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    DPDD32MX4RSAY5 Search Results

    DPDD32MX4RSAY5 Datasheets (9)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DPDD32MX4RSAY5-DP-0815 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-0820 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-0825 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-1015 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-1020 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-1025 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-7515 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-7520 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD32MX4RSAY5-DP-7525 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: The LP-Stack is DPAC core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the Memory Stack™ family which applies the DPAC technology to create a 128Mb Double Data Rate DDR SDRAM


    Original     		PDF DPDD32MX4RSAY5 DPDD32MX4RSAY5 128Mb 53A001-00 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 DESCRIPTION: FEATURES: • Electrical characteristics meet semiconductor manufacturers’ datasheet • Memory organization: 2 64Mb memory devices. Each device arranged as 16M x 4 bits (4M x 4 bits x 4 banks)


    Original     		PDF DPDD32MX4RSAY5 IPC-A-610, 66-Pin 30A222-00

    Untitled

    Abstract: No abstract text available
    Text: M t n t» DENSE-PAC MICROSYSTEMS "7\ /H-Dênsus a ^ 128 Aa dpdd32mx4riay5 Megabit CM OS DDR SDRAM High Density Memory Device d pd d 32 m X 4 R S A Y 5 ADVANCED INFORMATION DESCRIPTION: Jhe/k-'D eH JH j series is a family of interchangeable memory devices.


    OCR Scan     		PDF dpdd32mx4riay5 DPDD32M DPDD32MX4RSAY5, 64Mbit 30A222-00