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    DPAC TECHNOLOGIES Search Results

    DPAC TECHNOLOGIES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-SATDRIVEX2-001 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-001 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 1m Datasheet
    CS-SATDRIVEX2-002 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-002 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 2m Datasheet
    CS-SATDRIVEX2-000.5 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-000.5 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 0.5m Datasheet
    CS-SASDDP8282-000.5 Amphenol Cables on Demand Amphenol CS-SASDDP8282-000.5 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 0.5m Datasheet
    CS-SASDDP8282-001 Amphenol Cables on Demand Amphenol CS-SASDDP8282-001 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 1m Datasheet

    DPAC TECHNOLOGIES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP007 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com


    Original     		PDF ACH2-AT-DP007

    DPAC Technologies

    Abstract: No abstract text available
    Text: DPAC TECHNOLOGIES DPAC TECHNOLOGIES ACH2-AT-DP010 http://www.dpactech.com DPAC TECHNOLOGIES http://www.dpactech.com


    Original     		PDF ACH2-AT-DP010 DPAC Technologies

    Untitled

    Abstract: No abstract text available
    Text: ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com ACH2-AT-DP004 DWG. # ACH2-AT-DP004 DPAC TECHNOLOGIES http://www.dpactech.com


    Original     		PDF ACH2-AT-DP004

    encryption key wireless

    Abstract: No abstract text available
    Text: Wireless Networking Basics Copyright 2005 DPAC Technologies Corporation ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of DPAC Technologies®


    Original     		PDF

    DP006

    Abstract: No abstract text available
    Text: ACH2-AT-DP006 DWG. # ACH2-AT-DP006 DPAC TECHNOLOGIES http://www.dpactech.com


    Original     		PDF ACH2-AT-DP006 DP006

    Untitled

    Abstract: No abstract text available
    Text: ACH2-AT-DP003 DWG.# ACH2-AT-DP003 DPAC TECHNOLOGIES CORP. http://www.dpactech.com


    Original     		PDF ACH2-AT-DP003

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00

    FAH 32

    Abstract: No abstract text available
    Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of


    Original     		PDF DP5Z1MW32PV3 DP5Z1MW32PV3 MX29F1610AHC) MX29F1610HC) 30A180-11 FAH 32

    Untitled

    Abstract: No abstract text available
    Text: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides


    Original     		PDF 921kbps RS-232/422/485)

    Untitled

    Abstract: No abstract text available
    Text: Features and Benefits Quatech Wireless Device Servers When you need the ultimate in wireless device server performance, ease of use and flexibility, specify Quatech. Now with WPA support! sensitivity, the embedded DPAC Technologies 802.11b radio provides


    Original     		PDF 921kbps RS-232/422/485)

    ipc 502

    Abstract: DPSD64ME8WKY5
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit Synchronous SDRAM DPSD64ME8WKY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 512 Megabit SDRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 256Mb


    Original     		PDF DPSD64ME8WKY5 256Mb 256Mb IPC-A-610, 30A226-11 ipc 502 DPSD64ME8WKY5

    DPDD64MX8WSAY5

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit CMOS DDR SDRAM DPDD64MX8WSAY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 512 Mb, CMOS DDR Synchronous DRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 256Mb


    Original     		PDF DPDD64MX8WSAY5 256Mb 256Mb IPC-A-610, 30A253-00 DPDD64MX8WSAY5

    UDM-1

    Abstract: DPDD16MX32WCD5
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit CMOS DDR SDRAM DPDD16MX32WCD5 DQ17 68 DQ18 69 DQ19 70 DQ20 71 DQ21 72 DQ22 73 LDM1 74 The following features are not affected by LP-Stack and are provided as reference only. Refer to memory OEM device specification for details.


    Original     		PDF DPDD16MX32WCD5 A10/AP DQ0-DQ15 30A256-00 UDM-1 DPDD16MX32WCD5

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit Synchronous DRAM DPSD128ME8XKY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 1 Gigabit SDRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 512Mb


    Original     		PDF DPSD128ME8XKY5 512Mb 512Mb 30A226-21

    circuit diagram of wifi wireless router

    Abstract: WLNB-ET-DP101 WLNB-ET-DP501 WLNB-AN-DP101 airborn DP100 smps repair wi-fi transmitter computer Wi-Fi transmitter circuit WLNB-SE-DP101
    Text: AirborneTM Wireless LAN Node Module Data Book For use with: WLNB-AN-DP100 Series WLNB-AN-DP500 Enterprise Series WLNB-SE-DP100 Series WLNB-ET-DP100 Series WLNB-ET-DP500 Enterprise Series WLNB-SE-DP500 Enterprise Series 39L3702-01 Rev. E 1/25/2006 www.dpactech.com


    Original     		PDF WLNB-AN-DP100 WLNB-AN-DP500 WLNB-SE-DP100 WLNB-ET-DP100 WLNB-ET-DP500 WLNB-SE-DP500 39L3702-01 circuit diagram of wifi wireless router WLNB-ET-DP101 WLNB-ET-DP501 WLNB-AN-DP101 airborn DP100 smps repair wi-fi transmitter computer Wi-Fi transmitter circuit WLNB-SE-DP101

    DP3ED16ME8RKY5

    Abstract: EDO DRAM CMOS-33V
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS3.3V EDO DRAM DP3ED16ME8RKY5 DESCRIPTION: The LP-Stack series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The module is constructed with two 8 Meg x 8 EDO, 3.3


    Original     		PDF DP3ED16ME8RKY5 A0-A11 30A228-11 DP3ED16ME8RKY5 EDO DRAM CMOS-33V

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RY5 / DP3ED32MX4R8Y5 PIN NAMES AD-A12* Row Address: A0-A12 Column Address: A0-A10 Refresh Address: A0-A12 DQ0-DQ3 Data In/Data Out CAS0-CAS1 Column Address Strobes RAS0-RAS1 Row Address Enables


    Original     		PDF DP3ED32MX4RY5 DP3ED32MX4R8Y5 30A221-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit Synchronous DRAM DPSD128MX4WY5 DESCRIPTION: The LP-Stack series is a family of interchangeable memory modules. The 512 Megabit SDRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are constructed with 64 Meg x 4 SDRAMs.


    Original     		PDF DPSD128MX4WY5 PC100 PC133 53A001-00 30A215-00

    cmos dram 8m x 16

    Abstract: DPDD64MX8WSBY5
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit CMOS DDR SDRAM DPDD64MX8WSBY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 512 Mb, CMOS DDR Synchronous DRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 256Mb


    Original     		PDF DPDD64MX8WSBY5 256Mb 256Mb IPC-A-610, 30A249-00 cmos dram 8m x 16 DPDD64MX8WSBY5

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit CMOS DDR SDRAM DPDD256MX4XSAY5 DESCRIPTION: 1 The Memory Stack series is a family of interchangeable memory devices. The 1 Gb, CMOS DDR Synchronous DRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 512Mb 128M x 4


    Original     		PDF DPDD256MX4XSAY5 512Mb 30A252-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 256 Megabit Synchronous DRAM DPSD64MX4TY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 256 Megabit SDRAM assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two 128Mb 32M x 4


    Original     		PDF DPSD64MX4TY5 128Mb 256Mb 128Mb 43A001-00. 30A214-00

    LP SDRAM

    Abstract: LP SDRAM solution 30A223-10
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD16MX8RSBY5 DESCRIPTION: FEATURES: • Electrical characteristics meet semiconductor manufacturers’ datasheet • Memory organization: 2 64Mb memory devices. Each device arranged as 8M x 8 bits (2M x 8 bits x 4 banks)


    Original     		PDF DPDD16MX8RSBY5 IPC-A-610, 66-Pin 30A223-10 LP SDRAM LP SDRAM solution 30A223-10

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 512 Megabit CMOS DDR SDRAM DPDD32MX16WSCY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory devices. The 512 Mb, CMOS DDR Synchronous DRAM, assembly utilizes the space saving LP-Stack™ technology to increase memory density. This stack is constructed with two


    Original     		PDF DPDD32MX16WSCY5 256Mb A10/AP DQ0-DQ15 30A246-00