TI date code
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG
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DM941230AG
DM941226AA
DS2502
DM941226AA
DM941230AG
TI date code
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DALLAS DS80C320
Abstract: 25863
Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DS1232
DK933191AAJ
HRS87C520
DS87C520
DE013425AAD
J-STD-020
30C/60%
DALLAS DS80C320
25863
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA
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DM941226AA
DM941230AG
DS2502
DM941230AG
DM941226AA
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DS-1000
Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH927108AJC
J-STD-020
30C/60%
DS-1000
DS1302 DIE REVISION
DH020
25409
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dallas date code ds1230
Abstract: dallas ds1230 25919 DS1230
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:
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DS1621
DE940040AAC
DS5002
DS87C520
DM925587AAF
DK935356AAB
DK933191AAJ
DE952427AAD
DE014522ADB
dallas date code ds1230
dallas ds1230
25919
DS1230
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dallas date code ds1230
Abstract: dallas date code dallas ds1230 code 25807
Text: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K
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DS5002
DS87C520
DM925587AAF
DN901118AAB
DK935356AAB
J-STD-020
DM929359AB
DS1232
DS1233
dallas date code ds1230
dallas date code
dallas ds1230
code 25807
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25821
Abstract: dallas date code ds12887 25854
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC
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DS1621
DS1869
DE940040AAC
DH833210AAB
DS2181A
DS5002
DE004552ABD
DN012259AAL
DN028766AAD
25821
dallas date code ds12887
25854
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997E-07
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY
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DK031452AB
DS21352
DM941230AG
DN041061AAE
DK007198AAF
DK016058AA
DK016058AA
DS2108
997E-07
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25804
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1
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DS1000Z-25
DS1000
DE009456ACE
150x1
DS87C520
DE029195AAB
650x65
25804
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