT971ALE	PDF

Virtex-6 reflow Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320 Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the	Original	UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
cmos 556 timer Abstract: powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG Text: ` 8 Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v3.1.1 March 9, 2004 Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty RocketIO™ embedded multi-gigabit	Original	DS083-1 18-bit cmos 556 timer powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG	PDF
XC2VP40 Abstract: ultra fine pitch BGA XC2VP2-FG256 XC2VP100 XC2VP70 FF1704 pinout AF103 diode t25 4 L9 AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 FF672 XC2VP50 Text: 299 Virtex-II Pro Platform FPGAs: Pinout Information R DS083-4 v3.1.1 March 9, 2004 This document providnes Virtex-II Pro Device/Package Combinations and Maximum I/Os and Virtex-II Pro Pin Definitions, followed by pinout tables, for these packages: •	Original	DS083-4 FG256 FG456 FG676 FF672 FF896 FF1152 FF1148 FF1517 FF1704 XC2VP40 ultra fine pitch BGA XC2VP2-FG256 XC2VP100 XC2VP70 FF1704 pinout AF103 diode t25 4 L9 AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 XC2VP50	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
vhdl code for watchdog timer of ATM Abstract: Virtex-II 16 bit array multiplier VERILOG virtex 2 pro digital clock vhdl code powerpc 405 IEEE1532 PPC405 XAPP653 vhdl code for matrix multiplication Text: Virtex-II Pro X Platform FPGAs: Introduction and Overview R DS110-1 v1.1 March 5, 2004 Advance Product Specification Summary of Virtex-II Pro X Features • • High-Performance Platform FPGA Solution Including - Up to twenty RocketIO™ X embedded multi-gigabit	Original	DS110-1 18-bit vhdl code for watchdog timer of ATM Virtex-II 16 bit array multiplier VERILOG virtex 2 pro digital clock vhdl code powerpc 405 IEEE1532 PPC405 XAPP653 vhdl code for matrix multiplication	PDF
NE 565 texas instruments Abstract: at17 dcm hf nw IBM Processor Local Bus (PLB) 64-Bit Architecture gearbox 405 xilinx tri mode ethernet TRANSMITTER signal 32 bit ALU vhdl code AM3 Processor Functional Data Sheet OPB* 953 XC2VPX70 RF receiver U35 Text: Virtex-II Pro X Platform FPGAs: Complete Data Sheet R DS110 v1.1 March 5, 2004 Advance Product Specification This document includes all four modules of the Virtex-II Pro X Platform FPGA data sheet. Module 1: Introduction and Overview DS110-1 (v1.1) March 5, 2004	Original	DS110 DS110-1 DS110-2 DS110-4 NE 565 texas instruments at17 dcm hf nw IBM Processor Local Bus (PLB) 64-Bit Architecture gearbox 405 xilinx tri mode ethernet TRANSMITTER signal 32 bit ALU vhdl code AM3 Processor Functional Data Sheet OPB* 953 XC2VPX70 RF receiver U35	PDF
bt 1696 Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are	Original		PDF
apple ipad schematic drawing Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller Text: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG012 apple ipad schematic drawing xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller	PDF
XCV100 TQ144 Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116 Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116	PDF

FF170 Search Results

FF170 Price and Stock

Infineon Technologies AG FF1700XTR17IE5DBPSA1

AMD XC2VP70-7FF1704C

AMD XC2VP70-5FF1704C

AMD XC2VP70-6FF1704I

AMD XC2VP70-6FF1704C

FF170 Datasheets Context Search

FF1704

BLVDS-25

qfn 3x3 tray dimension

Untitled

vf152

Untitled

QF32

AB38R

xc2vp1257

vhdl code for uart communication

vhdl code for uart communication

ra1613

Untitled

fox 515 abb

Virtex-6 reflow

xilinx topside marking

cmos 556 timer

XC2VP40

xilinx part marking

vhdl code for watchdog timer of ATM

NE 565 texas instruments

bt 1696

apple ipad schematic drawing

XCV100 TQ144